Abstract: The present invention provides a method for manufacturing a closed impeller that has a simple configuration and enables fusion in a very accurate position. The method includes: forming a frustum-shaped front plate and a disk-shaped base plate formed therebelow, upper surfaces of a plurality of unit impeller blade plates made from a synthetic resin extending in radial directions which are formed as impeller blade tip surfaces, with sharp-pointed ridge-like protrusions having an acute upper end and a width less than a width of the impeller blade tip surface being integrally formed on the impeller blade tip surfaces. In the method, an inner surface of the front plate and the plurality of impeller blade tip surfaces are formed as parts of conical surfaces and formed so that the cone apex angles of the two conical surfaces are equal to each other.

Abstract: A present invention's object is to maintain a discharge performance by making a discharge flow rate constant in a low rotation region of an engine rotation speed and to reduce the discharge flow rate in a high rotation region. The present invention consists of a housing case, an impeller base provided with plural holes and plural elliptical elongated holes, a vane body provided with a rotary shaft on an inner peripheral side and a rocking shaft on an outer peripheral side, a plate cam in which an elongated groove is formed on an outer peripheral side of a disc portion and a single torsion spring. The spring and the plate cam are housed in the housing case and the impeller base. The rotary shaft is inserted rotatably into the holes, and the rocking shaft is movably inserted into the elliptical elongated holes and the elongated groove.

Abstract: A present invention's object is to maintain a discharge performance by making a discharge flow rate constant in a low rotation region of an engine rotation speed and to reduce the discharge flow rate in a high rotation region. The present invention consists of a housing case, an impeller base provided with plural holes and plural elliptical elongated holes, a vane body provided with a rotary shaft on an inner peripheral side and a rocking shaft on an outer peripheral side, a plate cam in which an elongated groove is formed on an outer peripheral side of a disc portion and a single torsion spring. The spring and the plate cam are housed in the housing case and the impeller base. The rotary shaft is inserted rotatably into the holes, and the rocking shaft is movably inserted into the elliptical elongated holes and the elongated groove.

Abstract: The present invention provides a method for manufacturing a closed impeller that has a simple configuration and enables fusion in a very accurate position. The method includes: forming a frustum-shaped front plate and a disk-shaped base plate formed therebelow, upper surfaces of a plurality of unit impeller blade plates made from a synthetic resin extending in radial directions which are formed as impeller blade tip surfaces, with sharp-pointed ridge-like protrusions having an acute upper end and a width less than a width of the impeller blade tip surface being integrally formed on the impeller blade tip surfaces. In the method, an inner surface of the front plate and the plurality of impeller blade tip surfaces are formed as parts of conical surfaces and formed so that the cone apex angles of the two conical surfaces are equal to each other.

Abstract: A method for fabricating a stacked chip package comprises the steps of: (a) attaching a first semiconductor chip to an upper surface of a substrate through a first adhesive layer; (b) partially curing the first adhesive layer such that it gels but does not harden; (c) attaching a second semiconductor chip to the first semiconductor chip through a second adhesive layer; (d) curing the first and second adhesive layer; (e) electrically coupling the first and second semiconductor chips to a structure for making external electrical connection provided on the substrate; and (f) forming a package body over the first semiconductor chip, the second semiconductor chip, and a portion of the upper surface of the substrate. Since the first and second adhesive layers may be cured in one single step, the cycle time may be reduced thereby cutting down the production cost.

Abstract: A method for fabricating a stacked chip package comprises the steps of: (a) attaching a first semiconductor chip to an upper surface of a substrate through a first adhesive layer; (b) partially curing the first adhesive layer such that it gels but does not harden; (c) attaching a second semiconductor chip to the first semiconductor chip through a second adhesive layer; (d) curing the first and second adhesive layer; (e) electrically coupling the first and second semiconductor chips to a structure for making external electrical connection provided on the substrate; and (f) forming a package body over the first semiconductor chip, the second semiconductor chip, and a portion of the upper surface of the substrate. Since the first and second adhesive layers may be cured in one single step, the cycle time may be reduced thereby cutting down the production cost.

Abstract: A method for fabricating a stacked chip package comprises the steps of: (a) attaching a first semiconductor chip to an upper surface, of a substrate through a first adhesive layer; (b) partially curing the first adhesive layer such that it gels but does not harden; (c) attaching a second semiconductor chip to the first semiconductor chip through a second adhesive layer; (d) curing the first and second adhesive layer; (e) electrically coupling the first and second semiconductor chips to a structure for making external electrical connection provided on the substrate; and (f) forming a package body over the first semiconductor chip, the second semiconductor chip, and a portion of the upper surface of the substrate. Since the first and second adhesive layers may be cured in one single step the cycle time may be reduced thereby cutting down the production cost.