Patents by Inventor Soma TODA

Soma TODA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11841600
    Abstract: A wavelength conversion element according to the present disclosure includes: a wavelength conversion layer; a first substrate; a second substrate; a first intermediate layer; and a second intermediate layer. A linear expansion coefficient of the first substrate is smaller than a linear expansion coefficient of the wavelength conversion layer. The linear expansion coefficient of the wavelength conversion layer is smaller than a linear expansion coefficient of the second substrate. The linear expansion coefficient of the first substrate is smaller than the linear expansion coefficient of the second substrate. A thermal conductivity of the first substrate is larger than a thermal conductivity of the wavelength conversion layer. A thermal conductivity of the second substrate is larger than the thermal conductivity of the wavelength conversion layer.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: December 12, 2023
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Wataru Yasumatsu, Soma Toda
  • Publication number: 20210286245
    Abstract: A wavelength conversion element according to the present disclosure includes: a wavelength conversion layer; a first substrate; a second substrate; a first intermediate layer; and a second intermediate layer. A linear expansion coefficient of the first substrate is smaller than a linear expansion coefficient of the wavelength conversion layer. The linear expansion coefficient of the wavelength conversion layer is smaller than a linear expansion coefficient of the second substrate. The linear expansion coefficient of the first substrate is smaller than the linear expansion coefficient of the second substrate. A thermal conductivity of the first substrate is larger than a thermal conductivity of the wavelength conversion layer. A thermal conductivity of the second substrate is larger than the thermal conductivity of the wavelength conversion layer.
    Type: Application
    Filed: March 11, 2021
    Publication date: September 16, 2021
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Wataru YASUMATSU, Soma TODA