Patents by Inventor Soo Hyun Lyoo
Soo Hyun Lyoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10468183Abstract: An inductor includes a body including a coil, the coil including a plurality of coil patterns connected by a via, is disposed, wherein the via includes a first conductive layer and a second conductive layer, formed on the first conductive layer, and the second conductive layer includes a conductive powder and an organic material.Type: GrantFiled: September 26, 2016Date of Patent: November 5, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Se Woong Paeng, Soo Hyun Lyoo, Jong Seok Bae
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Patent number: 10147533Abstract: An inductor includes a body including an organic material and a coil part disposed in the body. External electrodes are disposed on outer surfaces of the body and connected to the coil part. The coil part includes a conductive pattern and a conductive via. An adhesive layer is disposed between the conductive pattern and the conductive via, and the adhesive layer is formed of a material different from materials of the conductive pattern and the conductive via.Type: GrantFiled: April 7, 2016Date of Patent: December 4, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soo Hyun Lyoo, Se Woong Paeng, Jung Min Kim, Jeong Gu Yeo, Tae Hoon Kim, Sang Jun Lee, Ji Hyung Jung, Ji Man Ryu, Do Young Jung
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Publication number: 20170200551Abstract: An inductor includes a body including a coil, the coil including a plurality of coil patterns connected by a via, is disposed, wherein the via includes a first conductive layer and a second conductive layer, formed on the first conductive layer, and the second conductive layer includes a conductive powder and an organic material.Type: ApplicationFiled: September 26, 2016Publication date: July 13, 2017Inventors: Se Woong PAENG, Soo Hyun LYOO, Jong Seok BAE
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Publication number: 20160351321Abstract: An inductor includes a body including an organic material and a coil part disposed in the body. External electrodes are disposed on outer surfaces of the body and connected to the coil part. The coil part includes a conductive pattern and a conductive via. An adhesive layer is disposed between the conductive pattern and the conductive via, and the adhesive layer is formed of a material different from materials of the conductive pattern and the conductive via.Type: ApplicationFiled: April 7, 2016Publication date: December 1, 2016Inventors: Soo Hyun LYOO, Se Woong PAENG, Jung Min KIM, Jeong Gu YEO, Tae Hoon KIM, Sang Jun LEE, Ji Hyung JUNG, Ji Man RYU, Do Young JUNG
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Patent number: 8147633Abstract: There are provided a method of manufacturing a ceramic sintered body. A method of manufacturing a ceramic sintered body according to one aspect of the invention may include: preparing at least one ceramic sheet having first ceramic particles and glass particles; preparing at least one constraining sheet having second ceramic particles having a smaller particle size than the glass particles and the first ceramic particles; forming a ceramic laminate by alternating the ceramic sheet and the constraining sheet while the ceramic sheet and the constraining sheet are in contact with each other; and sintering the ceramic laminate so that components, which do not react with the first ceramic particles, from the glass particle are moved into the constraining sheet to sinter the constraining sheet when the ceramic sheet is sintered.Type: GrantFiled: July 1, 2011Date of Patent: April 3, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Soo Hyun Lyoo, Yong Seok Choi
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Patent number: 8093172Abstract: Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBi2O3-bB2O3-cSiO2-dBaO-eTiO2, where a+b+c+d+e=100, and a, b, c, d, and e are 40?a?89, 10?b?50, 1?c?20, 0?d?10, and 0?e?10, respectively.Type: GrantFiled: November 14, 2008Date of Patent: January 10, 2012Assignee: Samsung Electro-Mechanics Co. Ltd.Inventors: Ho Sung Choo, Jong Myeon Lee, Eun Tae Park, Myung Whun Chang, Soo Hyun Lyoo, Beom Joon Cho
