Patents by Inventor Somnuk Akkahadsi

Somnuk Akkahadsi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7361976
    Abstract: In a lead-frame configuration (60), a module (70) and a data carrier (72), two connecting plates (12, 13) of the module (70), which are each intended for connection to a connecting contact or bump (47, 48) of a chip (41), are connected to a reinforcement film (66, 71) formed from a fiber-reinforced film of plastics material by means of a layer (73) of an adhesive that is particularly well suited to transmitting shear forces, in which case there is additionally provided in an advantageous further embodiment, on the reinforcement film (66, 71), at least one further layer (74, 75, 76) that is able to serve for protecting, damping or fastening purposes.
    Type: Grant
    Filed: October 31, 2003
    Date of Patent: April 22, 2008
    Assignee: NXP B.V.
    Inventors: Reinhard Fritz, Peter Schmallegger, Somnuk Akkahadsi