Patents by Inventor Song Kai Tan

Song Kai Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive interconnects
    Patent number: 11742282
    Abstract: Some embodiments include conductive interconnects which include the first and second conductive materials, and which extend upwardly from a conductive structure. Some embodiments include integrated assemblies having conductive interconnects.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: August 29, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Jordan D. Greenlee, Rita J. Klein, Everett A. McTeer, John D. Hopkins, Shuangqiang Luo, Song Kai Tan, Jing Wai Fong, Anurag Jindal, Chieh Hsien Quek
  • Conductive Interconnects
    Publication number: 20220044999
    Abstract: Some embodiments include conductive interconnects which include the first and second conductive materials, and which extend upwardly from a conductive structure. Some embodiments include integrated assemblies having conductive interconnects.
    Type: Application
    Filed: August 7, 2020
    Publication date: February 10, 2022
    Applicant: Micron Technology, Inc.
    Inventors: Jordan D. Greenlee, Rita J. Klein, Everett A. McTeer, John D. Hopkins, Shuangqiang Luo, Song Kai Tan, Jing Wai Fong, Anurag Jindal, Chieh Hsien Quek