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Publication number: 20110277912Abstract: There are provided a method of manufacturing a ceramic sintered body. A method of manufacturing a ceramic sintered body according to one aspect of the invention may include: preparing at least one ceramic sheet having first ceramic particles and glass particles; preparing at least one constraining sheet having second ceramic particles having a smaller particle size than the glass particles and the first ceramic particles; forming a ceramic laminate by alternating the ceramic sheet and the constraining sheet while the ceramic sheet and the constraining sheet are in contact with each other; and sintering the ceramic laminate so that components, which do not react with the first ceramic particles, from the glass particle are moved into the constraining sheet to sinter the constraining sheet when the ceramic sheet is sintered.Type: ApplicationFiled: July 1, 2011Publication date: November 17, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soo Hyun Lyoo, Yong Seok Choi
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Patent number: 7998561Abstract: There are provided a ceramic laminate and a method of manufacturing a ceramic sintered body. A ceramic laminate according to an aspect of the invention may include: at least one ceramic sheet having first ceramic particles and glass particles; and at least one constraining sheet having second ceramic particles and alternating with the ceramic sheet while the constraining sheet and the ceramic sheet are in contact with each other, wherein the glass particles and the first ceramic particles each have a larger particle size than the second ceramic particles, and the first ceramic particles have a particle size of 1 ?m or more, the glass particles have a particle size within the range of 1 ?m to 10 ?m, and the second ceramic particles have a particle size of 1 ?m or less. An aspect of the present invention provides a ceramic laminate having constraining layers that can evenly exert a constraining force onto a ceramic laminate during sintering.Type: GrantFiled: July 27, 2009Date of Patent: August 16, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Soo Hyun Lyoo, Yong Seok Choi
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Patent number: 7994084Abstract: Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiO3 of about 80 wt % or more, and an accessory component, CuBi2O4 and ZnO—B2O3—SiO2-based glass of about 20 wt % or less.Type: GrantFiled: November 26, 2008Date of Patent: August 9, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Soo Hyun Lyoo, Jong Myeon Lee, Ho Sung Choo, Min Ji Ko, Beom Joon Cho, Myung Whun Chang
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Patent number: 7886436Abstract: Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same. Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; and a method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.Type: GrantFiled: February 13, 2009Date of Patent: February 15, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jin Seok Moon, Yul Kyo Chung, Soo Hyun Lyoo, Seung Hyun Sohn
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Patent number: 7871482Abstract: Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of fired ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets.Type: GrantFiled: June 2, 2009Date of Patent: January 18, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yong Seok Choi, Seung Gyo Jeong, Eun Tae Park, Ki Pyo Hong, Soo Hyun Lyoo
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Publication number: 20100101702Abstract: Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets.Type: ApplicationFiled: June 2, 2009Publication date: April 29, 2010Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Seok CHOI, Seung Gyo Jeong, Eun Tae Park, Ki Pyo Hong, Soo Hyun Lyoo
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Publication number: 20100104835Abstract: There are provided a ceramic laminate and a method of manufacturing a ceramic sintered body. A ceramic laminate according to an aspect of the invention may include: at least one ceramic sheet having first ceramic particles and glass particles; and at least one constraining sheet having second ceramic particles and alternating with the ceramic sheet while the constraining sheet and the ceramic sheet are in contact with each other, wherein the glass particles and the first ceramic particles each have a larger particle size than the second ceramic particles, and the first ceramic particles have a particle size of 1 ?m or more, the glass particles have a particle size within the range of 1 ?m to 10 ?m, and the second ceramic particles have a particle size of 1 ?m or less. An aspect of the present invention provides a ceramic laminate having constraining layers that can evenly exert a constraining force onto a ceramic laminate during sintering.Type: ApplicationFiled: July 27, 2009Publication date: April 29, 2010Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soo Hyun LYOO, Yong Seok CHOI
