Abstract: The structure of a semiconductor device with passivation layers on active regions of FET devices and a method of fabricating the semiconductor device are disclosed. The semiconductor device includes a substrate, first and second source/drain (S/D) regions disposed on the substrate, nanostructured channel regions disposed between the first and second S/D regions, a passivation layer, and a nanosheet (NS) structure wrapped around the nanostructured channel regions. Each of the S/D regions have a stack of first and second semiconductor layers arranged in an alternating configuration and an epitaxial region disposed on the stack of first and second semiconductor layers.

Abstract: A computer-readable medium storing a program for causing a computer to execute processing in one of stages of a supply chain, the processing including: obtaining, from an immediately upstream stage, a first cumulative value being from a most upstream stage to the immediately upstream stage and a first random number used to generate a first commitment obtained by concealing the first cumulative value; generating, based on the first random number, a link commitment obtained by concealing information indicating a relationship between the immediately upstream stage and the stage; calculating, based on the first cumulative value, a second cumulative value being from the most upstream stage to the stage; generating a proof indicating that the second cumulative value is calculated using the correct first cumulative value and that is a zero-knowledge proof based on the link commitment; and causing the link commitment and the proof to be recorded in a blockchain.

Abstract: A method for a computer to construct a test scenario and an information processing device are provided. The method for constructing a test scenario for a target application executed through a plurality of executable applications in distributed nodes in an asynchronous manner includes constructing an invocation relationship graph representing a plurality of functions included in the executable applications; determining, according to a code structure of each of the functions in the invocation relationship graph, one or more of a plurality of risk types which may cause an operation error for the function; traversing the invocation relationship graph to obtain possible function paths and determining, based on a plurality of risk types of functions in each of the possible function paths, risk types of the function path; and determining, according to the risk types of the function path, a type of a test scenario for the function path.

Abstract: A method including determining a first frequency for (i) a first track in a servo layer of a storage medium, or (ii) a first sector in the servo layer. The servo layer is dedicated to storing servo information. The method further includes: obtaining first address information addressing the first track or the first sector; modulating the first address information according to the first frequency; and storing the modulated first address information in the servo layer. Subsequent to the storing of the modulated first address information, the servo information includes the modulated first address information.

Abstract: Disclosed are rapid and reproducible methods for separating and purifying nucleic acids from paraffin-containing tissue samples. The disclosed methods involve a melting step, where paraffin-containing tissue samples are heated in the presence of a detergent, causing the paraffin to melt and tissue sample cells to lyse. From the resulting two-phase mixture (i.e., a paraffin phase and an aqueous phase), the aqueous phase is collected for purification of nucleic acid. Protease(s) can be used at one or more points in the separation process to facilitate tissue cell lysis and/or degrade proteins that could degrade nucleic acid or interfere with subsequent genetic manipulation or analysis.

Abstract: A method including determining a first frequency for (i) a first track in a servo layer of a storage medium, or (ii) a first sector in the servo layer. The servo layer is dedicated to storing servo information. The method further includes: obtaining first address information addressing the first track or the first sector; modulating the first address information according to the first frequency; and storing the modulated first address information in the servo layer. Subsequent to the storing of the modulated first address information, the servo information includes the modulated first address information.

Abstract: Disclosed are rapid and reproducible methods for separating and purifying nucleic acids from paraffin-containing tissue samples. The disclosed methods involve a melting step, where paraffin-containing tissue samples are heated in the presence of a detergent, causing the paraffin to melt and tissue sample cells to lyse. From the resulting two-phase mixture (i.e., a paraffin phase and an aqueous phase), the aqueous phase is collected for purification of nucleic acid. Protease(s) can be used at one or more points in the separation process to facilitate tissue cell lysis and/or degrade proteins that could degrade nucleic acid or interfere with subsequent genetic manipulation or analysis.

Abstract: According to embodiments of the present invention, a storage medium is provided. The storage medium includes a dedicated servo layer including a plurality of servo tracks, wherein at least one of the plurality of servo tracks includes a modulated address information including an address information being modulated by at least one frequency associated with the at least one of the plurality of servo tracks. According to further embodiments of the present invention, a modulator for a storage medium, a demodulator for a storage medium, a data storage device and a method of processing address information for a data storage device are also provided.

Abstract: According to embodiments of the present invention, a storage medium is provided. The storage medium includes a dedicated servo layer including a plurality of servo tracks, wherein at least one of the plurality of servo tracks includes a modulated address information including an address information being modulated by at least one frequency associated with the at least one of the plurality of servo tracks. According to further embodiments of the present invention, a modulator for a storage medium, a demodulator for a storage medium, a data storage device and a method of processing address information for a data storage device are also provided.

