Patents by Inventor Son Ky Quan

Son Ky Quan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and method therefor
    Patent number: 7927927
    Abstract: A semiconductor package substrate (11) has an array of package sites (13, 14, 16, and 21) that are substantially identical. The entire array of package sites (13, 14, 16, and 21) is covered by an encapsulant (19). The individual package sites (13, 14, 16, and 21) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (11).
    Type: Grant
    Filed: August 13, 2001
    Date of Patent: April 19, 2011
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Son Ky Quan, Samuel L. Coffman, Bruce Reid, Keith E. Nelson, Deborah A. Hagen
  • Semiconductor package and method therefor
    Publication number: 20020053452
    Abstract: A semiconductor package substrate (10) has an array of package sites (13,14,16,21,22, and 23) that are substantially identical. The entire array of package sites (13,14,16,21,22, and 23) is covered by an encapsulant (19). The individual package sites (13,14,16,21,22, and 23) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (10).
    Type: Application
    Filed: August 13, 2001
    Publication date: May 9, 2002
    Inventors: Son Ky Quan, Samuel L. Coffman, Bruce Reid, Keith E. Nelson, Deborah A. Hagen
  • Semiconductor package and method thereof
    Patent number: 5776798
    Abstract: A semiconductor package substrate (10) has an array of package sites (13,14,16,21,22, and 23) that are substantially identical. The entire array of package sites (13,14,16,21,22, and 23) is covered by an encapsulant (19). The individual package sites (13,14,16,21,22, and 23) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (10).
    Type: Grant
    Filed: September 4, 1996
    Date of Patent: July 7, 1998
    Assignee: Motorola, Inc.
    Inventors: Son Ky Quan, Samuel L. Coffman, Bruce Reid, Keith E. Nelson, Deborah A. Hagen