Patents by Inventor Sonja Bollmann

Sonja Bollmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8999086
    Abstract: A molding compound for joining two moldings each made of a PA11 and/or PA12 molding compound contains at least 50% by weight of a polyamide component so chosen that it is preparable from linear aliphatic diamines and dicarboxylic acids and/or lactams or ?-aminocarboxylic acids, there being 11 to 12 carbon atoms present per carboxamide group in the repeating units, and, furthermore, this polyamide component containing not more than 80% by weight of either one of the polyamides PA11 and PA12. With this compound a firm weld is obtained both to a PA11 molding and to a PA12 molding.
    Type: Grant
    Filed: August 13, 2008
    Date of Patent: April 7, 2015
    Assignee: Evonik Degussa GmbH
    Inventors: Sonja Bollmann, Rainer Goering, Franz-Erich Baumann, Andreas Dowe, Vera Schiemann
  • Patent number: 8647551
    Abstract: A process for producing moldings with condensing-up of a polyamide molding composition whose polyamide component contains, as a result of the method of preparation, at least 5 ppm of phosphorus in the form of an acidic compound by means of a compound having at least two carbonate units, wherein a) from 0.001 to 10% by weight, based on the polyamide, of a salt of a weak acid is added to the polyamide molding composition prior to compounding or during compounding, b) a mixture of the finished composition and the compound having at least two carbonate units is prepared, c) the mixture is, if appropriate, stored and/or transported and d) the mixture is subsequently processed to produce the molding, with the condensing-up occurring only in this step, effects a significant increase in the melt stiffness combined with moderate processing pressures, which considerably simplifies, in particular, the production of hollow bodies and hollow profiles having large diameters.
    Type: Grant
    Filed: February 15, 2006
    Date of Patent: February 11, 2014
    Assignee: Evonik Degussa GmbH
    Inventors: Andreas Dowe, Rainer Goering, Martin Himmelmann, Sonja Bollmann, Franz-Erich Baumann, Roland Wursche
  • Publication number: 20140037937
    Abstract: A film whose outer layer is composed of a molding composition which is in essence composed of the following components: a) from 3 to 50% by weight of a polyamide, selected from the group of PA11 and PA12, and b) from 50 to 97% by weight of a polyamide, selected from the group of PA1012 and PA1212, where the percentages are based on the entirety of components a) and b), is suitable for decoration of moldings which retain their gloss during their service time.
    Type: Application
    Filed: October 10, 2013
    Publication date: February 6, 2014
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Roland Wursche, Sonja Bollmann, Harald Haeger, Martin Wielpuetz, Kirsten Alting, Michael Beyer, Franz-Erich Baumann
  • Patent number: 8614005
    Abstract: A film whose outer layer is composed of a molding composition which is in essence composed of the following components: a) from 3 to 50% by weight of a polyamide, selected from the group of PA11 and PA12, and b) from 50 to 97% by weight of a polyamide, selected from the group of PA1012 and PA1212, where the percentages are based on the entirety of components a) and b), is suitable for decoration of moldings which retain their gloss during their service time.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: December 24, 2013
    Assignee: Evonik Degussa GmbH
    Inventors: Roland Wursche, Sonja Bollmann, Harald Haeger, Martin Wielpuetz, Kirsten Alting, Michael Beyer, Franz-Erich Baumann
  • Patent number: 8580899
    Abstract: A process for producing moldings with condensing-up of a polyamide molding composition by means of a compound having at least two carbonate units, wherein a) a polyamide molding composition is made available, b) a mixture of the polyamide molding composition and the compound having at least two carbonate units is prepared, c) the mixture is, if appropriate, stored and/or transported and d) the mixture is subsequently processed to produce the molding, with the condensing-up occurring only in this step, and the molding is a hollow body or hollow profile having an external diameter of at least 30 mm and a wall thickness of at least 1 mm, effects a significant increase in the melt stiffness combined with moderate processing presssures, which considerably simplifies the production of these moldings.
