Patents by Inventor Son Kyo Hwang

Son Kyo Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting device package and light unit
    Patent number: 9634215
    Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: April 25, 2017
    Assignee: LG Innotek Co., Ltd.
    Inventors: Su Jung Jung, Yon Tae Moon, Young Jun Cho, Son Kyo Hwang, Byung Mok Kim, Seo Yeon Kwon
  • LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT
    Publication number: 20160043296
    Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.
    Type: Application
    Filed: October 16, 2015
    Publication date: February 11, 2016
    Inventors: Su Jung JUNG, Yon Tae MOON, Young Jun CHO, Son Kyo HWANG, Byung Mok KIM, Seo Yeon KWON
  • Light emitting device package and light unit
    Patent number: 9196814
    Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: November 24, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Su Jung Jung, Yon Tae Moon, Young Jun Cho, Son Kyo Hwang, Byung Mok Kim, Seo Yeon Kwon
  • LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT
    Publication number: 20140225151
    Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.
    Type: Application
    Filed: April 15, 2014
    Publication date: August 14, 2014
    Applicant: LG Innotek Co., Ltd.
    Inventors: Su Jung JUNG, Yon Tae MOON, Young Jun CHO, Son Kyo HWANG, Byung Mok KIM, Seo Yeon KWON
  • Light emitting device package, light source module, and lighting system including the same
    Patent number: 8773006
    Abstract: Disclosed is a light emitting device package. The light emitting device includes a package body having a cavity defined by a sidewall and a bottom surface, a light emitting device disposed in the cavity, a radiator inserted into the package body and disposed below the light emitting device, and a second electrode pattern disposed around the radiator and electrically connected to the light emitting device via wire bonding. The second electrode pattern includes a first region to which a wire is bonded, and a second region connected to the first region, and a width of the first region differs from a width of the second region.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: July 8, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Byung Mok Kim, Young Jun Cho, Yon Tae Moon, Su Jung Jung, Seo Yeon Kwon, Son Kyo Hwang
  • Light emitting device package and light unit
    Patent number: 8704433
    Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.
    Type: Grant
    Filed: August 22, 2012
    Date of Patent: April 22, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Su Jung Jung, Yon Tae Moon, Young Jun Cho, Son Kyo Hwang, Byung Mok Kim, Seo Yeon Kwon
  • LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT
    Publication number: 20130049564
    Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.
    Type: Application
    Filed: August 22, 2012
    Publication date: February 28, 2013
    Inventors: Su Jung JUNG, Yon Tae MOON, Young Jun CHO, Son Kyo HWANG, Byung Mok KIM, Seo Yeon KWON
  • LIGHT EMITTING DEVICE PACKAGE, LIGHT SOURCE MODULE, AND LIGHTING SYSTEM INCLUDING THE SAME
    Publication number: 20130049563
    Abstract: Disclosed is a light emitting device package. The light emitting device includes a package body having a cavity defined by a sidewall and a bottom surface, a light emitting device disposed in the cavity, a radiator inserted into the package body and disposed below the light emitting device, and a second electrode pattern disposed around the radiator and electrically connected to the light emitting device via wire bonding. The second electrode pattern includes a first region to which a wire is bonded, and a second region connected to the first region, and a width of the first region differs from a width of the second region.
    Type: Application
    Filed: August 21, 2012
    Publication date: February 28, 2013
    Inventors: Byung Mok Kim, Young Jun Cho, Yon Tae Moon, Su Jung Jung, Seo Yeon Kwon, Son Kyo Hwang
  • Light emitting device package and light unit
    Patent number: RE48858
    Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: December 21, 2021
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Su Jung Jung, Yon Tae Moon, Young Jun Cho, Son Kyo Hwang, Byung Mok Kim, Seo Yeon Kwon