Patents by Inventor Soichiro TAKAHASHI
Soichiro TAKAHASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105560Abstract: A semiconductor device includes: two conductive members; a semiconductor element bonded to one of the two conductive members; and a relay terminal bonded to the two conductive members. The relay terminal has a first strip portion and a second strip portion that are bonded to the two conductive members, and a connecting portion that connects the first strip portion and the second strip portion. The first strip portion has a first side. The connecting portion has a first intermediate side, and a first connecting side connecting the first side and the first intermediate side. As viewed in the thickness direction, the first connecting side is located away from a first virtual intersection that is an intersection of a first virtual line overlapping with the first side and a second virtual line overlapping with the first intermediate side.Type: ApplicationFiled: December 4, 2023Publication date: March 28, 2024Inventors: Yasuhiro TAHARA, Soichiro TAKAHASHI
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Publication number: 20240079296Abstract: A semiconductor device includes a first conductive plate, a second conductive plate, first switching elements, second switching elements, a first supply terminal and a second supply terminal. The first and second conductive plates are spaced apart from each other in a first direction. The first switching elements are bonded to the first conductive plate, and are electrically connected to the second conductive plate. The second switching elements are bonded to the second conductive plate. The first supply terminal is bonded to the first conductive plate. The second supply terminal has a region that overlaps with the first supply terminal as viewed in a plan view. The second supply terminal is spaced apart from the first conductive plate and the first supply terminal in a thickness direction perpendicular to the first direction. The second supply terminal is electrically connected to the second switching elements.Type: ApplicationFiled: April 26, 2023Publication date: March 7, 2024Inventors: Takumi KANDA, Masaaki MATSUO, Soichiro TAKAHASHI, Yoshitoki INAMI, Kaito INOUE
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Publication number: 20240047432Abstract: A semiconductor device includes a substrate including an obverse surface facing one side in a thickness direction, a plurality of semiconductor elements located on the one side in the thickness direction with respect to the substrate and having a switching function, a first layer located between the obverse surface and the plurality of semiconductor elements in the thickness direction and having electrical conductivity, a second layer conductively bonding the obverse surface and the first layer to each other, and a third layer conductively bonding the first layer and the plurality of semiconductor elements to each other.Type: ApplicationFiled: October 20, 2023Publication date: February 8, 2024Inventor: Soichiro TAKAHASHI
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Patent number: 11670572Abstract: A semiconductor device includes a first conductive plate, a second conductive plate, first switching elements, second switching elements, a first supply terminal and a second supply terminal. The first and second conductive plates are spaced apart from each other in a first direction. The first switching elements are bonded to the first conductive plate, and are electrically connected to the second conductive plate. The second switching elements are bonded to the second conductive plate. The first supply terminal is bonded to the first conductive plate. The second supply terminal has a region that overlaps with the first supply terminal as viewed in a plan view. The second supply terminal is spaced apart from the first conductive plate and the first supply terminal in a thickness direction perpendicular to the first direction. The second supply terminal is electrically connected to the second switching elements.Type: GrantFiled: November 18, 2021Date of Patent: June 6, 2023Assignee: ROHM CO., LTD.Inventors: Takumi Kanda, Masaaki Matsuo, Soichiro Takahashi, Yoshitoki Inami, Kaito Inoue
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Publication number: 20220320049Abstract: A power module includes a mount layer, a control layer, and a drive layer that are formed on an electrically insulative substrate and multiple power semiconductor elements mounted on the mount layer in one direction and each including a first drive electrode connected to the mount layer, a second drive electrode connected to the drive layer, and a control electrode connected to the control layer. A control terminal is connected to the control layer and a detection terminal is connected to the drive layer. At least one of the control layer and the drive layer includes a detour portion that detours to reduce a difference between the power semiconductor elements in a sum of a length of a first conductive path between the control electrode and the control terminal and a length of a second conductive path between the second drive electrode and the detection terminal.Type: ApplicationFiled: August 6, 2020Publication date: October 6, 2022Inventors: Kenichi ONODERA, Soichiro TAKAHASHI
