Abstract: A wiring board includes: an insulating member having a first upper surface, and a second upper surface located higher than the first upper surface; and a first wiring layer located on the first upper surface. The first upper surface has a wiring region that does not overlap with the second upper surface in a top view, and that is located in an exposed region. The first wiring layer extends from the wiring region to a connecting region that is connected to the wiring region, that overlaps with the second upper surface in a top view, and that is not exposed. The first wiring layer comprises a first pad portion located in the wiring region, and a first pattern portion located in the connecting region.

Abstract: A base includes: a bottom part having a bottom face; and a lateral part surrounding the bottom face and extending upwards from the bottom face, the lateral part having an uppermost face and comprises a first stepped portion including a first upper face and a second stepped portion including a second upper face, the first upper face and the second upper face being disposed below the uppermost face, and a height of the first stepped portion from the bottom face being different from a height of the second stepped portion from the bottom face. In a top view: the first upper face and the second upper face are disposed inward of the uppermost face, the bottom face is directly adjacent to the first upper face, the bottom face is directly adjacent to the second upper face, and the first upper face is directly adjacent to the second upper face.

Abstract: A package includes: a bottom portion having a mounting surface on which a light emitting element is arranged; and a lateral wall portion having a top surface and including: a lateral wall having a rectangular outer shape in a top view and surrounding the mounting surface, and a stepped portion formed along the lateral wall below the top surface. In the top view, the stepped portion includes a wide portion and a narrow portion that are two regions having different widths. The wide portion has a region on which a protecting element to protect the light emitting element is arranged and the narrow portion does not have the region on which the protecting element is arranged.

Abstract: A light emitting device includes first and second semiconductor laser elements, first and second light-reflective members, and a basal part. The light emitted from the first semiconductor laser element irradiates a first light-reflective surface of the first light-reflective member at a first position. The light emitted from the second semiconductor laser element irradiates a second light-reflective surface of the second light-reflective member at a second position. A height of the first position is different from a height of the second position. With respect to a virtual axis extending along the prescribed direction, the first position and the second position have the same coordinates. A mounting position of the first light-reflective member and a mounting position of the second light-reflective member are different with respect to the prescribed direction.

Abstract: A light emitting device includes: a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part has an uppermost face and includes a first stepped portion including a first upper face and a second stepped portion including a second upper face, wherein the first upper face and the second upper face are disposed below the uppermost face, wherein the first upper face and the second upper face are disposed inward of the uppermost face in a top view, and wherein a height of the first stepped portion from the bottom face is lower than a height of the second stepped portion from the bottom face; a semiconductor laser element disposed on the bottom face; and a light reflective member and/or an optical member disposed on the bottom face.

Abstract: A light emitting device includes three or more light emitting elements, and a package that includes a base having a mounting face on which the three or more light emitting elements are disposed and a lateral wall part disposed around the light emitting elements and having a light transmitting incident face. The three or more light emitting elements include a first light emitting element that emits first light having an emission peak at a first wavelength along a first optical axis, a second light emitting element that emits second light having an emission peak at a second wavelength along a second optical axis, and a third light emitting element that emits third light having an emission peak at a third wavelength along a third optical axis. An angle formed by the first optical axis and the second optical axis in a top view is 3° to 45°.

Abstract: A package includes: a bottom portion having a mounting surface; and a lateral wall portion having a top surface and including: a lateral wall having a rectangular outer shape in a top view and surrounding the mounting surface, and a stepped portion formed along the lateral wall below the top surface. In the top view, the stepped portion includes a wide portion and a narrow portion that are two regions having different widths. The narrow portion is formed on a portion along a one side of an entire circumference of the lateral wall.

Abstract: A light emitting device includes: a package having a light extraction face that has a light transmitting region, and including a base that has a mounting face; a first light emitting element disposed on the mounting face in the package and having a first emission face configured to emit divergent light, the first emission face being perpendicular to the mounting face of the base and parallel to the light extraction face; and a second light emitting element disposed on the mounting face in the package and having a second emission face configured to emit divergent light, the second emission face being perpendicular to the mounting face of the base and parallel to the light extraction face. The light emitted from the first light emitting element exits from the package through the light transmitting region.

Abstract: A light emitting device includes a base, a frame, first and second semiconductor laser elements, one or more light-reflective members, and wires. The frame part has first inner lateral surfaces, second inner lateral surfaces, a first and second step-parts respectively formed along the second inner lateral surfaces. The wires are bonded to an upper surface of the first step-part or an upper surface of the second step-part. The first semiconductor laser element is disposed closer to the first step-part. The second semiconductor laser element is disposed closer to the second step-part. All of the wires that electrically connect the first semiconductor laser element to the frame part are not bonded to the upper surface of the second step-part. All of the wires that electrically connect the second semiconductor laser element to the frame part are not bonded to the upper surface of the first step-part.

Abstract: A light emitting device includes a base, a light emitting element, a wavelength conversion member, a lens member, and a frame part. The light emitting element is disposed on an upper surface of the base and configured to emit light. The wavelength conversion member is disposed on the upper surface of the base. The wavelength conversion member has an incident surface on which the light is to be incident, and a light emission surface through which the light is extracted out of the wavelength conversion member. The light emission surface is different from the incident surface. The lens member is bonded to the wavelength conversion member on a light emission surface side of the wavelength conversion member. The frame part is connected to the base and forms a sealed space in which the light emitting element, the wavelength conversion member, and the lens member are sealed.

