Patents by Inventor Soichiro INOUE

Soichiro INOUE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240079296
    Abstract: A semiconductor device includes a first conductive plate, a second conductive plate, first switching elements, second switching elements, a first supply terminal and a second supply terminal. The first and second conductive plates are spaced apart from each other in a first direction. The first switching elements are bonded to the first conductive plate, and are electrically connected to the second conductive plate. The second switching elements are bonded to the second conductive plate. The first supply terminal is bonded to the first conductive plate. The second supply terminal has a region that overlaps with the first supply terminal as viewed in a plan view. The second supply terminal is spaced apart from the first conductive plate and the first supply terminal in a thickness direction perpendicular to the first direction. The second supply terminal is electrically connected to the second switching elements.
    Type: Application
    Filed: April 26, 2023
    Publication date: March 7, 2024
    Inventors: Takumi KANDA, Masaaki MATSUO, Soichiro TAKAHASHI, Yoshitoki INAMI, Kaito INOUE
  • Publication number: 20230229819
    Abstract: Provided is an estimation device that estimates a response at a position of a floating structure where a sensor detecting a structural response is not installed. The estimation device acquires a strain response spectrum at an installation position at which a strain sensor is installed on a floating structure, the strain response spectrum being calculated based on the strain sensor, a wave spectrum, and strain response functions at the installation position and at a non-installation position of the strain sensor, calculates a correction amount based on a predetermined formula expressing a relationship among the strain response spectrum, the wave spectrum, and the strain response functions, and adds the correction amount to a theoretical value of the strain response spectrum calculated from the strain response function and the wave spectrum at the non-installation position of the strain sensor to calculate the strain response spectrum at the non-installation position.
    Type: Application
    Filed: October 7, 2021
    Publication date: July 20, 2023
    Inventors: Tadashi SUGIMURA, Shunsaku MATSUMOTO, Soichiro INOUE, Shin TERADA, Satoshi MIYAZAKI