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Patent number: 7675756Abstract: Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same. Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; and a method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.Type: GrantFiled: November 6, 2006Date of Patent: March 9, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jin Seok Moon, Yul Kyo Chung, Soo Hyun Lyoo, Seung Hyun Sohn
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Publication number: 20090214881Abstract: There is provided a low temperature co-fired ceramic substrate having a diffusion barrier layer to prevent diffusion occurring in a heterojunction during firing and a method of manufacturing the same. A low temperature co-fired ceramic substrate according to an aspect of the invention may include: a first ceramic layer formed of a material having a first dielectric constant; a second ceramic layer formed of a material having a second dielectric constant lower than the first dielectric constant; and a diffusion barrier layer interposed between the first ceramic layer and the second ceramic layer and formed of the first ceramic layer material, the second ceramic layer material, and a barium (Ba) compound, wherein inter-diffusion between the first ceramic layer material and the second ceramic layer material is prevented by using the diffusion barrier layer.Type: ApplicationFiled: February 19, 2009Publication date: August 27, 2009Inventors: Myung Whun Chang, Jong Myeon Lee, Soo Hyun Lyoo, Ho Sung Choo
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Publication number: 20090152121Abstract: Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same. Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; and a method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.Type: ApplicationFiled: February 13, 2009Publication date: June 18, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Seok MOON, Yul Kyo Chung, Soo Hyun Lyoo, Seung Hyun Sohn
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Publication number: 20090141427Abstract: Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiO3 of about 80 wt % or more, and an accessory component, CuBi2O4 and ZnO—B2O3—SiO2-based glass of about 20 wt % or less.Type: ApplicationFiled: November 26, 2008Publication date: June 4, 2009Inventors: Soo Hyun Lyoo, Jong Myeon Lee, Ho Sung Choo, Min Ji Ko, Beom Joon Cho, Myung Whun Chang
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Publication number: 20090135542Abstract: Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBi2O3-bB2O3-cSiO2-dBaO-eTiO2, where a+b+c+d+e=100, and a, b, c, d, and e are 40?a?89, 10?b?50, 1?c?20, O?d?10, and O?e?10, respectively.Type: ApplicationFiled: November 14, 2008Publication date: May 28, 2009Inventors: Ho Sung Choo, Jong Myeon Lee, Eun Tae Park, Myung Whun Chang, Soo Hyun Lyoo, Beom Joon Cho
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Publication number: 20090133806Abstract: There is provided a method of manufacturing a dielectric sheet and a multilayer ceramic substrate. A method of manufacturing a dielectric sheet according to an aspect of the invention may include: forming an embossed pattern formed of a thermoplastic material on a carrier film; forming a dielectric sheet by casting dielectric slurry onto the carrier film to cover the embossed pattern; removing the carrier film and the embossed pattern to leave an intaglio pattern having the shape corresponding to the embossed pattern on the dielectric sheet; and filling the intaglio pattern of the dielectric sheet with a conductive material. According to an aspect of the invention, a method of manufacturing a dielectric sheet and a multilayer ceramic substrate that can prevent the generation of irregularities when a dielectric sheet having an intaglio electrode pattern printed thereon is laminated to a multilayer substrate can be provided.Type: ApplicationFiled: November 28, 2008Publication date: May 28, 2009Inventors: Ho Sung CHOO, Soo Hyun LYOO, Myung Whun CHANG, Beom Joon CHO
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Publication number: 20090133805Abstract: There is provided a method of manufacturing a multilayer ceramic substrate that can be easily performed with high efficiency at low cost without affecting the performance of a multilayer ceramic substrate. A method of manufacturing a multilayer ceramic substrate according to an aspect of the invention may include: printing a cutting region onto at least one of a plurality of ceramic green sheets when the plurality of ceramic green sheets are laminated to form the ceramic laminate; firing the ceramic laminate; and cutting the fired ceramic laminate along the cutting region.Type: ApplicationFiled: November 24, 2008Publication date: May 28, 2009Inventors: Soo Hyun Lyoo, Jong Myeon Lee, Eun Tae Park, Hyong Ho Kim