Abstract: A method for producing a semiconductor device includes forming, on a substrate, a film to be processed. The method further includes forming, on the film to be processed, a first film containing a metallic element and a second film containing at least one of carbon or boron. The method further includes forming an insulating film on the first and second films. The method further includes processing the film to be processed using the first film, the second film, and the insulating film, as a mask.

Abstract: A workpiece preset jig arrangement for a welding apparatus. The welding apparatus has an apparatus body, a welding jig mechanism on the body and clamps on the welding jig mechanism for clamping plural component parts for constituting a workpiece so that the workpiece may be welded to another workpiece by the welding jig mechanism. The preset arrangement includes a preset arrangement body positioned adjacent the welding apparatus body, a preset jig mechanism provided on the arrangement body, and preset clamps mounted on the preset jig mechanism for clamping the plural component parts. The preset jig mechanism is moveable between a set position facing the welding jig mechanism and a preset position away from the set position and the welding jig mechanism. The set position is such that the plural component parts may be transferred from the preset jig mechanism to the welding jig mechanism simply by releasing the clamps on the preset jig mechanism and engaging the clamps on the welding jig mechanism.

Abstract: A multi-spot welding arrangement in which a jig table on the front surface of a machine frame has a plurality of welding guns located along the shape or contour of the workpiece to be processed or worked. An electric supply has a plurality of units which are connected to the welding guns through respective electric supply cables. A pressure applying mechanism has a plurality of operation cylinders which are connected to the welding guns through respective flexible wires, and is located on the rear side and the upper side of the machine frame. The machine frame, moreover, has a front frame and a rear frame which are coupled together in a detachable manner. The jig table and the pressure applying mechanism are located on the front frame, and the electric supply is provided on the rear frame.