Patents by Inventor Somchai Nondhasittichai

Somchai Nondhasittichai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame land grid array
    Patent number: 8648474
    Abstract: A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: February 11, 2014
    Assignee: UTAC Thai Limited
    Inventors: Somchai Nondhasittichai, Saravuth Sirinorakul
  • LEAD FRAME LAND GRID ARRAY
    Publication number: 20130234307
    Abstract: A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.
    Type: Application
    Filed: September 4, 2012
    Publication date: September 12, 2013
    Applicant: UTAC THAI LIMITED
    Inventors: Somchai Nondhasittichai, Saravuth Sirinorakul
  • Lead frame land grid array
    Patent number: 8310060
    Abstract: A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: November 13, 2012
    Assignee: Utac Thai Limited
    Inventors: Somchai Nondhasittichai, Saravuth Sirinorakul