Patents by Inventor Soo Gil Shin

Soo Gil Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for manufacturing camera module
    Patent number: 9161457
    Abstract: Disclosed herein is an apparatus for manufacturing a camera module, the apparatus including: a base jig holding a PCB from below; a bonding head picking up an image sensor and attaching the image sensor onto the PCB; and a housing bonding tool picking up a housing assembly and attaching the housing assembly onto the PCB so that the image sensor attached onto the PCB is received in the housing assembly, wherein the base jig is constituted in a structure where the base jig is tension-movable in a vertical direction (Z-axial direction), so that an upper surface of the PCB is an identical reference plane for attaching the image sensor and the housing assembly when the image sensor is picked up by the bonding head and attached onto the PCB.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: October 13, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Jae Lee, Byung Jae Kim, Sang Jin Kim, Soo Gil Shin, Seung Hee Cho
  • APPARATUS FOR MANUFACTURING CAMERA MODULE
    Publication number: 20130333207
    Abstract: Disclosed herein is an apparatus for manufacturing a camera module, the apparatus including: a base jig holding a PCB from below; a bonding head picking up an image sensor and attaching the image sensor onto the PCB; and a housing bonding tool picking up a housing assembly and attaching the housing assembly onto the PCB so that the image sensor attached onto the PCB is received in the housing assembly, wherein the base jig is constituted in a structure where the base jig is tension-movable in a vertical direction (Z-axial direction), so that an upper surface of the PCB is an identical reference plane for attaching the image sensor and the housing assembly when the image sensor is picked up by the bonding head and attached onto the PCB.
    Type: Application
    Filed: March 14, 2013
    Publication date: December 19, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Jae LEE, Byung Jae Kim, Sang Jin Kim, Soo Gil Shin, Seung Hee Cho