Abstract: Semiconductor light emitting elements are configured to be mounted on the substrate, a frame is configured to be vertically provided on the substrate in an annular or oval-annular shape so as to surround the semiconductor light emitting elements, and a sealing portion is configured to seal an inner wall of the frame, an upper surface of the substrate inside the frame, and the semiconductor light emitting elements. The sealing portion includes a first resin portion configured to have a concave surface having at least one rotational plane having a central axis of the frame as a rotational axis, and a second resin portion configured to cover the concave surface of the first resin portion and having a convex external surface, and the sealing portion has an external surface in which an external surface of the first resin portion and an external surface of the second resin portion are integrated.

Abstract: According to one embodiment, a light-emitting module includes N light-emitting elements, which are a first group of light-emitting elements, on the front surface of a substrate. The N light-emitting elements are disposed in a row in a longitudinal direction from one end portion to the other end portion of the substrate. The N light-emitting elements are connected in series. The light-emitting module includes a metal member provided in the longitudinal direction of the substrate in a position not overlapping a conductive line on the rear surface of the substrate. The conductive line is connected to, via a through-hole, a conductive line configured to connect the N light-emitting elements.

Abstract: According to one embodiment, the light-emitting apparatus is provided with a substrate, a plurality of light-emitting devices, and a phosphor layer. The plurality of light-emitting devices are mounted on the substrate. The phosphor layer is formed of a translucent resin containing a phosphor and includes a phosphor portion that is formed in a convex shape and covers a predetermined number of the light-emitting device. Bases of the adjacent phosphor portions are formed by being linked with one another.

Abstract: A lamp according to an embodiment includes a plurality of light-emitting sections including a plurality of kinds of light-emitting elements provided side by side in a predetermined direction on a substrate and configured to respectively emit lights of different colors, luminous fluxes of the lights respectively emitted by the light-emitting elements being separately controllable. The lamp according to the embodiment includes a pipe configured to diffuse the lights emitted by the light-emitting elements and formed including a translucent material, linear transmittance of which is any value of 0% to 50%. A distance “d” from a lower part of the pipe to the light-emitting elements is larger than the inner radius of the pipe.

Abstract: According to one embodiment, a light emitting device which is attached to an illumination apparatus and radiates light having a correlated color temperature of 2900 to 3600K is provided. The light emitting device includes a substrate, blue light emitting LED elements and red light emitting LED elements mounted on the substrate, and a wavelength converting unit. The red light emitting LED elements have a luminous intensity of 0.2 to 2.5 times as large as that of the blue light emitting LED elements at normal use temperature in a state where the light emitting device is attached to the illumination apparatus. The wavelength converting unit is excited by light emitted from the blue light emitting LED elements and converts the light to light having a peak wavelength within a range of 500 to 600 nm.

Abstract: According to one embodiment, a light-emitting device includes a substrate, a plurality of pads and a plurality of light-emitting elements. The pads has electric conductance, and are arranged on the substrate. A reflecting layer which is formed by electroplating is provided on a surface of each of the pads. The light-emitting elements are mounted on the pads. A depressed part is left on the substrate. The depressed part is formed on the substrate by removing a pattern on the substrate, by which the pads are electrically connected.

Abstract: To improve an angular color difference and emit uniform illumination light. According to an embodiment, a light-emitting device in an embodiment includes a light-emitting module (15). The light-emitting module (15) includes a substrate (21), a plurality of light-emitting elements (45) made of semiconductor, and a plurality of sealing members (54). The light-emitting elements (45) are disposed on the substrate (21). The sealing members (54) contain, as a main component, translucent resin mixed with a phosphor. The sealing members (54) are heaped up from the bottom surfaces thereof bonded on the substrate (21) and are each formed to bury a singularity or a plurality of the light-emitting elements (45). A ratio (H/D) of a diameter D of the bottom surfaces to height H of the heaps of the sealing members (54) is set to 0.22 to 1.0.

Abstract: A light-emitting device includes a substrate, and a plurality of light-emitting elements mounted on the substrate. The light-emitting elements are placed to meet conditions that the number B of light-emitting elements per unit area (cm2) of a mounting part is not less than 0.4 and a mean mounting density D is not less than 58 to not greater than 334, when a relationship of formula “D=A×B” is established, assuming D as a mean mounting density of light-emitting elements on a substrate, A as a current (mA) flowing through one light-emitting element, and B as the number of light-emitting elements per unit area (cm2) of a substantial mounting part for light-emitting elements.