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Publication number: 20220077032Abstract: A semiconductor device includes a first conductive plate, a second conductive plate, first switching elements, second switching elements, a first supply terminal and a second supply terminal. The first and second conductive plates are spaced apart from each other in a first direction. The first switching elements are bonded to the first conductive plate, and are electrically connected to the second conductive plate. The second switching elements are bonded to the second conductive plate. The first supply terminal is bonded to the first conductive plate. The second supply terminal has a region that overlaps with the first supply terminal as viewed in a plan view. The second supply terminal is spaced apart from the first conductive plate and the first supply terminal in a thickness direction perpendicular to the first direction. The second supply terminal is electrically connected to the second switching elements.Type: ApplicationFiled: November 18, 2021Publication date: March 10, 2022Inventors: Takumi KANDA, Masaaki MATSUO, Soichiro TAKAHASHI, Yoshitoki INAMI, Kaito INOUE
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Patent number: 11211312Abstract: A semiconductor device includes a first conductive plate, a second conductive plate, first switching elements, second switching elements, a first supply terminal and a second supply terminal. The first and second conductive plates are spaced apart from each other in a first direction. The first switching elements are bonded to the first conductive plate, and are electrically connected to the second conductive plate. The second switching elements are bonded to the second conductive plate. The first supply terminal is bonded to the first conductive plate. The second supply terminal has a region that overlaps with the first supply terminal as viewed in a plan view. The second supply terminal is spaced apart from the first conductive plate and the first supply terminal in a thickness direction perpendicular to the first direction. The second supply terminal is electrically connected to the second switching elements.Type: GrantFiled: November 19, 2018Date of Patent: December 28, 2021Assignee: ROHM CO., LTD.Inventors: Takumi Kanda, Masaaki Matsuo, Soichiro Takahashi, Yoshitoki Inami, Kaito Inoue
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Patent number: 11127662Abstract: The disclosure provides a semiconductor device. The device includes first and second substrates, first mounting layers, second mounting layers, power supply terminals, an output terminal, electroconductive coupling members and switching elements. The first substrate has first obverse and reverse surfaces facing in a thickness direction. The second substrate has a second obverse surface facing as the first obverse surface faces in the thickness direction and a second reverse surface facing away from the second obverse surface. The second substrate is spaced from the first substrate in a first direction crossing the thickness direction. The first mounting layers are electrically conductive and disposed on the first obverse surface. The second mounting layers are electrically conductive and disposed on the second obverse surface. The power supply terminals are electrically connected to the first mounting layers. The output terminal is connected to one of the second mounting layers.Type: GrantFiled: March 14, 2018Date of Patent: September 21, 2021Assignee: ROHM CO., LTD.Inventors: Masaaki Matsuo, Kenji Hayashi, Akihiro Suzaki, Soichiro Takahashi, Masashi Hayashiguchi, Yoshihisa Tsukamoto
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Patent number: 10892218Abstract: A first power supply terminal P is provided with an internal wiring connection portion 31A, an upright portion 31B which is joined to the internal wiring connection portion 31A, an inclined portion 31C which is joined to the upright portion 31B and an external wiring connection portion 31D which is joined to the inclined portion 31C. A second power supply terminal N is provided with an internal wiring connection portion 32A, an upright portion 32B which is joined to the internal wiring connection portion 32A, an inclined portion 32C which is joined to the upright portion 32B and an external wiring connection portion 32D which is joined to the inclined portion 32C. The upright portion 31B of the first power supply terminal P and the upright portion 32B of the second power supply terminal N are arranged so as to face each other, with a predetermined interval kept therebetween.Type: GrantFiled: October 9, 2019Date of Patent: January 12, 2021Assignee: ROHM CO., LTD.Inventors: Yoshihisa Tsukamoto, Masashi Hayashiguchi, Soichiro Takahashi
