Patents by Inventor Soichiro Nagamochi

Soichiro Nagamochi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11577508
    Abstract: A highly reliable multilayer structure element substrate according to an embodiment of this present invention comprises: an electrothermal transducer; a temperature detection element formed at a position where the temperature detection element at least partially overlaps the electrothermal transducer in a planar view of the element substrate; and a plurality of wirings connected to the temperature detection element, wherein the temperature detection element can detect temperatures in a plurality of regions when a plurality of different wirings out of the plurality of wirings are selected.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: February 14, 2023
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Soichiro Nagamochi, Mineo Shimotsusa
  • Publication number: 20220288924
    Abstract: An element substrate comprises a plurality of stages of shift registers that inputs and holds a serial data signal; a latch circuit that latches the serial data held by the shift registers; a decoder circuit that inputs an output of the latch circuit and outputs a selection signal for selecting a block of the print elements or the memory elements; and a mask circuit that masks the output of the selection signal for selecting the block of the memory elements from the decoder circuit in accordance with an input bit data signal. The block of the print elements or the memory elements includes a plurality of print elements or memory elements in which one element is selected in each of the plurality of groups.
    Type: Application
    Filed: March 10, 2022
    Publication date: September 15, 2022
    Inventors: Soichiro Nagamochi, Toshio Negishi, Yasuhiro Soeda
  • Patent number: 11358389
    Abstract: An element substrate has a layered structure including a heating resistance element, a first insulation layer where a temperature detection element constituted by a via is formed, and a second insulation layer provided between the heating resistance element and the temperature detection element which electrically insulates the heating resistance element and the temperature detection element.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: June 14, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventors: Mineo Shimotsusa, Soichiro Nagamochi
  • Patent number: 11110705
    Abstract: A liquid-discharging-head substrate includes an insulation layer, an electrode, and a heating resistor element, wherein the insulation layer includes a first opening portion including a first opening formed in a surface of the insulation layer, a second opening having a smaller opening area than an opening area of the first opening, and a surface connecting the first opening and the second opening, and a second opening portion extending from the second opening to a back surface of the insulation layer, wherein the electrode is formed in the second opening portion, and a surface of the electrode is exposed from the second opening when viewed from the surface side of the insulation layer, and wherein the heating resistor element is in contact with the surface connecting the first opening and the second opening, and with the surface of the electrode.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: September 7, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventors: Soichiro Nagamochi, Hirokazu Komuro
  • Patent number: 10981381
    Abstract: A liquid discharge head substrate comprising a liquid discharge element arranged above a surface of a substrate, an insulator arranged between the surface and the liquid discharge element, a liquid supply port extending through the insulator, first and second conductive patterns is provided. The first pattern connects an element arranged on the surface and the liquid discharge element. The second pattern surrounds the liquid supply port. The insulator includes first and second films that are bonded at a bonding surface along the surface. A first member arranged in the first film and a second member arranged in the second film, of the first pattern, are bonded at the bonding surface. A third member arranged in the first film and a fourth member arranged in the second film, of the second pattern, are bonded at the bonding surface.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: April 20, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Soichiro Nagamochi, Takeshi Aoki
  • Publication number: 20210031513
    Abstract: An element substrate has a layered structure including a heating resistance element, a first insulation layer where a temperature detection element constituted by a via is formed, and a second insulation layer provided between the heating resistance element and the temperature detection element which electrically insulates the heating resistance element and the temperature detection element.
    Type: Application
    Filed: July 14, 2020
    Publication date: February 4, 2021
    Inventors: Mineo Shimotsusa, Soichiro Nagamochi
  • Publication number: 20210008878
    Abstract: A highly reliable multilayer structure element substrate according to an embodiment of this present invention comprises: an electrothermal transducer; a temperature detection element formed at a position where the temperature detection element at least partially overlaps the electrothermal transducer in a planar view of the element substrate; and a plurality of wirings connected to the temperature detection element, wherein the temperature detection element can detect temperatures in a plurality of regions when a plurality of different wirings out of the plurality of wirings are selected.