    Type: Grant
    Filed: February 15, 2006
    Date of Patent: November 12, 2013
    Assignee: Evonik Degussa GmbH
    Inventors: Andreas Dowe, Rainer Goering, Sonja Bollmann, Franz-Erich Baumann
  • Patent number: 8535811
    Abstract: A polyamide molding composition which can be used for production of a printable or printed item contains a) at most 90 parts by weight of a polyamide obtained from a lactam or from an amino carboxylic acid having at least 10 carbon atoms; and b) from 10 to 100 parts by weight of PA1010, wherein a total of components a) and b) is 100 parts by weight.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: September 17, 2013
    Assignee: Evonik Degussa GmbH
    Inventors: Kirsten Luetzeler, Franz-Erich Baumann, Sonja Bollmann, Andreas Dowe, Roland Wursche, Georg Schaefer
  • Patent number: 8357455
    Abstract: The invention relates to the use of a molding composition which comprises at least 50% by weight of a copolyamide, which is composed of the following monomer combination: a) from 65 to 99 mol % of a substantially equimolar mixture composed of an unbranched aliphatic diamine having from 6 to 18 carbon atoms and of an unbranched aliphatic dicarboxylic acid having from 6 to 18 carbon atoms, ?where the mixture composed of diamine and dicarboxylic acid comprises an average of from 8 to 12 carbon atoms, b) from 1 to 35 mol % of a substantially equimolar mixture composed of a cycloaliphatic diamine having from 8 to 20 carbon atoms and of a dicarboxylic acid having from 6 to 18 carbon atoms, for production of a printable or printed item, such as a ski topcoat.
    Type: Grant
    Filed: November 9, 2005
    Date of Patent: January 22, 2013
    Assignee: Evonik Degussa GmbH
    Inventors: Franz-Erich Baumann, Roland Wursche, Harald Häger, Sonja Bollmann, Kirsten Alting
  • Publication number: 20120094116
    Abstract: A film whose outer layer is composed of a molding composition which is in essence composed of the following components: a) from 3 to 50% by weight of a polyamide, selected from the group of PA11 and PA12, and b) from 50 to 97% by weight of a polyamide, selected from the group of PA1012 and PA1212, where the percentages are based on the entirety of components a) and b), is suitable for decoration of moldings which retain their gloss during their service time.
    Type: Application
    Filed: December 21, 2011
    Publication date: April 19, 2012
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Roland WURSCHE, Sonja Bollmann, Harald Häger, Martin Wielpütz, Kirsten Alting, Michael Beyer, Franz-Erich Baumann
  • Publication number: 20110244209
    Abstract: A polyamide molding composition which can be used for production of a printable or printed item contains a) at most 90 parts by weight of a polyamide obtained from a lactam or from an amino carboxylic acid having at least 10 carbon atoms; and b) from 10 to 100 parts by weight of PA1010, wherein a total of components a) and b) is 100 parts by weight.
    Type: Application
    Filed: June 1, 2011
    Publication date: October 6, 2011
    Applicant: DEGUSSA AG
    Inventors: Kirsten Luetzeler, Franz-Erich Baumann, Sonja Bollmann, Andreas Dowe, Roland Wursche, Georg SCHÄFER
  • Publication number: 20110217559
    Abstract: A moulding compound for joining two mouldings each made of a PA11 and/or PA12 moulding compound contains at least 50% by weight of a polyamide component so chosen that it is preparable from linear aliphatic diamines and dicarboxylic acids and/or lactams or ?-aminocarboxylic acids, there being 11 to 12 carbon atoms present per carboxamide group in the repeating units, and, furthermore, this polyamide component containing not more than 80% by weight of either one of the polyamides PA11 and PA12. With this compound a firm weld is obtained both to a PA11 moulding and to a PA12 moulding.
