Patents by Inventor Songli HU

Songli HU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10276418
    Abstract: A wafer pre-alignment device is disclosed, including a first unit configured to drive a wafer to rotate or move upward or downward, a second unit configured to drive the wafer to translate, and a position detector including a light source, a lens and an image sensor. A light beam from the light source passes through the wafer and the lens and thereby provides information indicating a position of the wafer to the image sensor. The first unit and the second unit are able to adjust the position of the wafer based on the information obtained by the image sensor. A method for pre-aligning a TSV wafer is also disclosed.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: April 30, 2019
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Weiwang Sun, Gang Wang, Chunxia Huang, Songli Hu, Jie Jiang, Ruzhan Lu, Jiyuan Mou
  • Patent number: 10254661
    Abstract: A wafer transfer system for use in a photolithography system including a wafer storage apparatus, a pre-alignment apparatus, a buffer stage and a wafer stage is disclosed, which includes: a dual-arm robot, configured to take a wafer to be exposed from the wafer storage apparatus and transfer it onto the pre-alignment apparatus and further configured to remove an exposed wafer from the buffer stage and place it back into the wafer storage apparatus; a wafer-loading linear robot, configured to transfer a pre-aligned wafer onto the wafer stage; and a wafer-unloading linear robot, configured to transfer the exposed wafer onto the buffer stage. The dual-arm robot, the wafer-loading linear robot and the wafer-unloading linear robot can operate in parallel so as to achieve time savings in the wafer transfers.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: April 9, 2019
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Kai Liu, Songli Hu, Jie Jiang
  • Publication number: 20180143541
    Abstract: A wafer transfer system for use in a photolithography system including a wafer storage apparatus, a pre-alignment apparatus, a buffer stage and a wafer stage is disclosed, which includes: a dual-arm robot, configured to take a wafer to be exposed from the wafer storage apparatus and transfer it onto the pre-alignment apparatus and further configured to remove an exposed wafer from the buffer stage and place it back into the wafer storage apparatus; a wafer-loading linear robot, configured to transfer a pre-aligned wafer onto the wafer stage; and a wafer-unloading linear robot, configured to transfer the exposed wafer onto the buffer stage. The dual-arm robot, the wafer-loading linear robot and the wafer-unloading linear robot can operate in parallel so as to achieve time savings in the wafer transfers.
    Type: Application
    Filed: May 20, 2016
    Publication date: May 24, 2018
    Inventors: Kai LIU, Songli HU, Jie JIANG
  • Publication number: 20160329229
    Abstract: A wafer pre-alignment device is disclosed, including a first unit configured to drive a wafer to rotate or move upward or downward, a second unit configured to drive the wafer to translate, and a position detector including a light source, a lens and an image sensor. A light beam from the light source passes through the wafer and the lens and thereby provides information indicating a position of the wafer to the image sensor. The first unit and the second unit are able to adjust the position of the wafer based on the information obtained by the image sensor. A method for pre-aligning a TSV wafer is also disclosed.
    Type: Application
    Filed: December 26, 2014
    Publication date: November 10, 2016
    Inventors: Weiwang SUN, Gang WANG, Chunxia HUANG, Songli HU, Jie JIANG, Ruzhan LU, Jiyuan MOU