Abstract: A method of fabricating a self-aligned vertical combdrive is described. The method includes the steps of etching in a semiconductor wafer a first comb with a coarse set of teeth. A second semiconductor wafer is bonded to the first set of teeth. A set of accurately positioned teeth is etched in the second wafer with teeth overlapping the teeth in the first comb. The lower teeth are etched using the overlapping teeth as a mask to assure proper alignment. One variation in this fabrication method whereby the first coarse comb teeth are etched on semiconductor-on-insulator instead, allows creation of double-sided comb actuators with increased torsional deflection range. Another variation to this fabrication method that keeps the electrically isolated upper masking teeth allows creation of dual-mode vertical comb actuators after an initial assembly step.