    Type: Application
    Filed: August 13, 2008
    Publication date: September 8, 2011
    Applicant: Evonik Degussa Gmbh
    Inventors: Sonja Bollmann, Rainer Goering, Franz-Erich Baumann, Andreas Dowe, Vera Schiemann
  • Patent number: 8003201
    Abstract: A polyamide molding composition which can be used for production of a printable or printed item contains a) at most 90 parts by weight of a polyamide obtained from a lactam or from an amino carboxylic acid having at least 10 carbon atoms; and b) from 10 to 100 parts by weight of PA1010, wherein a total of components a) and b) is 100 parts by weight.
    Type: Grant
    Filed: June 8, 2006
    Date of Patent: August 23, 2011
    Assignee: Evonik Degussa GmbH
    Inventors: Kirsten Luetzeler, Franz-Erich Baumann, Sonja Bollmann, Andreas Dowe, Roland Wursche, Georg Schaefer
  • Publication number: 20110045269
    Abstract: A component which comprises the following components: I. a top layer of a moulding compound which contains at least 50% by weight of PA613 and II. a substrate of a thermoplastic moulding compound has a surface with high scratch resistance and high chemical resistance.
    Type: Application
    Filed: June 23, 2009
    Publication date: February 24, 2011
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Roland Wursche, Sonja Bollmann, Franz-Erich Baumann, Beatrice Kueting, Kirsten Luetzeler, Andreas Pawlik, Martin Wielpuetz
  • Publication number: 20100221551
    Abstract: The present invention relates to a composite part containing (i) a part composed of an ABS molding composition, and (ii) a multilayer film including at least one layer comprising a polyamide molding composition, and at least one layer comprising an adhesion promoter, wherein the adhesion promoter contains from 2 to 100% by weight of a copolymer, and wherein the copolymer contains (a) from 70 to 99.9% by weight of monomer units derived from vinyl compounds selected from the group consisting of acrylic acid derivatives, methacrylic acid derivatives, and vinylaromatics; and (b) from 0.1 to 30% by weight of monomer units comprising a functional group selected from the group consisting of a carboxylic anhydride group, an epoxy group, and an oxazoline group.
    Type: Application
    Filed: May 14, 2010
    Publication date: September 2, 2010
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Roland WURSCHE, Sonja Bollmann, Martin Wielpuetz, Kirsten Alting, Harald Haeger
  • Publication number: 20080261010
    Abstract: A film whose outer layer is composed of a molding composition which is in essence composed of the following components: a) from 3 to 50% by weight of a polyamide, selected from the group of PA11 and PA12, and b) from 50 to 97% by weight of a polyamide, selected from the group of PA1012 and PA1212, where the percentages are based on the entirety of components a) and b), is suitable for decoration of moldings which retain their gloss during their service time.
    Type: Application
    Filed: January 4, 2006
    Publication date: October 23, 2008
    Applicant: DEGUSSA GmbH
    Inventors: Roland Wursche, Sonja Bollmann, Harald Hager, Martin Wielputz, Kirsten Alting, Michael Beyer, Franz-Erich Baumann
  • Publication number: 20080119632
    Abstract: The invention relates to the use of a molding composition which comprises at least 50% by weight of a copolyamide, which is composed of the following monomer combination: a) from 65 to 99 mol % of a substantially equimolar mixture composed of an unbranched aliphatic diamine having from 6 to 18 carbon atoms and of an unbranched aliphatic dicarboxylic acid having from 6 to 18 carbon atoms, where the mixture composed of diamine and dicarboxylic acid comprises an average of from 8 to 12 carbon atoms, b) from 1 to 35 mol % of a substantially equimolar mixture composed of a cycloaliphatic diamine having from 8 to 20 carbon atoms and of a dicarboxylic acid having from 6 to 18 carbon atoms, for production of a printable or printed item, such as a ski topcoat.
