Abstract: A light emitting device includes: a package including upper and lower portions, and one or more lateral portions including a first lateral portion having a light-transmitting portion, the package having a closed space; a first light-emitting element having an upper surface, configured to have one or more emission points on the upper surface, and disposed on a mounting surface of the lower portion; and a reflecting part having a first reflection surface within the closed space to reflect light emitted upward from the emission points. Light reflected from the first reflection surface is transmitted through the light-transmitting portion. In a direction normal to the mounting surface, a first distance between a lower surface of the upper portion and the mounting surface is equal to or greater than 1.5 times a second distance between the upper surface of the first light-emitting element and a midpoint of the first reflection surface.

Abstract: A light emitting device includes a first light-emitting element configured to emit a first light in a first direction, a second light-emitting element configured to emit a second light in the first direction, a package including a substrate and a cap, having a light emission surface through which the first light and second light emitted from the first and second light-emitting elements are passed, and forming a closed space in which the first and second light-emitting elements are located, one or more optical members that are spaced away from the light emission surface in the first direction, and that are configured to combine the first light and second light, and one or more photodetectors that are spaced away from the light emission surface in the first direction, and that are configured to receive the first light and second light.

Abstract: A wiring board includes: an insulating member having a first upper surface, and a second upper surface located higher than the first upper surface; and a first wiring layer located on the first upper surface. The first upper surface has a wiring region that does not overlap with the second upper surface in a top view, and that is located in an exposed region. The first wiring layer extends from the wiring region to a connecting region that is connected to the wiring region, that overlaps with the second upper surface in a top view, and that is not exposed. The first wiring layer comprises a first pad portion located in the wiring region, and a first pattern portion located in the connecting region.

Abstract: A light emitting device includes: a first light emitting element having a light emitting surface; an optical member having a lower surface, a first reflecting surface inclined to the lower surface, transmitting part of a first light emitted from the light emitting surface, and reflecting the rest upward, and a second reflecting surface located farther from the light emitting surface than the first reflecting surface and reflecting part or all of the first light passing through the first reflecting surface; and a photodetector located below the optical member and having a top surface provided with one or a plurality of light receiving regions including a first light receiving region configured to receive the first light reflected by the second reflecting surface. In a top view, part or all of the first light receiving region overlaps part or all of the first reflecting surface.

Abstract: A light-emitting device includes a plurality of light-emitting elements, a photodetector, an optical member and a bonding portion. The light-emitting elements include a first light-emitting element configured to emit first light and a second light-emitting element configured to emit second light. The photodetector is configured to receive a part of light emitted from each of the light-emitting elements. The photodetector has a first bonding surface. The optical member has a second bonding surface and a first inner side surface. The first inner side surface is continuous from the second bonding surface. The light emitted from each of the plurality of light-emitting elements is configured to pass through the optical member. The bonding portion bonds the photodetector and the optical member with the bonding portion being in contact with the first bonding surface, the second bonding surface, and at least a part of the first inner side surface.

Abstract: A light emitting device includes: a plurality of laser elements including a first laser element and a second laser element; a case enclosing the laser elements and including a light-transmissive region; and a plurality of main lenses including a first main lens configured to collimate or converge light emitted from the first laser element and a second main lens configured to collimate or converge light emitted from the second laser element. At least a first portion of the light-transmissive region is disposed on a first imaginary line passing through a light emitting end surface of the first laser element and the first main lens, and at least a second portion of the light-transmissive region is disposed on a second imaginary line passing through a light emitting end surface of the second laser element and the second main lens.

Abstract: A light emitting device includes a base, a first light emitting element and a first light reflecting member disposed on the base and a lens member. The first light reflecting member is positioned with respect to the first light emitting element so that emitted light from the first light emitting element is divided into a portion of the emitted light from the first light emitting element irradiating onto the light reflecting face and a portion of the emitted light from the first light emitting element traveling outside of the light reflecting face by having an edge of the light reflecting face serve as a boundary. The lens member includes a reflected light passing region having a first lens shape configured to control the travelling direction of reflected light, and a non-reflected light passing region having a second lens shape configured to control a travelling direction of non-reflected light.

Abstract: A light emitting device includes: a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part comprises a first stepped portion and a second stepped portion facing the first stepped portion; a first semiconductor laser element disposed on the bottom face and located between the first stepped portion and the second stepped portion in a top view, wherein the first semiconductor laser element is configured to emit light towards the second stepped portion; a first wiring region located on the first stepped portion; and one or more first wires, each having a first end that is connected to the first wiring region. At least one of the one or more first wires is electrically connected to the first semiconductor laser element.

Abstract: A polarization control member includes a first dichroic mirror having a first incident face, a second dichroic mirror joined to the first dichroic mirror, the second dichroic mirror having a second incident face, and a waveplate joined to the first incident face of the first dichroic mirror.

Abstract: A light emitting device includes a semiconductor light emitting element and a package that seals the semiconductor light emitting element. The package includes a base having a first upper surface region directly or indirectly supporting the semiconductor light emitting element, and a second upper surface region surrounding the first upper surface region in a plan view viewed in a direction normal to the first upper surface region. The package further includes a cover bonded to the base, an inner metal layer disposed on the second upper surface region of the base, an outer metal layer extending along the outer edge of the inner metal layer, and a slit part on the second upper surface region between the inner metal layer and the outer metal layer. In the plan view, the inner edge of the inner metal layer is positioned inward of the outer edge of the cover. In the plan view, at least a portion of the outer edge of the outer metal layer is positioned outward of the outer edge of the cover.

