Patents by Inventor Son K. Tran
Son K. Tran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7408264Abstract: An electronic fabrication process and structure is provided for attaching discrete passive surface mount devices (SMD) to a substrate in a single step. A liquid noflow resin encapsulant containing flux material is dispensed between presoldered pads on a substrate. The SMD, having a pair of electrical contacts, is pressed into said encapsulant so that the electrical contacts make contact with said presoldered pads. Heat is applied to first activate said flux material and then reflow the solder on said presoldered pads to bond said SMD contacts to said presoldered pads. The reflow temperature is maintained for about 180 seconds during which time the resin solidifies. The resin encapsulant fills the space between substrate and SMD and forms fillets around the solder bonded contacts.Type: GrantFiled: August 2, 2006Date of Patent: August 5, 2008Assignee: International Business Machines CorporationInventors: Clément J. Fortin, Pierre M. Langevin, Son K. Tran, Michael B. Vincent
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Patent number: 7119003Abstract: A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.Type: GrantFiled: June 8, 2005Date of Patent: October 10, 2006Assignee: International Business Machines CorporationInventors: William E. Bernier, Charles F. Carey, Eberhard B. Gramatzki, Thomas R. Homa, Eric A. Johnson, Pierre Langevin, Irving Memis, Son K. Tran, Robert F. White
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Patent number: 7109592Abstract: An electronic fabrication process and structure is provided for attaching discrete passive surface mount devices (SMD) to a substrate in a single step. A liquid noflow resin encapsulant containing flux material is dispensed between presoldered pads on a substrate. The SMD, having a pair of electrical contacts, is pressed into said encapsulant so that the electrical contacts make contact with said presoldered pads. Heat is applied to first activate said flux material and then reflow the solder on said presoldered pads to bond said SMD contacts to said presoldered pads. The reflow temperature is maintained for about 180 seconds during which time the resin solidifies. The resin encapsulant fills the space between substrate and SMD and forms fillets around the solder bonded contacts.Type: GrantFiled: March 23, 2004Date of Patent: September 19, 2006Assignee: International Business Machines CorporationInventors: Clément J. Fortin, Pierre M. Langevin, Son K. Tran, Michael B. Vincent
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Patent number: 7067916Abstract: A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.Type: GrantFiled: June 20, 2001Date of Patent: June 27, 2006Assignee: International Business Machines CorporationInventors: William E. Bernier, Charles F. Carey, Eberhard B. Gramatzki, Thomas R. Homa, Eric A. Johnson, Pierre Langevin, Irving Memis, Son K. Tran, Robert F. White
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Publication number: 20040180469Abstract: An electronic fabrication process and structure is provided for attaching discrete passive surface mount devices (SMD) to a substrate in a single step. A liquid noflow resin encapsulant containing flux material is dispensed between presoldered pads on a substrate. The SMD, having a pair of electrical contacts, is pressed into said encapsulant so that the electrical contacts make contact with said presoldered pads. Heat is applied to first activate said flux material and then reflow the solder on said presoldered pads to bond said SMD contacts to said presoldered pads. The reflow temperature is maintained for about 180 seconds during which time the resin solidifies. The resin encapsulant fills the space between substrate and SMD and forms fillets around the solder bonded contacts.Type: ApplicationFiled: March 23, 2004Publication date: September 16, 2004Inventors: Clement J. Fortin, Pierre M. Langevin, Son K. Tran, Michael B. Vincent
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Patent number: 6777817Abstract: Reworkable thermally conductive adhesive composition including a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.Type: GrantFiled: September 5, 2003Date of Patent: August 17, 2004Assignee: International Business Machines CorporationInventors: Stephen Buchwalter, Michael Anthony Gaynes, Nancy C. LaBianca, Stefano Sergio Oggioni, Son K. Tran
