Abstract: The present invention relates to a fluorine-containing resin composition, and a resin vanish, a fluorine-containing dielectric sheet, a laminate, a copper clad laminate and a printed circuit board containing the same. The fluorine-containing resin composition comprises 30 wt. %-70 wt. % of a fluorine-containing polymer, 30 wt. %-70 wt. % of an inorganic filler which includes the following particle size distribution: D10 is greater than 1.5 ?m; and D50 is 10-15 ?m. In the present invention, the selection of an inorganic filler with a specific particle size distribution can ensure that the boards prepared by the fluorine-containing resin composition have excellent dielectric properties and voltage resistance performance, even if the inorganic filler is added in a large amount.

Abstract: A magnetic dielectric resin composition, and a prepreg and a copper clad laminate comprising same. The magnetic dielectric resin composition comprises a resin and a magnetic filler. The absolute value of the temperature drift coefficient of the magnetic filler under the conditions of ?55° C. to 150° C. is 0-1000 ppm/° C. Preparation raw materials of the magnetic filler comprise a combination of iron oxide and a metal oxide. By means of mutual synergy of the resin and the specific magnetic filler, and on the premise of ensuring good dielectric properties, the magnetic dielectric resin composition has a high magnetic permeability, a low magnetic loss, and a proper cut-off frequency, and can also reduce a temperature drift coefficient and improve stability.

Abstract: Provided are a low dielectric loss non-woven fabric, a preparation method thereof and use thereof. The low dielectric loss non-woven fabric is composed of an inorganic fiber and a binder, and the binder is any one or a combination of at least two of a fluorine-containing resin emulsion, a polyolefin emulsion, a polyphenylene ether resin or a cyanate ester resin. The non-woven fabric of the present application has good dielectric properties and obvious strengthening effect, and can meet various performance requirements for copper clad laminate materials in the field of high-frequency communication.

Abstract: The present invention relates to a fluorine-containing resin composition, and a resin vanish, a fluorine-containing dielectric sheet, a laminate, a copper clad laminate and a printed circuit board containing the same. The fluorine-containing resin composition comprises 30 wt. %-70 wt. % of a fluorine-containing polymer, 30 wt. %-70 wt. % of an inorganic filler which includes the following particle size distribution: D10 is greater than 1.5 ?m; and D50 is 10-15 ?m. In the present invention, the selection of an inorganic filler with a specific particle size distribution can ensure that the boards prepared by the fluorine-containing resin composition have excellent dielectric properties and voltage resistance performance, even if the inorganic filler is added in a large amount.

Abstract: A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.

Abstract: A thermosetting resin composition. The composition comprises thermosetting resin, a cross-linking agent, accelerator, and a porogen. The porogen is a porogen capable of being dissolved in an organic solvent. The organic solvent is an organic solvent capable of dissolving the thermosetting resin. A mode of directly adding the dissolvable porogen to a resin system is used, tiny pores that are uniform in pore diameter can be evenly distributed in resin matrix by means of a simple process at low cost, and the high-performance composition having a low dielectric constant and low dielectric loss is obtained; the method has good applicability to a great number of resin systems; because the pore size in the system reaches a nanometer grade, performance of the final system, such as mechanical strength, thermal performance and water absorption rate, is not sacrificed.

Abstract: The present invention relates to a thermosetting resin composition. The composition comprises from about 20 wt. % to about 70 wt. % of a thermosetting resin, from about 1 wt. % to about 30 wt. % of a curing agent, from about 0 wt. % to about 10 wt. % of an accelerant, a tungsten compound, and an inorganic filler. A prepreg may be prepared in an impregnation manner or a coating product may be prepared in a coating manner. The composition may decrease the thermal expansion coefficient of laminates and may effectively block UV light and decrease the light transmissivity.

Abstract: The present invention relates to an epoxy resin composition and a copper clad laminate manufactured by using same. The epoxy resin composition comprises the following components and weight percentages thereof: epoxy resin 20-70%, curing agent 1-30%, accelerator 0-10%, fluororesin micropowder filler 1-60% and inorganic filler 0-60%, and further comprises a suitable amount of solvent. The copper clad laminate manufactured by using the epoxy resin composition comprises a prepreg and copper foils covering two sides of the prepreg, the prepreg comprising a reinforced material and the epoxy resin composition, which is adhered to the reinforced material after dipping and drying. The copper clad laminate manufactured by using the epoxy resin composition has excellent comprehensive performance, low water absorption, conductive anodic-filament resistance and good processability and meets requirements for processing an assembling of printed circuit boards.

Abstract: The present invention relates to a thermosetting resin composition. The composition comprises from about 20 wt. % to about 70 wt. % of a thermosetting resin, from about 1 wt. % to about 30 wt. % of a curing agent, from about 0 wt. % to about 10 wt. % of an accelerant, a tungsten compound, and an inorganic filler. A prepreg may be prepared in an impregnation manner or a coating product may be prepared in a coating manner. The composition may decrease the thermal expansion coefficient of laminates and may effectively block UV light and decrease the light transmissivity.

Abstract: The present invention relates to a thermosetting resin sandwich prepreg, and the copper clad laminates and multi-layered printed circuit wiring boards manufactured therefrom. The interlayer of the thermosetting resin sandwich prepreg contains the thermosetting resin composition with a high content of fillers, and the outer layer of the prepreg contains the thermosetting resin composition with a low content of fillers. The copper clad laminates prepared by using the prepregs have good adhesion to metal foils, insulativity and uniform dielectric constant distribution.

Abstract: A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.

Abstract: The present invention relates to an epoxy resin composition and a copper clad laminate manufactured by using same. The epoxy resin composition comprises the following components and weight percentages thereof: epoxy resin 20-70%, curing agent 1-30%, accelerator 0-10%, fluororesin micropowder filler 1-60% and inorganic filler 0-60%, and further comprises a suitable amount of solvent. The copper clad laminate manufactured by using the epoxy resin composition comprises a prepreg and copper foils covering two sides of the prepreg, the prepreg comprising a reinforced material and the epoxy resin composition, which is adhered to the reinforced material after dipping and drying. The copper clad laminate manufactured by using the epoxy resin composition has excellent comprehensive performance, low water absorption, conductive anodic-filament resistance and good processability and meets requirements for processing an assembling of printed circuit boards.