Abstract: A sensor device includes a semiconductor sensor element and a substrate on which the semiconductor sensor element is mounted. The substrate includes a sensor-element mounted portion at which the semiconductor sensor element is mounted, and includes a first resist portion that surrounds the sensor-element mounted portion. The substrate includes a first region adjacent to the first resist portion and being covered with a resin layer, and includes a second resist portion that surrounds the first resist portion, the first region being interposed between the first resist portion and the second resist portion. The substrate includes at least one third resist portion extending from the first resist portion toward the second resist portion.

Abstract: A pressure sensor device of the present invention includes a first board including external connection terminals, a second board stacked on an upper surface of the first board and including a first through hole and a second through hole, a pressure sensor element including a diaphragm structure and mounted on an upper surface of the second board such that the first through hole is closed by the diaphragm structure, and a cover that is mounted on the upper surface of the second board to cover the pressure sensor element and in which a first channel for guiding a first fluid to an upper surface of the diaphragm structure is formed. A second channel is formed between the first board and the second board to lead from the second through hole to the first through hole and guide a second fluid to a lower surface of the diaphragm structure.

Abstract: A pressure sensor device of the present invention includes a first board including external connection terminals, a second board stacked on an upper surface of the first board and including a first through hole and a second through hole, a pressure sensor element including a diaphragm structure and mounted on an upper surface of the second board such that the first through hole is closed by the diaphragm structure, and a cover that is mounted on the upper surface of the second board to cover the pressure sensor element and in which a first channel for guiding a first fluid to an upper surface of the diaphragm structure is formed. A second channel is formed between the first board and the second board to lead from the second through hole to the first through hole and guide a second fluid to a lower surface of the diaphragm structure.

Abstract: A module includes a first substrate including first electrodes; a first element bonded to the first substrate, and including second electrodes disposed at a first end of the first element and third electrodes disposed at a second end of the first element opposite from the first end; a second substrate stacked on the first substrate and including a recess; and a second element bonded to a bottom surface of the recess of the second substrate and including fourth electrodes. The first electrodes of the first substrate are electrically connected to the second electrodes at the first end of the first element, and the third electrodes at the second end of the first element are electrically connected to the fourth electrodes of the second element via a through hole formed in the bottom surface of the recess.

Abstract: A module includes a first substrate including first electrodes; a first element bonded to the first substrate, and including second electrodes disposed at a first end of the first element and third electrodes disposed at a second end of the first element opposite from the first end; a second substrate stacked on the first substrate and including a recess; and a second element bonded to a bottom surface of the recess of the second substrate and including fourth electrodes. The first electrodes of the first substrate are electrically connected to the second electrodes at the first end of the first element, and the third electrodes at the second end of the first element are electrically connected to the fourth electrodes of the second element via a through hole formed in the bottom surface of the recess.

Abstract: A sensor apparatus includes a semiconductor sensor device including a first attachment surface, a base part being wire-bonded to the semiconductor sensor device and including a second attachment surface, and a spacer being interposed between the first and second attachment surfaces and having a target attachment surface to which at least one of the first and second attachment surfaces is adhered via a die-bond resin. A total area of the target attachment surface is smaller than a total area of the first attachment surface.

Abstract: A sensor apparatus includes a semiconductor sensor device including a first attachment surface, a base part being wire-bonded to the semiconductor sensor device and including a second attachment surface, and a spacer being interposed between the first and second attachment surfaces and having a target attachment surface to which at least one of the first and second attachment surfaces is adhered via a die-bond resin. A total area of the target attachment surface is smaller than a total area of the first attachment surface.