Abstract: In one embodiment of the present invention, an integral lid assembly (10) for sealing a substrate processing chamber includes first (16) and third (12) plates fixedly fused to a second plate (14) positioned therebetween. The first and second plates define a coolant passage (110) or channel therein, and the second and third plates define a gas delivery channel(s) (146, 148) therein. The first plate has a substantially planar surface for coupling to a processing chamber, and the third plate has a substantially planar surface for coupling to a microwave generation device or a remote plasma clean device (106). In this manner, the lid assembly is compact in size, and facilitates the mounting of a microwave device closer to the chamber than for bulkier lid assemblies. In another embodiment, gas passages (232) through the brazed lid assembly (200) are coupled to the processing chamber (310), and are configured to provide the desired gas distribution thereto for exemplary processes.

Abstract: A substrate support having a removable edge ring, which is made of a material having a lower coefficient of thermal expansion (CTE), than that of the substrate support is provided. The edge ring and the substrate support are configured for pin and slot coupling. Specifically, either the edge ring, or the substrate support comprises a plurality of pins, and the other of the edge ring or the substrate support comprises a plurality of hollow regions or slots in which the pins may be inserted. The slots are at least as wide as a corresponding one of the plurality of pins and extend in the direction in which the substrate support expands and contracts during thermal cycling. Each of the slots extends a length which is sufficient to compensate for the difference between the CTE of the substrate support and the CTE of the edge ring, over the range of process temperatures to which the apparatus is exposed. Preferably the susceptor is made of aluminum, and the edge ring is made of ceramic.