Patents by Inventor Son Nam Doan

Son Nam Doan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9393914
    Abstract: One disclosed aspect of the embodiments is an apparatus to hold a mobile device in a vehicle. A sleeve is stretchable to fit longitudinally along a sun visor of a vehicle and having front and back surfaces. The front surface has a vent structure. A first strap is transversely attached on the front surface at a first side of the vent structure to hold a first end of a first device. A second strap is transversely attached on the front surface at a second side of the vent structure to adjustably hold a second end of the first device. The second side is opposite to the first side across the vent structure.
    Type: Grant
    Filed: August 17, 2013
    Date of Patent: July 19, 2016
    Inventors: Son Nam Doan, Nick Ngoc Nguyen
  • Publication number: 20150048643
    Abstract: One disclosed aspect of the embodiments is an apparatus to hold a mobile device in a vehicle. A sleeve is stretchable to fit longitudinally along a sun visor of a vehicle and having front and back surfaces. The front surface has a vent structure. A first strap is transversely attached on the front surface at a first side of the vent structure to hold a first end of a first device. A second strap is transversely attached on the front surface at a second side of the vent structure to adjustably hold a second end of the first device. The second side is opposite to the first side across the vent structure.
    Type: Application
    Filed: August 17, 2013
    Publication date: February 19, 2015
    Applicant: GOUGAH PRODUCTS LLC
    Inventors: Son Nam Doan, Nick Ngoc Nguyen
  • Patent number: 6011690
    Abstract: A PC card comprising a housing including top and bottom cover panels encloses at least one heat-generating circuit component, typically an IC device or package. A heat spreading element, which may be in the form of a copper sheet, is disposed in conduction heat transfer relationship with the at least one circuit component and at least one of the housing covers, the heat spreading element being adapted to receive heat from the at least one circuit component, to spread the heat uniformly and to transfer it to the at least one housing cover panel. From there, the heat is dissipated into the surrounding environment.
    Type: Grant
    Filed: June 23, 1997
    Date of Patent: January 4, 2000
    Assignee: Xircom, Inc.
    Inventors: James G. Hughes, John N. Otey, Son Nam Doan