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Publication number: 20200266134Abstract: A semiconductor device includes a first conductive plate, a second conductive plate, first switching elements, second switching elements, a first supply terminal and a second supply terminal. The first and second conductive plates are spaced apart from each other in a first direction. The first switching elements are bonded to the first conductive plate, and are electrically connected to the second conductive plate. The second switching elements are bonded to the second conductive plate. The first supply terminal is bonded to the first conductive plate. The second supply terminal has a region that overlaps with the first supply terminal as viewed in a plan view. The second supply terminal is spaced apart from the first conductive plate and the first supply terminal in a thickness direction perpendicular to the first direction. The second supply terminal is electrically connected to the second switching elements.Type: ApplicationFiled: November 19, 2018Publication date: August 20, 2020Inventors: Takumi KANDA, Masaaki MATSUO, Soichiro TAKAHASHI, Yoshitoki INAMI, Kaito INOUE
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Patent number: 10704403Abstract: A wastegate sealing jig (13) includes a base (14) which is fixable to an exhaust portion (11) of a turbocharger (1), the base (14) including a wastegate valve (6), and a turbine hole (12) which discharges exhaust gas in a turbine chamber (4b), a protrusion (15) which is provided in the base (14) so as to extend toward the exhaust portion (11), a valve member (16) which is attached to a distal end of the protrusion (15). The wastegate (5) is closed by the valve member (16) by inserting the valve member (16) between the wastegate (5) and the wastegate valve (6) of the turbocharger (1) in a state in which the wastegate valve (6) is opened.Type: GrantFiled: November 5, 2018Date of Patent: July 7, 2020Assignee: HONDA MOTOR CO., LTD.Inventors: Yasuo Watanabe, Soichiro Takahashi, Tomoki Kiyooka
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Publication number: 20200043843Abstract: A first power supply terminal P is provided with an internal wiring connection portion 31A, an upright portion 31B which is joined to the internal wiring connection portion 31A, an inclined portion 31C which is joined to the upright portion 31B and an external wiring connection portion 31D which is joined to the inclined portion 31C. A second power supply terminal N is provided with an internal wiring connection portion 32A, an upright portion 32B which is joined to the internal wiring connection portion 32A, an inclined portion 32C which is joined to the upright portion 32B and an external wiring connection portion 32D which is joined to the inclined portion 32C. The upright portion 31B of the first power supply terminal P and the upright portion 32B of the second power supply terminal N are arranged so as to face each other, with a predetermined interval kept therebetween.Type: ApplicationFiled: October 9, 2019Publication date: February 6, 2020Inventors: Yoshihisa TSUKAMOTO, Masashi HAYASHIGUCHI, Soichiro TAKAHASHI
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Publication number: 20200013703Abstract: The disclosure provides a semiconductor device. The device includes first and second substrates, first mounting layers, second mounting layers, power supply terminals, an output terminal, electroconductive coupling members and switching elements. The first substrate has first obverse and reverse surfaces facing in a thickness direction. The second substrate has a second obverse surface facing as the first obverse surface faces in the thickness direction and a second reverse surface facing away from the second obverse surface. The second substrate is spaced from the first substrate in a first direction crossing the thickness direction. The first mounting layers are electrically conductive and disposed on the first obverse surface. The second mounting layers are electrically conductive and disposed on the second obverse surface. The power supply terminals are electrically connected to the first mounting layers. The output terminal is connected to one of the second mounting layers.Type: ApplicationFiled: March 14, 2018Publication date: January 9, 2020Inventors: Masaaki MATSUO, Kenji HAYASHI, Akihiro SUZAKI, Soichiro TAKAHASHI, Masashi HAYASHIGUCHI, Yoshihisa TSUKAMOTO
