Patents by Inventor Soo Ah Lee

Soo Ah Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Autotaxin inhibitor compounds
    Patent number: 11970493
    Abstract: The present disclosure provides autotaxin (ATX) inhibitor compounds and compositions including said compounds. The present disclosure also provides methods of using said compounds and compositions for inhibiting ATX. Also provided are methods of preparing said compounds and compositions, and synthetic precursors of said compounds.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: April 30, 2024
    Assignee: ILDONG PHARMACEUTICAL CO., LTD.
    Inventors: Sung-Ku Choi, Yoon-Suk Lee, Sung-Wook Kwon, Kyung-Sun Kim, Jeong-Geun Kim, Jeong-Ah Kim, An-Na Moon, Sun-Young Park, Jun-Su Ban, Dong-Keun Song, Kyu-Sic Jang, Ju-Young Jung, Soo-Jin Lee
  • Printed circuit board
    Patent number: 11076482
    Abstract: A printed circuit board includes an internal insulating layer, an internal conductive pattern layer disposed on the internal insulating layer and including a line portion and a bonding pad portion, and an external insulating layer disposed on the internal conductive pattern layer and the internal insulating layer and having an accommodation groove extending therethrough to expose the bonding pad portion. The bonding pad portion includes a connection pattern extending from the line portion of the internal conductive pattern layer embedded in the external insulating layer, and exposed to the accommodation groove; a land pattern disposed closer to a center portion of the accommodation groove than the connection pattern; and a dam pattern connecting the connection pattern and the land pattern, in which a line width of the dam pattern is narrower than a line width of the land pattern.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: July 27, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Soo Kim, Ha Il Kim, Seok Jun Ahn, Soo Ah Lee
  • PRINTED CIRCUIT BOARD
    Publication number: 20210185806
    Abstract: A printed circuit board includes an internal insulating layer, an internal conductive pattern layer disposed on the internal insulating layer and including a line portion and a bonding pad portion, and an external insulating layer disposed on the internal conductive pattern layer and the internal insulating layer and having an accommodation groove extending therethrough to expose the bonding pad portion. The bonding pad portion includes a connection pattern extending from the line portion of the internal conductive pattern layer embedded in the external insulating layer, and exposed to the accommodation groove; a land pattern disposed closer to a center portion of the accommodation groove than the connection pattern; and a dam pattern connecting the connection pattern and the land pattern, in which a line width of the dam pattern is narrower than a line width of the land pattern.
    Type: Application
    Filed: April 15, 2020
    Publication date: June 17, 2021
    Inventors: Jung Soo Kim, Ha Il Kim, Seok Jun Ahn, Soo Ah Lee