Patents by Inventor Soo Gil SIN

Soo Gil SIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Camera module
    Patent number: 11706510
    Abstract: A camera module includes a lens; an image sensor disposed on a substrate and converting an optical signal refracted by the lens into an electrical signal, an adhesive member disposed between the substrate and the image sensor to fix the image sensor to the substrate, and a support member disposed between the substrate and the image sensor configured to maintain a constant distance between the lens and the image sensor even at a time of shrinkage-deformation of the adhesive member.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: July 18, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Won Seo Gu, Soo Gil Sin, Sang Jin Kim
  • CAMERA MODULE
    Publication number: 20220132005
    Abstract: A camera module includes a lens; an image sensor disposed on a substrate and converting an optical signal refracted by the lens into an electrical signal, an adhesive member disposed between the substrate and the image sensor to fix the image sensor to the substrate, and a support member disposed between the substrate and the image sensor configured to maintain a constant distance between the lens and the image sensor even at a time of shrinkage-deformation of the adhesive member.
    Type: Application
    Filed: January 3, 2022
    Publication date: April 28, 2022
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Won Seo Gu, Soo Gil Sin, Sang Jin Kim
  • Camera module
    Patent number: 11252311
    Abstract: A camera module includes a lens; an image sensor disposed on a substrate and converting an optical signal refracted by the lens into an electrical signal, an adhesive member disposed between the substrate and the image sensor to fix the image sensor to the substrate, and a support member disposed between the substrate and the image sensor configured to maintain a constant distance between the lens and the image sensor even at a time of shrinkage-deformation of the adhesive member.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: February 15, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Won Seo Gu, Soo Gil Sin, Sang Jin Kim
  • CAMERA MODULE
    Publication number: 20200374426
    Abstract: A camera module includes a lens; an image sensor disposed on a substrate and converting an optical signal refracted by the lens into an electrical signal, an adhesive member disposed between the substrate and the image sensor to fix the image sensor to the substrate, and a support member disposed between the substrate and the image sensor configured to maintain a constant distance between the lens and the image sensor even at a time of shrinkage-deformation of the adhesive member.
    Type: Application
    Filed: January 23, 2020
    Publication date: November 26, 2020
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Seo GU, Soo Gil SIN, Sang Jin KIM
  • Camera module and method of manufacturing the same
    Patent number: 10506140
    Abstract: A camera module includes : a housing in which a lens barrel is accommodated; a circuit board fixedly mounted on a lower portion of the housing; and a guide member guiding a fixing position of the housing fixed to the circuit board, wherein the guide member includes a solder ball, formed on the circuit board to protrude in an upward optical axis direction and a guide groove, provided as a groove recessed in the upward optical axis direction in a lower end portion of the housing and into which the solder ball is fitted.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: December 10, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Jin Kim, Soo Gil Sin, Young Rok Park
  • CAMERA MODULE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20190320095
    Abstract: A camera module includes : a housing in which a lens barrel is accommodated; a circuit board fixedly mounted on a lower portion of the housing; and a guide member guiding a fixing position of the housing fixed to the circuit board, wherein the guide member includes a solder ball, formed on the circuit board to protrude in an upward optical axis direction and a guide groove, provided as a groove recessed in the upward optical axis direction in a lower end portion of the housing and into which the solder ball is fitted.
    Type: Application
    Filed: April 16, 2018
    Publication date: October 17, 2019
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Jin KIM, Soo Gil SIN, Young Rok PARK