Abstract: Integrated circuit structures having backside power delivery for multi-height standard cell circuits are described. In an example, an integrated circuit structure includes a front-side structure including a device layer including a first cell separated from a second cell by a cell boundary, and a metallization layer immediately above the device layer. A track of the metallization layer is along the cell boundary from a plan view perspective. A backside structure is below the device layer. The backside structure provides power to the device layer.