Abstract: The present invention discloses a cutting method of a liquid crystal panel, comprising: providing a control device, an image identification device and a knife, and the substrate has respective cutting positions of the knife in a first cutting direction, and the control device is preset with cutting position information of the respective cutting positions; setting a reference alignment mark on the substrate, and the reference alignment mark is positioned between two adjacent cutting positions; capturing the reference alignment mark with the image identification device, and generating reference position information indicating the reference alignment mark; controlling the knife to move to the respective cutting positions in sequence and to cut with the control device according to the reference position information and the cutting position information. The cutting method provided by the present invention can simplify the cutting process and raise the cutting efficiency.

Abstract: A method and an apparatus are provided for distributing glass substrates. The method includes: utilizing a first robot arm to pick up a first substrate and put the first substrate on a first conveyor belt; utilizing a second robot arm to pick up the first substrate and put the first substrate on a second production line; utilizing a third robot arm to pick up a second substrate and put the second substrate on a second conveyor belt; utilizing a fourth robot arm to pick up the second substrate and put the second substrate on a first production line. The first production line and the second production line are positioned side by side, and the first conveyor belt and the second conveyor belt are positioned between the first production line and the second production line. The method simplifies distribution and raises the efficiency.

Abstract: The present invention discloses a cutting method of a liquid crystal panel, comprising: providing a control device, an image identification device and a knife, and the substrate has respective cutting positions of the knife in a first cutting direction, and the control device is preset with cutting position information of the respective cutting positions; setting a reference alignment mark on the substrate, and the reference alignment mark is positioned between two adjacent cutting positions; capturing the reference alignment mark with the image identification device, and generating reference position information indicating the reference alignment mark; controlling the knife to move to the respective cutting positions in sequence and to cut with the control device according to the reference position information and the cutting position information. The cutting method provided by the present invention can simplify the cutting process and raise the cutting efficiency.

Abstract: The present disclosure proposes a method for distributing glass substrates. The method includes: utilizing a first robot arm to pick up a first substrate and put the first substrate on a first conveyor belt; utilizing a second robot arm to pick up the first substrate and put the first substrate on a second production line; utilizing a third robot arm to pick up a second substrate and put the second substrate on a second conveyor belt; utilizing a fourth robot arm to pick up the second substrate and put the second substrate on a first production line. The first production line and the second production line are positioned side by side, and the first conveyor belt and the second conveyor belt are positioned between the first production line and the second production line. The method simplifies distribution and raises the efficiency.