Abstract: Light-emitting modules according to the embodiments is configured by mounting a plurality of semiconductor light-emitting elements having the same light-emitting property in a closed-up manner on a substrate and sealing the closed up plurality of semiconductor light-emitting elements by a dome shaped sealing member altogether.

Abstract: A light emitting module is a light emitting module including a substrate, a first area in which LED chips are mainly arranged and mounted in a longitudinal direction of the substrate in an area on one side of the longitudinal direction, a second area in which non-light emitting components are mainly mounted in an area on another side of the longitudinal direction of the substrate and a notch portion which is between the first area and the second area and formed on the substrate. The non-light emitting components are mountable across the notch portion between the first area and the second area. Further, the substrate is separable into the first area and the second area by the notch portion. Furthermore, the first area after separation is formed to be connectable consecutively with another light emitting module in the longitudinal direction.

Abstract: A device of an embodiment includes a plurality of substrates connected end to end along a predetermined direction. Then, the device of the embodiment includes a plurality of light-emitting elements mounted on each of the substrates and aligned in the predetermined direction, a mounting interval of the light-emitting elements on one of the substrates is different from a mounting interval of the light-emitting elements on another of the substrates.

Abstract: A light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm3/(m2·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.

Abstract: According to one embodiment, a light-emitting device comprises a substrate on which a plurality of light-emitting elements are arranged and mounted in two lines; and sealing members of two lines each sealing the plurality of light-emitting elements of each line. A distance between the lines of the sealing members is equal to 0.5 times or more but 2 times or less a width of the sealing member of each line.

Abstract: According to one embodiment, a light-emitting device comprises a substrate on a surface of which a light-emitting element is mounted, a light reflection layer formed on a second area of the surface of the substrate other than a first area on which the light-emitting element is mounted, and a sealing member sealing the light-emitting element. An engagement protrusion part protruding toward the sealing member is provided at an edge part of the light reflection layer at which the light reflection layer is in contact with the area on which the light-emitting element is mounted. The engagement protrusion part juts out into the sealing member to prevent exfoliation of the sealing member.

Abstract: A light-emitting circuit is formed as a straight tube in a stable shape and capable of appropriately housing and holding an LED module and the like. The light-emitting circuit includes: a plurality of light-emitting elements configured to emit light; a substrate, functioning as an arrangement member, including an arrangement surface on which the plurality of light-emitting elements are arranged; and a substantially cylindrical lamp body including a translucent section at least in a part thereof, including the arrangement member disposed on the inside, and including a louver functioning as a projecting body projecting from an inner wall opposed to the arrangement surface and extending toward the arrangement surface.

Abstract: According to one embodiment, a luminaire includes plural semiconductor light sources mounted on a board, sealing bodies provided on the respective semiconductor light sources, and a light color adjusting part to adjust light color emitted from the plural sealing bodies. The sealing bodies contain a phosphor excited by a primary light emitted from the semiconductor light sources. The light color adjusting part contains the phosphor and is provided between arbitrary adjacent sealing bodies, or is provided by causing a shape or a characteristic of an arbitrary sealing body among the plural sealing bodies to be different from another sealing body.

Abstract: According to one embodiment, a light-emitting module includes a substrate, a light-emitting element and a sealing member. The light-emitting element is mounted on the substrate. The sealing member is formed of a material consisting principally of a translucent resin containing phosphor particles. The sealing member includes a main portion covering the light-emitting element and an outer peripheral portion coming into contact with the substrate. A content percentage of the phosphor particles with respect to the resin is smaller in the outer peripheral portion of the sealing member than that in the main portion.

Abstract: Light-emitting modules according to the embodiments is configured by mounting a plurality of semiconductor light-emitting elements having the same light-emitting property in a closed-up manner on a substrate and sealing the closed up plurality of semiconductor light-emitting elements by a dome shaped sealing member altogether.

Abstract: A lamp with ferrule 10 includes a substrate 12 in which a solid light-emitting device 11 is implemented on one surface side thereof; a thermal radiation member 14 which is fixed to the other surface side of the substrate 12 by a fluid fixing member 13 having thermal conductivity; a light-emitting portion 15 constituted by the substrate 12 and the thermal radiation member 14; a thermally conductive support member 17 which constitutes a three-dimensional light source body 16 using a plurality of light-emitting portions 15; a thermally conductive main body 18 which is provided with the support member 17 so as to project the three-dimensional light source body 16 to the one end portion side; and a ferrule member 19 that is provided on the other end portion side of the main body 18.

Abstract: According to one embodiment, a light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm3/(m2·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.