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Patent number: 6739497Abstract: An electronic fabrication process and structure is provided for attaching discrete passive surface mount devices (SMD) to a substrate in a single step. A liquid noflow resin encapsulant containing flux material is dispensed between presoldered pads on a substrate. The SMD, having a pair of electrical contacts, is pressed into said encapsulant so that the electrical contacts make contact with said presoldered pads. Heat is applied to first activate said flux material and then reflow the solder on said presoldered pads to bond said SMD contacts to said presoldered pads. The reflow temperature is maintained for about 180 seconds during which time the resin solidifies. The resin encapsulant fills the space between substrate and SMD and forms fillets around the solder bonded contacts.Type: GrantFiled: May 13, 2002Date of Patent: May 25, 2004Assignee: International Busines Machines CorporationInventors: Clément J. Fortin, Pierre M. Langevin, Son K. Tran, Michael B. Vincent
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Patent number: 6713858Abstract: An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material.Type: GrantFiled: March 31, 2003Date of Patent: March 30, 2004Assignee: International Business Machines CorporationInventors: Ramesh R. Kodnani, Luis J. Matienzo, Son K. Tran
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Publication number: 20040041280Abstract: Reworkable thermally conductive adhesive composition comprising a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.Type: ApplicationFiled: September 5, 2003Publication date: March 4, 2004Applicant: International Business Machines CorporationInventors: Stephen L. Buchwalter, Michael Anthony Gaynes, Nancy C. LaBianca, Stefano Sergio Oggioni, Son K. Tran
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Publication number: 20030209590Abstract: An electronic fabrication process and structure is provided for attaching discrete passive surface mount devices (SMD) to a substrate in a single step. A liquid noflow resin encapsulant containing flux material is dispensed between presoldered pads on a substrate. The SMD, having a pair of electrical contacts, is pressed into said encapsulant so that the electrical contacts make contact with said presoldered pads. Heat is applied to first activate said flux material and then reflow the solder on said presoldered pads to bond said SMD contacts to said presoldered pads. The reflow temperature is maintained for about 180 seconds during which time the resin solidifies. The resin encapsulant fills the space between substrate and SMD and forms fillets around the solder bonded contacts.Type: ApplicationFiled: May 13, 2002Publication date: November 13, 2003Applicant: International Business Machines CorporationInventors: Clement J. Fortin, Pierre M. Langevin, Son K. Tran, Michael B. Vincent
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Publication number: 20030203535Abstract: An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material.Type: ApplicationFiled: March 31, 2003Publication date: October 30, 2003Applicant: International Business Machines CorporationInventors: Ramesh R. Kodnani, Luis J. Matienzo, Son K. Tran
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Patent number: 6617698Abstract: Reworkable thermally conductive adhesive composition comprising a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.Type: GrantFiled: March 9, 2001Date of Patent: September 9, 2003Assignee: International Business Machines CorporationInventors: Stephen Buchwalter, Michael Anthony Gaynes, Nancy C. LaBianca, Stefano Sergio Oggioni, Son K. Tran
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Patent number: 6596559Abstract: An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material.Type: GrantFiled: March 30, 2001Date of Patent: July 22, 2003Assignee: International Business Machines CorporationInventors: Ramesh R. Kodnani, Luis J. Matienzo, Son K. Tran
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Patent number: 6558981Abstract: An encapsulated semiconductor chip module. The chip module has the overlying encapsulant adhered directly and integrally to bare portions of the substrate to which the chip is mounted. This configuration enhances the adhesion and inhibits unintended delamination of the encapsulant from the balance of the module. The module is made by patterning anchor openings into the solder mask. The anchor openings expose corresponding portions of the substrate. It is important to locate the anchor openings over parts of the substrate that do not have circuitry on them, that is, on bare portions, so as to avoid corrosion or contamination of the circuit connections.Type: GrantFiled: May 3, 2001Date of Patent: May 6, 2003Assignee: International Business Machines CorporationInventors: Miguel A. Jimarez, Marybeth Perrino, Son K. Tran, Tien Y. Wu
