Patents by Inventor Sonny Maung

Sonny Maung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for process endpoint prediction based on actual thickness measurements
    Patent number: 5503707
    Abstract: In accordance with one aspect of the present invention, a method is provided for predicting the endpoint time of a semiconductor process for a layer of a wafer (14). The endpoint time is the time at which a predetermined thickness of the layer occurs. A layer thickness, calculated for a first sample time, is received. It is then determined whether or not the layer thickness lies within a predetermined range. If the layer thickness does lie within the predetermined range, it is used to update a forecasted process rate. The forecasted process rate is used to predict the endpoint time. The endpoint time is used to control the semiconductor process so that the layer of wafer (14) is formed having the predetermined thickness.
    Type: Grant
    Filed: September 22, 1993
    Date of Patent: April 2, 1996
    Assignee: Texas Instruments Incorporated
    Inventors: Sonny Maung, Stephanie W. Butler, Steven A. Henck