Abstract: A bitline sense amplifier including: an amplifier which is connected between a first sensing bitline and a second sensing bitline, and detects and amplifies a voltage difference between a first bitline and a second bitline in response to a first control signal and a second control signal; and an equalizer which is connected between a first supply line through which the first control signal is supplied and a second supply line through which the second control signal is supplied, and pre-charges the first bitline and the second bitline with a precharge voltage in response to an equalizing control signal, wherein the equalizer includes an equalizing enable transistor in which a source terminal is connected to the first supply line and performs equalizing in response to the equalizing control signal.

Abstract: A polyamide resin composition using a recycled carbon fiber to establish reasonable manufacturing costs. The polyamide resin composition has excellent processability and can be used for injection molding, so that molded products with various structures can be made from the polyamide resin composition. In addition, good mechanical properties of the polyamide resin composition enable applications in various fields.

Abstract: Proposed are a wafer heating apparatus and a wafer processing apparatus using the same. More particularly, proposed are a wafer heating apparatus having an improved structure to enable efficient cooling of a terminal block, and a wafer processing apparatus using the same. A wafer heating apparatus for heating a wafer according to one embodiment includes a heater disposed below the wafer and configured to serve as a heat source, a cooling plate disposed below the heater and configured to provide cool air, and a terminal block configured to supply power to the heater and having a lower end portion in contact with the cooling plate.

Abstract: The present invention relates to a technology for collecting map information including terrain information through a collectible open map service without actual road measurement information and generating a simulation image by processing an image reflecting a type, a terrain condition, and the like of a road.

Abstract: Disclosed are a cartridge-type X-ray source apparatus and an X-ray emission apparatus using the same. The X-ray source includes: a cathode electrode provided with an electron emission source by using a nanostructure; an anode electrode having a target emitting X-rays by electron collision; and a housing forming an external appearance, and exposing a cathode electrode terminal connected to the cathode electrode and an anode electrode terminal connected to the anode electrode to an outside thereof, wherein the cathode electrode terminal and the anode electrode terminal differ from each other in at least one of exposure direction, height, size, and shape.

Abstract: Provided is an intermediate connection system for an ultra-high-voltage direct-current (DC) power cable. Specifically, the present invention relates to an intermediate connection system, for an ultra-high-voltage DC power cable, which is capable of simultaneously preventing or minimizing electric field distortion, a decrease of DC dielectric strength, and a decrease of impulse breakdown strength due to the accumulation of space charges in an insulating layer of a cable and an insulating material of an intermediate connection part.

Abstract: Provided is an intermediate connection system for an ultra-high-voltage direct-current (DC) power cable. Specifically, the present invention relates to an intermediate connection system, for an ultra-high-voltage DC power cable, which is capable of simultaneously preventing or minimizing electric field distortion, a decrease of DC dielectric strength, and a decrease of impulse breakdown strength due to the accumulation of space charges in an insulating layer of a cable and an insulating material of an intermediate connection part.

Abstract: A ventilation apparatus of a lamp module for vehicles may include a lamp housing, a lamp installed in the lamp housing and emitting light through a light transmitting part, a light transmitting lens covering an opening of the lamp housing and transmitting the light emitted from the light transmitting part, an intake hole part formed through the lamp housing and arranged at one side of the lamp, an exhaust hole part formed through the lamp housing and arranged at the other side of the lamp, an exhaust pipe coupled to the lamp housing and connected to the exhaust hole part, and an exhaust pump connected to the exhaust pipe and forcibly discharging the air between the lamp housing and the light transmitting lens through the exhaust pipe.

Abstract: A ventilation apparatus of a lamp module for vehicles may include: a lamp housing; a lamp emitting light through a light transmitting part; a light transmitting lens covering an opening of the lamp housing; an intake hole part formed through the lamp housing, and arranged at one side of the lamp; an exhaust hole part formed through the lamp housing, and arranged at the other side of the lamp; and an exhaust pipe having one side coupled to the lamp housing and connected to the exhaust hole part and the other side connected to an intake part of an engine.

