Abstract: A privacy film for a curved display screen. The privacy film has a curved cross section when no force is applied. The privacy film comprises alternating transparent layers and opaque layers, each extending across the privacy film, and each parallel to the other transparent and opaque layers when no force is applied. A method of manufacturing the film is also disclosed.

Abstract: A method of manufacturing a plurality of optical elements comprising the steps of providing a substrate (120) providing a tool (100) comprising, a plurality of replication sections (106) each defining a surface structure of one of the optical elements, and at least one contact spacer portion (112), aligning the tool (100) and the substrate (120) with respect to each other and bringing the tool (100) and a first side of the substrate (120) together, with replication material (124) between the tool (100) and the substrate (120), the contact spacer portion (112) contacting the first side of the substrate (120), hardening the replication material (124), and separating the tool (100) from the substrate (120) with the hardened replication material adhering to the substrate (120), wherein the tool (100) has yard line features (304) around at least a portion of the replication sections (106), the yard line features (304) configured to contain the replication material (124) on a first side of the yard line with respec

Abstract: Wafer-level methods for manufacturing one or more uniform layers of material on one or more surfaces of a plurality of optoelectronic modules include assembling a wafer assembly, injecting a formable material into the wafer assembly, ejecting excess formable material form the wafer assembly, and hardening one or more formable material layers on one or more surfaces of the plurality of optoelectronic modules such that the hardened one or more formable material layers are the one or more uniform layers of material.

Abstract: This disclosure describes optoelectronic modules, methods for manufacturing pluralities of discrete optoelectronic modules, and optoelectronic molding tools. The methods include coating a substrate wafer and a plurality of optoelectronic components with a photosensitive material, and further include exposing select portions of the photosensitive material to electromagnetic radiation. The exposed portions delineate at least in part the dimensions of the optical channels, wherein the optical channels are associated with at least one optoelectronic component. In some instances, optical elements are incorporated into the optical channels. In some instances, the exposed portions are the optical channels. In some instances, the exposed portions are spacers between the optical channels.