    Type: Application
    Filed: July 2, 2020
    Publication date: January 14, 2021
    Inventors: Soichiro Nagamochi, Mineo Shimotsusa
  • Patent number: 10766256
    Abstract: Provided is a liquid ejection head substrate having a base, a heat generating resistor layer formed on or above the base and including an electrothermal conversion portion, a wiring electrically connected to the heat generating resistor layer and defining the electrothermal conversion portion and a protecting film covering at least the electrothermal conversion portion and the wiring of the heat generating resistor layer. In the liquid ejection head substrate, the wiring is made of an alloy containing Al as a main component and Cu and having an average crystal grain size of 300 nm or less.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: September 8, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Soichiro Nagamochi, Yuzuru Ishida
  • Patent number: 10703103
    Abstract: A liquid ejection head including a substrate, an energy generating element provided on the substrate, a film provided on the substrate and the energy generating element, and a flow path forming member provided on the substrate, forming a flow path of a liquid between the flow path forming member and the substrate, and having an ejection orifice at a position faced with the energy generating element, characterized in that the substrate has a supply path of the liquid communicating with the flow path, the flow path forming member has a structure protruding toward the supply path, and a peripheral shape of a distal end portion of the structure is a curved surface shape.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: July 7, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Souta Takeuchi, Soichiro Nagamochi, Takuya Hatsui
  • Publication number: 20200039222
    Abstract: A liquid discharge head substrate comprising a liquid discharge element arranged above a surface of a substrate, an insulator arranged between the surface and the liquid discharge element, a liquid supply port extending through the insulator, first and second conductive patterns is provided. The first pattern connects an element arranged on the surface and the liquid discharge element. The second pattern surrounds the liquid supply port. The insulator includes first and second films that are bonded at a bonding surface along the surface. A first member arranged in the first film and a second member arranged in the second film, of the first pattern, are bonded at the bonding surface. A third member arranged in the first film and a fourth member arranged in the second film, of the second pattern, are bonded at the bonding surface.
    Type: Application
    Filed: July 30, 2019
    Publication date: February 6, 2020
    Inventors: Soichiro Nagamochi, Takeshi Aoki
  • Publication number: 20190308416
    Abstract: Provided is a liquid ejection head substrate having a base, a heat generating resistor layer formed on or above the base and including an electrothermal conversion portion, a wiring electrically connected to the heat generating resistor layer and defining the electrothermal conversion portion and a protecting film covering at least the electrothermal conversion portion and the wiring of the heat generating resistor layer. In the liquid ejection head substrate, the wiring is made of an alloy containing Al as a main component and Cu and having an average crystal grain size of 300 nm or less.
    Type: Application
    Filed: March 29, 2019
    Publication date: October 10, 2019
    Inventors: Soichiro Nagamochi, Yuzuru Ishida
  • Publication number: 20190217619
    Abstract: A liquid ejection head including a substrate, an energy generating element provided on the substrate, a film provided on the substrate and the energy generating element, and a flow path forming member provided on the substrate, forming a flow path of a liquid between the flow path forming member and the substrate, and having an ejection orifice at a position faced with the energy generating element, characterized in that the substrate has a supply path of the liquid communicating with the flow path, the flow path forming member has a structure protruding toward the supply path, and a peripheral shape of a distal end portion of the structure is a curved surface shape.
    Type: Application
    Filed: January 4, 2019
    Publication date: July 18, 2019
    Inventors: Souta Takeuchi, Soichiro Nagamochi, Takuya Hatsui
  • Publication number: 20190084302
    Abstract: A liquid-discharging-head substrate includes an insulation layer, an electrode, and a heating resistor element, wherein the insulation layer includes a first opening portion including a first opening formed in a surface of the insulation layer, a second opening having a smaller opening area than an opening area of the first opening, and a surface connecting the first opening and the second opening, and a second opening portion extending from the second opening to a back surface of the insulation layer, wherein the electrode is formed in the second opening portion, and a surface of the electrode is exposed from the second opening when viewed from the surface side of the insulation layer, and wherein the heating resistor element is in contact with the surface connecting the first opening and the second opening, and with the surface of the electrode.