Abstract: Disclosed are a cartridge-type X-ray source apparatus and an X-ray emission apparatus using the same. The X-ray source includes: a cathode electrode provided with an electron emission source by using a nanostructure; an anode electrode having a target emitting X-rays by electron collision; and a housing forming an external appearance, and exposing a cathode electrode terminal connected to the cathode electrode and an anode electrode terminal connected to the anode electrode to an outside thereof, wherein the cathode electrode terminal and the anode electrode terminal differ from each other in at least one of exposure direction, height, size, and shape.

Abstract: A ventilation apparatus of a lamp module for vehicles may include a lamp housing, a lamp installed in the lamp housing and emitting light through a light transmitting part, a light transmitting lens covering an opening of the lamp housing and transmitting the light emitted from the light transmitting part, an intake hole part formed through the lamp housing and arranged at one side of the lamp, an exhaust hole part formed through the lamp housing and arranged at the other side of the lamp, an exhaust pipe coupled to the lamp housing and connected to the exhaust hole part, and an exhaust pump connected to the exhaust pipe and forcibly discharging the air between the lamp housing and the light transmitting lens through the exhaust pipe.

Abstract: A ventilation apparatus of a lamp module for vehicles may include: a lamp housing; a lamp emitting light through a light transmitting part; a light transmitting lens covering an opening of the lamp housing; an intake hole part formed through the lamp housing, and arranged at one side of the lamp; an exhaust hole part formed through the lamp housing, and arranged at the other side of the lamp; and an exhaust pipe having one side coupled to the lamp housing and connected to the exhaust hole part and the other side connected to an intake part of an engine.

Abstract: A camera module and a method of manufacturing the camera module are provided. The camera module includes a substrate having an opening through which light passes, a circuit pattern for transmitting an electrical signal, and first and second terminals connected to the circuit pattern; an image sensor combined with the substrate so as to receive the light through the opening, and electrically connected to the first terminals; a lead frame disposed around the image sensor and electrically connected to the second terminals of the substrate; a housing combined on a surface of the substrate opposite to another surface on which the image sensor and the lead frame are combined; and a lens disposed in the housing.

Abstract: Provided is a lead frame having an improved wire bonding property of inner leads and an improved soldering property of outer leads and preventing defects with high producing yield, and a method of manufacturing the lead frame. The lead frame includes a plurality of inner leads formed with predetermined intervals between them; and a plurality of outer leads extended from the inner leads in length directions of the inner leads, each of which has an end portion overlapped with the inner lead and coupled thereto and the other end connected to neighboring outer lead by a supporting portion.

Abstract: Provided are a semiconductor lead frame, a semiconductor package having the semiconductor lead frame, and a method of plating the semiconductor lead frame. The method includes preparing a substrate formed of a Fe—Ni alloy (alloy 42), and a plating layer that contains grains less than 1 micrometer in size and is plated on the substrate. The growth of whiskers when a Sn plated layer is formed on a substrate formed of a Fe—Ni alloy (alloy 42) can be suppressed by minimizing the grain size of the Sn plated layer.

Abstract: Provided are a semiconductor lead frame, a semiconductor package having the semiconductor lead frame, and a method of plating the semiconductor lead frame. The method includes preparing a substrate formed of a Fe—Ni alloy (alloy 42), and a plating layer that contains grains less than 1 micrometer in size and is plated on the substrate. The growth of whiskers when a Sn plated layer is formed on a substrate formed of a Fe—Ni alloy (alloy 42) can be suppressed by minimizing the grain size of the Sn plated layer.

Abstract: Provided is a lead frame having an improved wire bonding property of inner leads and an improved soldering property of outer leads and preventing defects with high producing yield, and a method of manufacturing the lead frame. The lead frame includes a plurality of inner leads formed with predetermined intervals between them; and a plurality of outer leads extended from the inner leads in length directions of the inner leads, each of which has an end portion overlapped with the inner lead and coupled thereto and the other end connected to neighboring outer lead by a supporting portion.