Patents by Inventor Songwan Su

Songwan Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220008949
    Abstract: An ultrasonic atomization piece and manufacturing process thereof relate to the technical field of ultrasonic atomization. The piece comprises a piezoelectric ceramic sheet and at least one composite plate. The composite plate is fixed on one side of the piezoelectric ceramic sheet and includes a substrate and a conductive layer, the conductive layer is in contact with the piezoelectric ceramic sheet, the substrate is provided with atomizing apertures, and the substrate is a polymer film. Compared with the traditional stainless steel thin sheet, the polymer film is used as the substrate material; the force for the piezoelectric ceramic sheet to generate deformation requires being lower, so the piezoelectric ceramic sheet can pull the polymer film to generate deformation with less energy. The difficulty of drilling apertures is reduced, and metal residues splashing will not occur, thereby eliminating the adverse effect of metal residues on the passage efficiency of liquid.
    Type: Application
    Filed: September 26, 2021
    Publication date: January 13, 2022
    Inventors: YAO ZHENG, Qiuhong Su, Songwan Su
  • Publication number: 20220008956
    Abstract: A manufacturing process for ultrasonic atomization piece relates to the atomization piece technical field and includes: S1. cutting a press-thermosetting conductive adhesive film into a shape matched with a piezoelectric ceramic sheet; S2. placing the press-thermosetting conductive adhesive film on a composite plate, wherein the composite plate includes a substrate and a conductive layer, the press-thermosetting conductive adhesive film is placed on the conductive layer, and the substrate is a polymer film; S3. placing the piezoelectric ceramic sheet on the press-thermosetting conductive adhesive film; S4. pressing the piezoelectric ceramic sheet and the composite plate in S3 together by a press machine. The press-thermosetting conductive adhesive film for connecting the piezoelectric ceramic sheet and the composite plate can be cured in a short time under high pressure and heating and has excellent adhesion, which is a thin film material with excellent plasticity and can be easily cut into various shapes.
    Type: Application
    Filed: September 26, 2021
    Publication date: January 13, 2022
    Inventors: YAO ZHENG, QIUHONG SU, SONGWAN SU