Abstract: A test kit and method includes amplification and extension primers that are selected to allow multiplex PCR and extension at increased specificity. Preferably, the extension primers include a tag that hybridizes with a capture probe on a biochip, wherein the tag is distinct from the target nucleic acid sequence to be analyzed. Further preferred kits include a biochip and various instructions.

Abstract: High yield, high reliability, flip-chip integrated circuit (IC) packages are achieved utilizing a combination of heat and pressure to bond flip-chip die and to cure no-flow underfill material. The underfill comprises a filler or low coefficient of thermal expansion (CTE) material to decrease CTE of the cured underfill. The filler material can be selected from the group comprising silica, silicon oxide, silicon dioxide, silicon nitride, aluminum oxide, aluminum nitride, or a mixture thereof. The filler material may also increase the viscosity of the uncured underfill and/or increase the modulus of elasticity of the cured underfill. In some method embodiments, a thermocompression bonder is used to simultaneously provide solder bump reflow and underfill curing. Application of various methods to a component package, an electronic assembly, and an electronic system are also described.

Abstract: A semiconductor package comprises a substrate that has a first protruding interconnect and a semiconductor die that has a second protruding interconnect that faces the first protruding interconnect. The package further comprises a spacer provided between the substrate and the die, wherein the spacer comprises a hole filled with liquid metal to couple the first protruding interconnect to the second protruding interconnect.

Abstract: A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that alone exhibits a CTE that is characteristic of an inorganic-filled underfill composite previously known. An embodiment is also directed to the assembly of a flip-chip package that uses an underfill mixture.

Abstract: A temperature sustaining flip chip process in which ILD cracking and delamination are lessened. A sequence of substrate prebake, underfill dispense, chip placement, solder reflow and underfill cure operative stages introduces lower thermal-mechanical stress during flip chip packaging.

Abstract: High yield, high reliability, flip-chip integrated circuit (IC) packages are achieved utilizing a combination of heat and pressure to bond flip-chip die and to cure no-flow underfill material. The underfill comprises a filler or low coefficient of thermal expansion (CTE) material to decrease CTE of the cured underfill. The filler material can be selected from the group comprising silica, silicon oxide, silicon dioxide, silicon nitride, aluminum oxide, aluminum nitride, or a mixture thereof. The filler material may also increase the viscosity of the uncured underfill and/or increase the modulus of elasticity of the cured underfill. In some method embodiments, a thermocompression bonder is used to simultaneously provide solder bump reflow and underfill curing. Application of various methods to a component package, an electronic assembly, and an electronic system are also described.

Abstract: High yield, high reliability, flip-chip integrated circuit (IC) packages are achieved utilizing a combination of heat and pressure to bond flip-chip die and to cure no-flow underfill material. The underfill comprises a filler or low coefficient of thermal expansion (CTE) material to decrease CTE of the cured underfill. The filler material can be selected from the group comprising silica, silicon oxide, silicon dioxide, silicon nitride, aluminum oxide, aluminum nitride, or a mixture thereof. The filler material may also increase the viscosity of the uncured underfill and/or increase the modulus of elasticity of the cured underfill. In some method embodiments, a thermocompression bonder is used to simultaneously provide solder bump reflow and underfill curing. Application of various methods to a component package, an electronic assembly, and an electronic system are also described.

Abstract: Disclosed are rapid and reproducible methods for separating and purifying nucleic acids from paraffin-containing tissue samples. The disclosed methods involve a melting step, where paraffin-containing tissue samples are heated in the presence of a detergent, causing the paraffin to melt and tissue sample cells to lyse. From the resulting two-phase mixture (i.e., a paraffin phase and an aqueous phase), the aqueous phase is collected for purification of nucleic acid. Protease(s) can be used at one or more points in the separation process to facilitate tissue cell lysis and/or degrade proteins that could degrade nucleic acid or interfere with subsequent genetic manipulation or analysis.

Abstract: Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula:

Abstract: An electronic structure includes an electronic device coupled to a substrate by conductive bumps and ball limiting metallurgy (BLM). Underfill material having filler particles is disposed in a space between the electronic device and the substrate. A weight percentage of the filler particles is at least about 60%. A particle size of at least 90 wt % of the filler particles is less than about 2 ?m and/or the filler particles are coated by an organic coupling agent. Once the underfill material is fully cured, its coefficient of thermal expansion is no more than 30 PPM/° C., and its glass transition temperature is at least 100° C., and its adhesion to a passivation layer of the electronic device, to the substrate and to the electronic device at its edges is such that the electronic structure passes standardized reliability tests without delamination of the ball limiting metallurgy.

Abstract: Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula: