Patents by Inventor Sony Mathews

Sony Mathews has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Powertrain system with wireless communication nodes and integrated RF shield guide layer
    Patent number: 12027676
    Abstract: An enclosed electrical device such as a battery pack for an electric powertrain system includes an enclosure having a tray and cover. The tray and cover together define an enclosure cavity. A radio frequency (RF) receiving node is located within the cavity. Printed circuit board assemblies (PCBAs) include an RF transmitting node. The PCBAs(s) are spaced apart from one another within the cavity. An RF shield guide layer is positioned between the PCBAs and the cover, such that the RF shield guide layer covers the PCBAs without covering the RF transmitting node. A battery pack and an electric powertrain system include the RF shield guide layer.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: July 2, 2024
    Assignee: GM Global Technology Operations LLC
    Inventors: Fiona E. Meyer-Teruel, Aseim M. Elfrgani, Christopher A. O'Brien, Sony Mathews, Hatem Elgothamy
  • POWERTRAIN SYSTEM WITH WIRELESS COMMUNICATION NODES AND INTEGRATED RF SHIELD GUIDE LAYER
    Publication number: 20230187712
    Abstract: An enclosed electrical device such as a battery pack for an electric powertrain system includes an enclosure having a tray and cover. The tray and cover together define an enclosure cavity. A radio frequency (RF) receiving node is located within the cavity. Printed circuit board assemblies (PCBAs) include an RF transmitting node. The PCBAs(s) are spaced apart from one another within the cavity. An RF shield guide layer is positioned between the PCBAs and the cover, such that the RF shield guide layer covers the PCBAs without covering the RF transmitting node. A battery pack and an electric powertrain system include the RF shield guide layer.
    Type: Application
    Filed: December 10, 2021
    Publication date: June 15, 2023
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Fiona E. Meyer-Teruel, Aseim M. Elfrgani, Christopher A. O'Brien, Sony Mathews, Hatem Elgothamy