Abstract: A light emitting device includes: a package having a light extraction face that has a light transmitting region; a first light emitting element disposed in the package and having an emission face configured to emit light that diverges; an optical member disposed in the package, wherein light emitting from the first light emitting element is incident on the optical member, and wherein the optical member is configured to reflect a portion of the incident light and to transmit a remainder of the incident light therethrough; and a photodetector disposed in the package and having a light receiving face configured to receive the light emitted from the first light emitting element and reflected by the optical member. The light emitted from the first light emitting element and transmitted through the optical member exits from the package through the light transmitting region.

Abstract: A light emitting device includes a plurality of semiconductor laser elements, a frame part, a light-reflective member, a plurality of wires, and first and second protective elements. The frame part has a pair of first inner lateral surfaces and a second inner surface. The light-reflective member is configured to reflect laser light traveling from at least one of the plurality of semiconductor laser elements toward one of the first inner lateral surfaces of the frame part. The wires electrically connect the semiconductor laser elements respectively to an upper surface of the frame part. The first and second protective elements are disposed on the upper surface of the frame part in an area of the upper surface along the second inner surface. At least one of the wires is bonded on an area of the upper surface between the first and second protective elements.

Abstract: A light emitting device includes a package, a cap, a joining member and at least one laser element. The package includes a metal film. The cap includes a light-transmissive member having a lower surface facing the package and an upper surface opposite to the lower surface, and a light blocking film arranged on the lower surface of the light-transmissive member and having a shape defining at least one opening. The joining member joins a part of the light blocking film and the metal film. The at least one laser element is positioned in a space bounded by the cap and the package such that a part of an edge of the at least one opening defined by the light blocking film is disposed directly above the at least one laser element.

Abstract: A light-emitting device includes a semiconductor laser element, a wavelength conversion member, and a package. The wavelength conversion member includes a wavelength conversion portion and a reflective portion as in the specification. The wavelength conversion portion includes a light incident surface and a light-emitting surface as in the specification. The package includes a disposition region as in the specification. The wavelength conversion member is disposed at a position away in a first direction from a position at which the semiconductor laser element is disposed. In a plan view perpendicular to the light-emitting surface, the light-emitting surface has a shape that has a first region as in the specification, and a region of at least 80% or more of the light incident surface overlaps an imaginary line that passes through a point of the light-emitting surface closest to the semiconductor laser element and that is parallel to the second direction.

Abstract: A light-emitting device includes a semiconductor laser element, a wavelength conversion member, and a package. The wavelength conversion member includes a wavelength conversion portion and a reflective portion. The wavelength conversion portion includes a light incident surface and a light-emitting surface. The package includes a disposition region. The wavelength conversion member is disposed at a position away in a first direction from a position at which the semiconductor laser element is disposed. The light-emitting surface has a shape that, in a plan view perpendicular to the light-emitting surface, has a first region decreasing in width in a second direction perpendicular to the first direction from the side closest to the semiconductor laser element toward the first direction.

Abstract: A package includes: a bottom portion having a mounting surface; and a lateral wall portion having a top surface and including: a lateral wall having a rectangular outer shape in a top view and surrounding the mounting surface, and a stepped portion formed along the lateral wall below the top surface. In the top view, the stepped portion includes a wide portion and a narrow portion that are two regions having different widths. The narrow portion is formed on a portion along a one side of an entire circumference of the lateral wall.

Abstract: A light emitting device includes: a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part has an uppermost face and includes a first stepped portion including a first upper face and a second stepped portion including a second upper face, wherein the first upper face and the second upper face are disposed below the uppermost face, wherein the first upper face and the second upper face are disposed inward of the uppermost face in a top view, and wherein a height of the first stepped portion from the bottom face is lower than a height of the second stepped portion from the bottom face; a semiconductor laser element disposed on the bottom face; and a light reflective member and/or an optical member disposed on the bottom face.

Abstract: A light emitting device includes: a laser element; a case enclosing the laser element, the case including a light-transmissive region configured to allow light emitted from the laser element to transmit through the light-transmissive region; a first lens configured to collimate or converge light emitted from the laser element; and a second lens that is disposed in the case and spaced apart from the first lens, the second lens located in an optical path between the laser element and the first lens. The second lens is spaced apart from the light-transmissive region such that an open space is located in the case between the light-transmissive region and the second lens.

Abstract: A light-emitting device includes a light-emitting element, a substrate supporting the light-emitting element, and one or more lateral wall portions joined to the substrate to surround the light-emitting element. The one or more lateral wall portions includes a first lateral wall portion having a light incident surface configured to receive a light emitted from the light-emitting element and traveling in a first direction and a light exit surface configured to emit the light. The substrate has a joint surface joined to the first lateral wall portion and a lateral surface meeting the joint surface. The lateral surface is located between the light incident surface and the light exit surface in a top view as viewed in a direction perpendicular to the joint surface.

Abstract: A light emitting device includes: a plurality of laser elements including a first laser element and a second laser element; a case enclosing the laser elements and including a light-transmissive region; and a plurality of main lenses including a first main lens configured to collimate or converge light emitted from the first laser element and a second main lens configured to collimate or converge light emitted from the second laser element. At least a first portion of the light-transmissive region is disposed on a first imaginary line passing through a light emitting end surface of the first laser element and the first main lens, and at least a second portion of the light-transmissive region is disposed on a second imaginary line passing through a light emitting end surface of the second laser element and the second main lens.