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Patent number: 10490494Abstract: A first power supply terminal P is provided with an internal wiring connection portion 31A, an upright portion 31B which is joined to the internal wiring connection portion 31A, an inclined portion 31C which is joined to the upright portion 31B and an external wiring connection portion 31D which is joined to the inclined portion 31C. A second power supply terminal N is provided with an internal wiring connection portion 32A, an upright portion 32B which is joined to the internal wiring connection portion 32A, an inclined portion 32C which is joined to the upright portion 32B and an external wiring connection portion 32D which is joined to the inclined portion 32C. The upright portion 31B of the first power supply terminal P and the upright portion 32B of the second power supply terminal N are arranged so as to face each other, with a predetermined interval kept therebetween.Type: GrantFiled: December 12, 2018Date of Patent: November 26, 2019Assignee: ROHM CO., LTD.Inventors: Yoshihisa Tsukamoto, Masashi Hayashiguchi, Soichiro Takahashi
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Publication number: 20190136706Abstract: A wastegate sealing jig (13) includes a base (14) which is fixable to an exhaust portion (11) of a turbocharger (1), the base (14) including a wastegate valve (6), and a turbine hole (12) which discharges exhaust gas in a turbine chamber (4b), a protrusion (15) which is provided in the base (14) so as to extend toward the exhaust portion (11), a valve member (16) which is attached to a distal end of the protrusion (15). The wastegate (5) is closed by the valve member (16) by inserting the valve member (16) between the wastegate (5) and the wastegate valve (6) of the turbocharger (1) in a state in which the wastegate valve (6) is opened.Type: ApplicationFiled: November 5, 2018Publication date: May 9, 2019Inventors: Yasuo Watanabe, Soichiro Takahashi, Tomoki Kiyooka
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Publication number: 20190115296Abstract: A first power supply terminal P is provided with an internal wiring connection portion 31A, an upright portion 31B which is joined to the internal wiring connection portion 31A, an inclined portion 31C which is joined to the upright portion 31B and an external wiring connection portion 31D which is joined to the inclined portion 31C. A second power supply terminal N is provided with an internal wiring connection portion 32A, an upright portion 32B which is joined to the internal wiring connection portion 32A, an inclined portion 32C which is joined to the upright portion 32B and an external wiring connection portion 32D which is joined to the inclined portion 32C. The upright portion 31B of the first power supply terminal P and the upright portion 32B of the second power supply terminal N are arranged so as to face each other, with a predetermined interval kept therebetween.Type: ApplicationFiled: December 12, 2018Publication date: April 18, 2019Inventors: Yoshihisa TSUKAMOTO, Masashi HAYASHIGUCHI, Soichiro TAKAHASHI
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Patent number: 10192820Abstract: A first power supply terminal P is provided with an internal wiring connection portion 31A, an upright portion 31B which is joined to the internal wiring connection portion 31A, an inclined portion 31C which is joined to the upright portion 31B and an external wiring connection portion 31D which is joined to the inclined portion 31C. A second power supply terminal N is provided with an internal wiring connection portion 32A, an upright portion 32B which is joined to the internal wiring connection portion 32A, an inclined portion 32C which is joined to the upright portion 32B and an external wiring connection portion 32D which is joined to the inclined portion 32C. The upright portion 31B of the first power supply terminal P and the upright portion 32B of the second power supply terminal N are arranged so as to face each other, with a predetermined interval kept therebetween.Type: GrantFiled: February 4, 2016Date of Patent: January 29, 2019Assignee: ROHM CO., LTD.Inventors: Yoshihisa Tsukamoto, Masashi Hayashiguchi, Soichiro Takahashi
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Publication number: 20180033720Abstract: A first power supply terminal P is provided with an internal wiring connection portion 31A, an upright portion 31B which is joined to the internal wiring connection portion 31A, an inclined portion 31C which is joined to the upright portion 31B and an external wiring connection portion 31D which is joined to the inclined portion 31C. A second power supply terminal N is provided with an internal wiring connection portion 32A, an upright portion 32B which is joined to the internal wiring connection portion 32A, an inclined portion 32C which is joined to the upright portion 32B and an external wiring connection portion 32D which is joined to the inclined portion 32C. The upright portion 31B of the first power supply terminal P and the upright portion 32B of the second power supply terminal N are arranged so as to face each other, with a predetermined interval kept therebetween.Type: ApplicationFiled: February 4, 2016Publication date: February 1, 2018Inventors: Yoshihisa TSUKAMOTO, Masashi HAYASHIGUCHI, Soichiro TAKAHASHI