Patents by Inventor Song-Hua Shi

Song-Hua Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
    Patent number: 6180696
    Abstract: An epoxy material suitable for no-flow underfilling processes with high glass transition temperature can be obtained by curing a solvent free formulation containing an epoxy resin, an organic carboxylic acid anhydride hardener, a curing accelerator, a fluxing agent, a viscosity controlling agent, a coupling agent, and a surfactant.
    Type: Grant
    Filed: February 18, 1998
    Date of Patent: January 30, 2001
    Assignee: Georgia Tech Research Corporation
    Inventors: Ching-Ping Wong, Song-Hua Shi