    Type: Application
    Filed: November 9, 2005
    Publication date: May 22, 2008
    Applicant: DEGUSSA GmbH
    Inventors: Franz-Erich Baumann, Roland Wursche, Harald Hager, Sonja Bollmann, Kirsten Alting
  • Publication number: 20070166560
    Abstract: An adhesion promoter which comprises from 2 to 100% by weight of a copolymer which contains the following monomer units: a) from 70 to 99.9% by weight of monomer units which derive from vinyl compounds selected from acrylic acid derivatives, methacrylic acid derivatives, and vinylaromatics, and also b) from 0.1 to 30% by weight of monomer units which contain a functional group selected from a carboxylic anhydride group, an epoxy group, and an oxazoline group, is used for production of a bond between I. a layer composed of a polyamide molding compound, and II. a part composed of an ABS molding composition.
    Type: Application
    Filed: June 9, 2005
    Publication date: July 19, 2007
    Applicant: Degussa AG
    Inventors: Roland Wursche, Sonja Bollmann, Martin Wielputz, Kirsten Alting, Harald Hager
  • Publication number: 20060281873
    Abstract: A polyamide molding composition which can be used for production of a printable or printed item contains a) at most 90 parts by weight of a polyamide obtained from a lactam or from an amino carboxylic acid having at least 10 carbon atoms; and b) from 10 to 100 parts by weight of PA1010, wherein a total of components a) and b) is 100 parts by weight.
    Type: Application
    Filed: June 8, 2006
    Publication date: December 14, 2006
    Applicant: DEGUSSA AG
    Inventors: Kirsten Alting, Franz-Erich Baumann, Sonja Bollmann, Andreas Dowe, Roland Wursche, Georg Schafer
  • Publication number: 20060183869
    Abstract: A process for producing moldings with condensing-up of a polyamide molding composition whose polyamide component contains, as a result of the method of preparation, at least 5 ppm of phosphorus in the form of an acidic compound by means of a compound having at least two carbonate units, wherein a) from 0.001 to 10% by weight, based on the polyamide, of a salt of a weak acid is added to the polyamide molding composition prior to compounding or during compounding, b) a mixture of the finished composition and the compound having at least two carbonate units is prepared, c) the mixture is, if appropriate, stored and/or transported and d) the mixture is subsequently processed to produce the molding, with the condensing-up occurring only in this step, effects a significant increase in the melt stiffness combined with moderate processing presssures, which considerably simplifies, in particular, the production of hollow bodies and hollow profiles having large diameters.
    Type: Application
    Filed: February 15, 2006
    Publication date: August 17, 2006
    Applicant: Degussa AG
    Inventors: Andreas Dowe, Rainer Goring, Martin Himmelmann, Sonja Bollmann, Franz-Erich Baumann, Roland Wursche
  • Publication number: 20060182916
    Abstract: A process for producing moldings with condensing-up of a polyamide molding composition by means of a compound having at least two carbonate units, wherein a) a polyamide molding composition is made available, b) a mixture of the polyamide molding composition and the compound having at least two carbonate units is prepared, c) the mixture is, if appropriate, stored and/or transported and d) the mixture is subsequently processed to produce the molding, with the condensing-up occurring only in this step, and the molding is a hollow body or hollow profile having an external diameter of at least 30 mm and a wall thickness of at least 1 mm, effects a significant increase in the melt stiffness combined with moderate processing presssures, which considerably simplifies the production of these moldings.
    Type: Application
    Filed: February 15, 2006
    Publication date: August 17, 2006
    Applicant: Degussa AG
    Inventors: Andreas Dowe, Rainer Goring, Sonja Bollmann, Franz-Erich Baumann
  • Publication number: 20030212174
    Abstract: A molding composition which comprises the following components:
    Type: Application
    Filed: January 13, 2003
    Publication date: November 13, 2003
    Applicant: DEGUSSA AG
    Inventors: Heinrich Peirick, Hans-Gunter Lohkamper, Sonja Bollmann, Harald Hager