    Type: Application
    Filed: November 20, 2018
    Publication date: March 21, 2019
    Inventors: Soichiro Nagamochi, Hirokazu Komuro
  • Patent number: 10166772
    Abstract: A liquid-discharging-head substrate includes an insulation layer, an electrode, and a heating resistor element, wherein the insulation layer includes a first opening portion including a first opening formed in a surface of the insulation layer, a second opening having a smaller opening area than an opening area of the first opening, and a surface connecting the first opening and the second opening, and a second opening portion extending from the second opening to a back surface of the insulation layer, wherein the electrode is formed in the second opening portion, and a surface of the electrode is exposed from the second opening when viewed from the surface side of the insulation layer, and wherein the heating resistor element is in contact with the surface connecting the first opening and the second opening, and with the surface of the electrode.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: January 1, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Soichiro Nagamochi, Hirokazu Komuro
  • Patent number: 9975338
    Abstract: A method for manufacturing a liquid ejection head substrate, in which a heat storage layer, a pair of electrodes extending from the surface of the heat storage layer toward the back surface, a heat-generating resistor layer in contact with the pair of electrodes and the surface of the heat storage layer, and a first cover layer configured to cover the heat-generating resistor layer are stacked, includes the steps of etching the heat-generating resistor layer and the first cover layer by using a mask disposed on a substrate including the heat-generating resistor layer and the first cover layer, removing the mask, and forming a second cover layer configured to cover an end portion of the heat-generating resistor layer in that order.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: May 22, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takuya Hatsui, Shuichi Tamatsukuri, Souta Takeuchi, Kenji Takahashi, Soichiro Nagamochi, Shinya Iwahashi
  • Patent number: 9751301
    Abstract: Even if electrostatic discharge occurs, dielectric breakdown of an insulating layer for covering an element on a base substrate is inhibited. A substrate for an ink jet recording head includes: a base substrate including an element configured to apply energy for ejecting ink to ink and an insulating protective layer for covering the element; an ejection orifice forming member including an insulating first member for forming an ink flow path for supplying ink to the element and a second member including an ejection orifice surface having ejection orifices provided therein; and a columnar conductive member extending between the second member and the base substrate in a direction intersecting the ejection orifice surface.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: September 5, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Kenji Takahashi, Shinya Iwahashi, Soichiro Nagamochi, Souta Takeuchi, Takuya Hatsui, Shuichi Tamatsukuri
  • Publication number: 20170225463
    Abstract: A liquid-discharging-head substrate includes an insulation layer, an electrode, and a heating resistor element, wherein the insulation layer includes a first opening portion including a first opening formed in a surface of the insulation layer, a second opening having a smaller opening area than an opening area of the first opening, and a surface connecting the first opening and the second opening, and a second opening portion extending from the second opening to a back surface of the insulation layer, wherein the electrode is formed in the second opening portion, and a surface of the electrode is exposed from the second opening when viewed from the surface side of the insulation layer, and wherein the heating resistor element is in contact with the surface connecting the first opening and the second opening, and with the surface of the electrode.
    Type: Application
    Filed: February 6, 2017
    Publication date: August 10, 2017
    Inventors: Soichiro Nagamochi, Hirokazu Komuro
  • Patent number: 9561651
    Abstract: An element substrate including a base having a heat-generating resistor element which generates thermal energy used for discharging a liquid; an electrically conductive protective layer covering the heat-generating resistor element; an insulating layer provided between the heat-generating resistor element and the protective layer; and a potential applying unit for applying a potential to the protective layer such that a potential of the protective layer is lower than a potential at one end of the heat-generating resistor element and higher than a potential at the other end of the heat-generating resistor element with a voltage being applied between the one end and the other end of the heat-generating resistor element.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: February 7, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takuya Hatsui, Souta Takeuchi, Kenji Takahashi, Soichiro Nagamochi, Shinya Iwahashi
  • Publication number: 20170021623
    Abstract: A method for manufacturing a liquid ejection head substrate, in which a heat storage layer, a pair of electrodes extending from the surface of the heat storage layer toward the back surface, a heat-generating resistor layer in contact with the pair of electrodes and the surface of the heat storage layer, and a first cover layer configured to cover the heat-generating resistor layer are stacked, includes the steps of etching the heat-generating resistor layer and the first cover layer by using a mask disposed on a substrate including the heat-generating resistor layer and the first cover layer, removing the mask, and forming a second cover layer configured to cover an end portion of the heat-generating resistor layer in that order.
    Type: Application
    Filed: July 22, 2016
    Publication date: January 26, 2017
    Inventors: Takuya Hatsui, Shuichi Tamatsukuri, Souta Takeuchi, Kenji Takahashi, Soichiro Nagamochi, Shinya Iwahashi
  • Publication number: 20160325544
    Abstract: Even if electrostatic discharge occurs, dielectric breakdown of an insulating layer for covering an element on a base substrate is inhibited. A substrate for an ink jet recording head includes: a base substrate including an element configured to apply energy for ejecting ink to ink and an insulating protective layer for covering the element; an ejection orifice forming member including an insulating first member for forming an ink flow path for supplying ink to the element and a second member including an ejection orifice surface having ejection orifices provided therein; and a columnar conductive member extending between the second member and the base substrate in a direction intersecting the ejection orifice surface.
    Type: Application
    Filed: April 25, 2016
    Publication date: November 10, 2016
    Inventors: Kenji Takahashi, Shinya Iwahashi, Soichiro Nagamochi, Souta Takeuchi, Takuya Hatsui, Shuichi Tamatsukuri