Patents by Inventor Sonny S. Pareno

Sonny S. Pareno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic package having controlled epoxy flow
    Patent number: 5239131
    Abstract: There is provided an electronic package assembly having a die attach paddle bonded to the package base by a compliant adhesive. A recessed channel formed in the base is partially overlapped by the die attach paddle. During package sealing, excess adhesive accumulates in the recessed channel, eliminating bridging of the adhesive to the leadframe.
    Type: Grant
    Filed: July 13, 1992
    Date of Patent: August 24, 1993
    Assignee: Olin Corporation
    Inventors: Paul R. Hoffman, Linda E. Strauman, Dexin Liang, Sonny S. Pareno, German J. Ramirez