Abstract: A recording method includes: generating a laser driving pulse, of which the number depends on a length of a mark which is formed, and where a pulse level of a pulse column at least in an intermediate pulse besides the lead pulse and the last pulse is sequentially decreased; performing laser emission, based on the laser driving pulse; and performing mark formation using thermal recording by laser irradiation on a recording medium.

Abstract: Provided is a pattern transfer medium manufacturing apparatus including a disc injection compression molding unit that forms a disc-shaped pattern transfer medium by an injection compression molding using a disc molding die and a disc-shaped stamper and a cutting unit that performs cutting the periphery of a concave and convex pattern portion on the disc-shaped pattern transfer medium, which is formed due to a transfer by the injection compression molding, as a target object.

Abstract: A hologram master having a hologram image recorded thereon is brought into intimate contact with a surface of a hologram recording medium containing a photosensitive material directly or via a refractive index adjuster. The hologram image is made to have continuous parallax in at least a first direction with a movement of an eyepoint along the first direction with respect to a normal line when the hologram master is illuminated at a predetermined angle. First laser light is applied onto the hologram master and the hologram recording medium via a diffusion plate configured to diffuse incident light in a second direction. Second laser light is applied onto the hologram recording medium via the hologram master simultaneously with the first laser light. The hologram image recorded on the hologram master and first additional information are recorded on the hologram recording medium.

Abstract: Provided is a fusing method of a substrate layer including: treating a joining surface of a substrate layer formed from a resin using an organic solvent having solubility with respect to the resin; and heating the treated substrate layer at less than a glass transition temperature or a softening point temperature of the resin and crimping the heated substrate layer.