Abstract: An optoelectronic component is disclosed. In an embodiment an optoelectronic component includes a housing body, an optical element and a rabbet comprising a shoulder and a cheek, wherein the rabbet is located on an upper side of the housing body, wherein the optical element is located in the rabbet such that a brim of the optical element rests on the shoulder of the rabbet, wherein the upper side of the housing body comprises a rectangular shape, and wherein the shoulder of the rabbet is located only at corners of the rabbet.

Abstract: A light-emitting component is provided which comprises a carrier, a reflective layer and a light source, wherein the light source is mechanically fixed on a mounting surface of the carrier. The carrier has an electrically isolating basic body comprising an edge region, said edge region bounding the mounting surface. The edge region comprises a recess, wherein the reflective layer covers a base surface of the recess. Moreover, the mounting surface is vertically elevated with respect to the base surface of the recess at least in places, such that the reflective layer is kept away from the mounting surface. Furthermore, a method for producing such a light-emitting component is provided.

Abstract: An optoelectronic semiconductor device and a method for producing an optoelectronic semiconductor device are disclosed.

Abstract: A light-emitting component is provided which comprises a carrier, a reflective layer and a light source, wherein the light source is mechanically fixed on a mounting surface of the carrier. The carrier has an electrically isolating basic body comprising an edge region, said edge region bounding the mounting surface. The edge region comprises a recess, wherein the reflective layer covers a base surface of the recess. Moreover, the mounting surface is vertically elevated with respect to the base surface of the recess at least in places, such that the reflective layer is kept away from the mounting surface. Furthermore, a method for producing such a light-emitting component is provided.

Abstract: An optoelectronic component is disclosed. In an embodiment an optoelectronic component includes a housing body, an optical element and a rabbet comprising a shoulder and a cheek, wherein the rabbet is located on an upper side of the housing body, wherein the optical element is located in the rabbet such that a brim of the optical element rests on the shoulder of the rabbet, wherein the upper side of the housing body comprises a rectangular shape, and wherein the shoulder of the rabbet is located only at corners of the rabbet.

Abstract: A package for an electronic component includes a housing and a leadframe embedded in the housing. The leadframe includes a first section, a second section and a third section which are electrically isolated from one another. The first section and the second section each include an L-shape.

Abstract: A package for an electronic component includes a housing and a leadframe embedded in the housing. The leadframe includes a first section, a second section and a third section which are electrically isolated from one another. The first section and the second section each include an L-shape.

Abstract: A leadframe includes first and second parts separated from each other, and each comprises at least one anchoring hole. The first part comprises a mounting area, the second part comprises an edge line facing the first part which is curved, and the first part comprises first, second and third portions each having a maximum width, wherein the mounting area is arranged at the third portion, and the third portion follows the second portion and the second portion follows the first portion in a direction of a longitudinal extent of the first part such that the third portion faces the second part.

Abstract: A window that covers an optoelectronic semiconductor chip includes an upper face, the upper face including a polygonal shape, wherein at least one corner of the upper face is chamfered. A method of producing a window that covers an optoelectronic semiconductor chip, the method including providing a panel; creating a plurality of holes at an upper face of the panel; dividing the panel along separation lines to obtain a plurality of windows, wherein the separation lines extend through the holes.

Abstract: A leadframe includes first and second parts separated from each other, and each comprises at least one anchoring hole. The first part comprises a mounting area, the second part comprises an edge line facing the first part which is curved, and the first part comprises first, second and third portions each having a maximum width, wherein the mounting area is arranged at the third portion, and the third portion follows the second portion and the second portion follows the first portion in a direction of a longitudinal extent of the first part such that the third portion faces the second part.

Abstract: An optoelectronic device includes a carrier, a housing, and a radiation source that emits electromagnetic radiation arranged on the carrier, wherein the housing is fixed to the carrier by a glue layer, the glue layer is arranged between a first face of the housing and a second face of the carrier, the first face of the housing and the second face of the carrier are arranged at an inclination angle to each other, a distance between the first face and the second face increases from an outer rim in a direction to a middle area of the carrier, and a thickness of the glue layer increases at least partially from the outer rim in the direction to the middle area of the carrier.

Abstract: An optoelectronic device includes a carrier, a housing, and a radiation source that emits electromagnetic radiation arranged on the carrier, wherein the housing is fixed to the carrier by a glue layer, the glue layer is arranged between a first face of the housing and a second face of the carrier, the first face of the housing and the second face of the carrier are arranged at an inclination angle to each other, a distance between the first face and the second face increases from an outer rim in a direction to a middle area of the carrier, and a thickness of the glue layer increases at least partially from the outer rim in the direction to the middle area of the carrier.

Abstract: A light emitter with a radiation exit surface including a housing part with a receptacle, at least one organic optoelectronic device, arranged in the receptacle, and at least one cover part joined to the housing part, wherein the device is mounted between the cover part and the housing part.

Abstract: A light emitter with a radiation exit surface including a housing part with a receptacle, at least one organic optoelectronic device, arranged in the receptacle, and at least one cover part joined to the housing part, wherein the device is mounted between the cover part and the housing part.

Abstract: A radiation emitting device includes a substrate and a layer sequence disposed on top of the substrate. The layer sequence includes a first electrode surface with a first contact for applying a voltage, at least one functional layer that emits radiation during operation, and a second electrode surface. In the layer sequence, a plurality of partial regions is present that is modified in such a way that the emission of radiation visible to an external observer therefrom is interrupted. The distribution density of these partial regions can vary depending on their distance from the contact.

Abstract: A radiation emitting device includes a substrate and a layer sequence disposed on top of the substrate. The layer sequence includes a first electrode surface with a first contact for applying a voltage, at least one functional layer that emits radiation during operation, and a second electrode surface. In the layer sequence, a plurality of partial regions is present that is modified in such a way that the emission of radiation visible to an external observer therefrom is interrupted. The distribution density of these partial regions can vary depending on their distance from the contact.

Abstract: The invention relates to a radiation emitting device, with a substrate (100) and a layer sequence disposed on top of it. Said layer sequence comprises a first electrode surface (200) with a first contact (210) for applying a voltage, at least one functional layer (300), which emits radiation during operation, and a second electrode surface (400). In the layer sequence, a plurality of partial regions is present that is modified in such a way that the emission of radiation visible to an external observer therefrom is interrupted. The distribution density of these partial regions varies depending on their distance from the contact.

Abstract: The invention relates to a radiation emitting device, with a substrate (100) and a layer sequence disposed on top of it. Said layer sequence comprises a first electrode surface (200) with a first contact (210) for applying a voltage, at least one functional layer (300), which emits radiation during operation, and a second electrode surface (400). In the layer sequence, a plurality of partial regions is present that is modified in such a way that the emission of radiation visible to an external observer therefrom is interrupted. The distribution density of these partial regions varies depending on their distance from the contact.