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Publication number: 20020195707Abstract: A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.Type: ApplicationFiled: June 20, 2001Publication date: December 26, 2002Applicant: International Business machines CorporationInventors: William E. Bernier, Charles F. Carey, Eberhard B. Gramatzki, Thomas R. Homa, Eric A. Johnson, Pierre Langevin, Irving Memis, Son K. Tran, Robert F. White
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Publication number: 20020171132Abstract: Reworkable thermally conductive adhesive composition comprising a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.Type: ApplicationFiled: March 9, 2001Publication date: November 21, 2002Applicant: International Business Machines CorporationInventors: Stephen Buchwalter, Michael Anthony Gaynes, Nancy C. LaBianca, Stefano Sergio Oggioni, Son K. Tran
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Patent number: 6348738Abstract: A method for forming a flip-chip-on-board assembly. An integrated circuit (IC) chip having a polyimide passivation layer is joined to a chip carrier via a plurality of solder bumps which electrically connect a plurality of contact pads on the IC chip to corresponding contacts on the chip carrier. A space is formed between a surface of the passivation layer and a surface of the chip carrier. A plasma is applied, to chemically modify the surface of the chip carrier and the passivation layer of the IC chip substantially without roughening the surface of the passivation layer. The plasma is either an O2 plasma or a microwave-generated Ar and N2O plasma. An underfill encapsulant material is applied to fill the space. The plasma treatment may be performed after the step of joining. Then, the chip and chip carrier are treated with the plasma simultaneously. Alternatively, the IC chip and chip carrier may be treated with the plasma before they are joined to one another.Type: GrantFiled: August 11, 1999Date of Patent: February 19, 2002Assignee: International Business Machines CorporationInventors: Jean Dery, Frank D. Egitto, Luis J. Matienzo, Charles Ouellet, Luc Ouellet, David L. Questad, William J. Rudik, Son K. Tran
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Patent number: 6306683Abstract: A method for forming a flip-chip-on-board assembly. An integrated circuit (IC) chip having a polyimide passivation layer is joined to a chip carrier via a plurality of solder bumps which electrically connect a plurality of contact pads on the IC chip to corresponding contacts on the chip carrier. A space is formed between a surface of the passivation layer and a surface of the chip carrier. A plasma is applied, to chemically modify the surface of the chip carrier and the passivation layer of the IC chip substantially without roughening the surface of the passivation layer. The plasma is either an O2 plasma or a microwave-generated Ar and N2O plasma. An underfill encapsulant material is applied to fill the space. The plasma treatment may be performed after the step of joining. Then, the chip and chip carrier are treated with the plasma simultaneously. Alternatively, the IC chip and chip carrier may be treat with the plasma before they are joined to one another.Type: GrantFiled: March 16, 2000Date of Patent: October 23, 2001Assignee: International Business Machines CorporationInventors: Jean Dery, Frank D. Egitto, Luis J. Matienzo, Charles Ouellet, Luc Ouellet, David L. Questad, William J. Rudik, Son K. Tran
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Publication number: 20010026959Abstract: An encapsulated semiconductor chip module. The chip module has the overlying encapsulant adhered directly and integrally to bare portions of the substrate to which the chip is mounted. This configuration enhances the adhesion and inhibits unintended delamination of the encapsulant from the balance of the module. The module is made by patterning anchor openings into the solder mask. The anchor openings expose corresponding portions of the substrate. It is important to locate the anchor openings over parts of the substrate that do not have circuitry on them, that is, on bare portions, so as to avoid corrosion or contamination of the circuit connections.Type: ApplicationFiled: May 3, 2001Publication date: October 4, 2001Inventors: Miguel A. Jimarez, Marybeth Perrino, Son K. Tran, Tien Y. Wu
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Publication number: 20010012642Abstract: An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material.Type: ApplicationFiled: March 30, 2001Publication date: August 9, 2001Applicant: International Business Machines CorporationInventors: Ramesh R. Kodnani, Luis J. Matienzo, Son K. Tran