Patents by Inventor Song Hee Yim

Song Hee Yim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-Free Solder Alloy Composition Suitable for Use in High-Temperature and Vibration Environments and Preparation Method Thereof
    Publication number: 20200238443
    Abstract: The present disclosure relates to a lead-free solder alloy composition in which a nanosized ceramic powder additive is added to a lead-free solder alloy of Sn—Cu—Bi, Sn—Ag—Bi or Sn—Ag—Cu—Bi, and a method for preparing the same.
    Type: Application
    Filed: January 23, 2020
    Publication date: July 30, 2020
    Inventors: Heung Rak SOHN, Bum Gyu BAEK, Song Hee YIM, Jun Tae KIM
  • Lead-free solder alloy composition and method for preparing lead-free solder alloy
    Patent number: 10286498
    Abstract: This invention relates to a lead-free solder alloy composition and a method of preparing a lead-free solder alloy, wherein the lead-free solder alloy composition includes a ceramic powder added to a lead-free solder of Sn-(0.1 to 2) wt % Cu, Sn-(0.5 to 5) wt % Ag, or Sn-(0.1 to 2) wt % Cu-(0.5 to 5) wt % Ag. According to this invention, a novel lead-free solder alloy, which functions as a replacement for a conventional lead-free solder, is provided, thus exhibiting superior spreadability, wettability, and mechanical properties than a conventional lead-free solder.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: May 14, 2019
    Assignee: KYUNG DONG ONE CORPORATION
    Inventors: Ashutosh Sharma, Jae Pil Jung, Jong Hyun Yoon, Bum Gyu Baek, Heung Rak Sohn, Song Hee Yim, Jong Hyuk Yoon
  • LEAD-FREE SOLDER ALLOY COMPOSITION AND METHOD FOR PREPARING LEAD-FREE SOLDER ALLOY
    Publication number: 20170225277
    Abstract: This invention relates to a lead-free solder alloy composition and a method of preparing a lead-free solder alloy, wherein the lead-free solder alloy composition includes a ceramic powder added to a lead-free solder of Sn-(0.1 to 2) wt % Cu, Sn-(0.5 to 5) wt % Ag, or Sn-(0.1 to 2) wt % Cu-(0.5 to 5) wt % Ag. According to this invention, a novel lead-free solder alloy, which functions as a replacement for a conventional lead-free solder, is provided, thus exhibiting superior spreadability, wettability, and mechanical properties than a conventional lead-free solder.
    Type: Application
    Filed: August 18, 2015
    Publication date: August 10, 2017
    Inventors: Ashutosh Sharma, Jae Pil Jung, Jong Hyun Yoon, Bum Gyu Baek, Heung Rak Sohn, Song Hee Yim, Jong Hyuk Yoon