Abstract: A light emitting device includes: a package including a base portion, a frame portion, and a cover portion; a light emitting element disposed on an upper surface of the base portion, surrounded by the frame portion, and configured to emit light traveling laterally; and a wavelength conversion member disposed on the base portion and including a first lateral surface on which light emitted from a light extraction surface of the light emitting element is to be incident, and an upper surface through which light is to be emitted. The frame portion includes a light shielding portion configured to shield light in a wavelength range of the light emitted from the light emitting element. The cover portion includes a light-transmissive portion configured to transmit and cause light emitted from the upper surface of the wavelength conversion member to exit to an area outside the light emitting device.

Abstract: A light emitting device includes: a plurality of light emitting elements including a first light emitting element and a second light emitting element; a case enclosing the light emitting elements and comprising a light-transmissive region; a plurality of main lenses, each covering a portion of the light-transmissive region, the plurality of main lenses including a first main lens configured to collimate or converge light emitted from the first light emitting element and a second main lens configured to collimate or converge light emitted from the second light emitting element; and a plurality of sub-lenses disposed in the case, the plurality of sub-lenses including a first sub-lens located in an optical path between the first light emitting element and the first main lens, and a second sub-lens located in an optical path between the second light emitting element and the second main lens.

Abstract: A light emitting device includes: a base having a first stepped portion and a second stepped portion; a light emitting element; an electronic member configured to be irradiated by light emitted from the light emitting element; a first wiring region located on the first stepped portion; a second wiring region located on the second stepped portion; wires connected to the light emitting element and the electronic member. The wires includes a first and second wires. The first wire has a first end that is connected to the first wiring region, and a second end. The second wire has a first end that is connected to the second wiring region, and a second end. A position of the second end of the first wire relative to the bottom face is lower than a position of the second end of the second wire relative to the bottom face.

Abstract: A light detecting element is realized in which a length thereof is reduced in a direction perpendicular to a direction in which light detecting regions are disposed side by side. A light detecting element includes a light detecting surface provided with a plurality of light detecting regions disposed side by side in a first direction and a plurality of wiring regions electrically connected to the plurality of light detecting regions. Of the plurality of wiring regions, a plurality of the wiring regions connected to a plurality of the light detecting regions are provided in an end region that is a region excluding a central region at the light detecting surface.

Abstract: A light emitting device includes a plurality of semiconductor laser elements, a frame part, a light-reflective member, a plurality of wires, and first and second protective elements. The frame part has a pair of first inner lateral surfaces and a second inner surface. The light-reflective member is configured to reflect laser light traveling from at least one of the plurality of semiconductor laser elements toward one of the first inner lateral surfaces of the frame part. The wires electrically connect the semiconductor laser elements respectively to an upper surface of the frame part. The first and second protective elements are disposed on the upper surface of the frame part in an area of the upper surface along the second inner surface. At least one of the wires is bonded on an area of the upper surface between the first and second protective elements.

Abstract: A light emitting device includes: a base; a first semiconductor laser element disposed on an upper surface of the base and configured to emit first light; a first light reflecting member disposed on the upper surface of the base, the first light reflecting member having a first light reflecting face including a plane configured to reflect the first light; a second semiconductor laser element disposed on an upper surface of the base and configured to emit second light; a second light reflecting member disposed on the upper surface of the base, the second light reflecting member having a second light reflecting face including a plane configured to reflect the second light; and a phosphor member onto which the first light reflected from the first light reflecting member and the second light reflected from the second light reflecting member are irradiated.

Abstract: A light-emitting device includes first and second light-emitting elements, upper submounts, and a lower submount. The upper submounts include a first submount having a first upper surface and a first lateral surface located on a same side as an emission end surface of the first light-emitting element, and a second submount having a second upper surface and a second lateral surface located on a same side as an emission end surface of the second light-emitting element. In a top plan view, the first lateral surface is located forward relative to the second lateral surface, and the emission end surface of the first light-emitting element is located forward relative to the emission end surface of the second light-emitting element. At least a portion of the first lateral surface is protruded forward relative to an edge along which an upper surface and a lateral surface of the lower submount meet.

Abstract: A light emitting device includes semiconductor laser elements, a frame part, a light-reflective member, a step part, metal films, wires, and a first protective element. The frame part surrounds a bottom surface on which the semiconductor laser elements are disposed. The light-reflective member is disposed on the bottom surface inside of a frame formed by the frame part. The step part is formed along a second inner lateral surface of the frame part, and disposed inside of the frame. The metal films are provided on an upper surface of the step part. The wires electrically connect the semiconductor laser elements respectively to the metal films. The first protective element is disposed on the upper surface of the step part and on a light traveling side of the laser light with respect to a plane including an emitting end surface of the first semiconductor laser element.

Abstract: A light emitting device includes a package, a cap fixed to the package, and at least one laser element. The cap includes a light-transmissive member having a lower surface facing the package and an upper surface opposite to the lower surface, and a light blocking film arranged on the lower surface of the light-transmissive member and having a shape which has at least one opening. The at least one laser element is disposed in a space bounded by the cap and the package at a position such that the at least one opening is irradiated by laser light emitted from the at least one laser element, at least a part of each of the at least one laser element being disposed in the at least one opening in the light blocking film in a top view.

Abstract: A light emitting device includes a light emitting element, a substrate, and a cap. The cap surrounds the light emitting element disposed on the substrate, and has a plurality of lateral portions including a first lateral portion having a first inner lateral surface through which the light emitted from a light emitting surface and traveling along an optical axis passes, and a second lateral portion having a second inner lateral surface different from the first inner lateral surface. The first inner lateral surface is inclined at a first inclination angle toward a side where the light emitting element is disposed with respect to a plane perpendicular to the mounting surface. The second inner lateral surface is inclined at a second inclination angle larger than the first inclination angle toward a side where the light emitting element is disposed with respect to a plane perpendicular to the mounting surface.