Abstract: A probe sanding fixture includes a base, a probe adapter including a probe guide defining one or more channels defined therein, and a sander tool including a sanding wheel and a gauge pin configured to process one or more probes positioned in the channels. The probe adapter is coupleable to the base such that the channels are extendable generally along a first axis. The sander tool is coupled to the base such that the sander tools is translatable along a second axis and rotatable about the first axis.

Abstract: A probe sanding fixture includes a base, a probe adapter including a probe guide defining one or more channels defined therein, and a sander tool including a sanding wheel and a gauge pin configured to process one or more probes positioned in the channels. The probe adapter is coupleable to the base such that the channels are extendable generally along a first axis. The sander tool is coupled to the base such that the sander tools is translatable along a second axis and rotatable about the first axis.

Abstract: A probe head assembly for testing a device under test includes a plurality of test probes and a probe head structure. The probe head structure includes a guide plate and a template and supports a plurality of test probes that each includes a tip portion with a tip end for making electrical contact with a device under test, a curved compliant body portion and a tail portion with a tail end for making electrical contact with the space transformer. Embodiments of the invention include offsetting the position of the tail portions of the test probes with respect to the tip portions of the test probes so that the tip portions of the test probes are biased within the apertures of the guide plate, using hard stop features to help maintain the position of the test probes with respect to the guide plate and probe ramp features to improve scrubbing behavior.

Abstract: A probe head assembly for testing a device under test includes a plurality of test probes and a probe head structure. The probe head structure includes a guide plate and a template and supports a plurality of test probes that each includes a tip portion with a tip end for making electrical contact with a device under test, a curved compliant body portion and a tail portion with a tail end for making electrical contact with the space transformer. Embodiments of the invention include offsetting the position of the tail portions of the test probes with respect to the tip portions of the test probes so that the tip portions of the test probes are biased within the apertures of the guide plate, using hard stop features to help maintain the position of the test probes with respect to the guide plate and probe ramp features to improve scrubbing behavior.

Abstract: A method and apparatus for a flattened probe element wire is provided. A probe element wire includes a beam portion and a tip portion. At least a part of the tip portion is flattened. Flattened probe element wires may have greater z-direction height strength, thereby increasing maximum probe element wire z-direction vertical force. Flattened probe element wires may also have decreased variability in the flattened probe element wire tips. A probe card assembly may includes a substrate and a plurality of at least partially flattened probe element wires supported by the substrate. Such probe card assemblies may have an extended life and maintained within design parameters for a longer period of use.

Abstract: A probe card assembly includes a substrate and a plurality of probes bonded to a surface of the substrate. The probe card assembly also includes a reinforcing layer provided on the surface of the substrate. The reinforcing layer is in contact with a lower portion of each of the probes, where a remaining portion of each of the probes is free from the reinforcing layer. The reinforcing layer may be a composite reinforcing layer that includes multiple layers of material to achieve a particular result. According to one embodiment of the invention, the reinforcing layer includes a powder layer disposed on the substrate and an adhesive layer formed on the powder layer. The composite reinforcing layer may be compliant to allow the probes to flex and move as intended, without limiting deflection capability. The composite reinforcing layer may be removable to allow access to probes for repair.

Abstract: A method and apparatus for a flattened probe element wire is provided. A probe element wire comprises a beam portion and a tip portion. At least a part of the tip portion is flattened. Flattened probe element wires may have greater z-direction height strength, thereby increasing maximum probe element wire z-direction vertical force. Flattened probe element wires may also have decreased variability in the flattened probe element wire tips. A probe card assembly may comprise a substrate and a plurality of at least partially flattened probe element wires supported by the substrate. Such probe card assemblies may have an extended life and maintained within design parameters for a longer period of use.

Abstract: Probe testing of an integrated circuit so as to achieve low probe needle contact resistance without probe needles “scrubbing” against bonding pads is achieved at high test signal frequencies by a probe needle assembly (14) including a plurality of probe needles (13) each having a shank portion (13A), a curved flex portion (13B), and a contact tip (13C) on a free end of the flex portion, the shank portion (13A) being electrically coupled to an electrical test system. The shank portion (13A) of each probe needle is attached to a surface (16A) of an insulative layer (16). The insulative layer is supported on a ground plane conductor 25. The flex portions (13B) of the probe needles (13) extend beyond an edge of the insulative layer. A portion (24) of the ground plane conductor (25) extends beyond the insulator (16) and is adjacent to all but an extending tip portion (30) of the flex portion (13B) of each probe needle (13).