Abstract: In a method of forming a pattern using a composition for removing photoresist, a layer is formed on a substrate, and then a photoresist pattern is formed on the layer. A portion of the layer exposed by the photoresist pattern is etched using the photoresist pattern as an etching mask to form the pattern on the substrate. Then, the photoresist pattern is removed using the composition including hydroxylamine, an alkanolamine-based compound, a morpholine-based compound, a polar solvent, a corrosion preventing agent, and water. The composition may effectively remove a photoresist pattern and etched residues without damaging the substrate and/or the pattern including metal, nitride, oxide and/or metal nitride.

Abstract: In a method of forming a pattern using a composition for removing photoresist, a layer is formed on a substrate, and then a photoresist pattern is formed on the layer. A portion of the layer exposed by the photoresist pattern is etched using the photoresist pattern as an etching mask to form the pattern on the substrate. Then, the photoresist pattern is removed using the composition including hydroxylamine, an alkanolamine-based compound, a morpholine-based compound, a polar solvent, a corrosion preventing agent, and water. The composition may effectively remove a photoresist pattern and etched residues without damaging the substrate and/or the pattern including metal, nitride, oxide and/or metal nitride.

Abstract: A waste gas treatment system treats waste gases of the type produced during the manufacture of semiconductor devices and therefore having different chemical characteristics. Based on the size of the particles of the waste gases, a gas separation unit discriminates waste gas that is best-suited for wet treatment from waste gas best-suited for dry treatment. A wet treatment unit is connected to one outlet of the gas separation unit, and a dry treatment unit is connected to another outlet of the gas separation unit. On the other hand, both the wet treatment unit and the dry treatment unit are connected to a water spray unit. The water spray unit treats the waste gases, which have passed through either the wet treatment unit or the dry treatment unit, so as to treat the waste gas for untreated water-soluble components.