Abstract: Disclosed are an electrolyte for a lithium secondary battery, and a lithium secondary battery. The electrolyte for a lithium secondary battery includes a lithium salt; an organic solvent; and an additive, wherein the additive includes a compound represented by Formula 1. In Formula 1, R1 to R5 are as defined in the detailed description of the disclosure.

Abstract: A method is described for treating activated carbon configured to be included in a carbon block of a filter for a water purifier. The method includes: inserting the activated carbon into a chamber; injecting ozone generated from an ozone generator into the chamber, and applying pressure to the chamber; and modifying a surface of the activated carbon inserted into the chamber based on applying the pressure to the chamber that holds the ozone and the activated carbon.

Abstract: An apparatus that transfers object motion in a source space to a target space is provided. The apparatus defines a mapping function from the source space to the target space based on feature points of the object-positioned source space, and feature points of the object-represented target space; determines a target root position corresponding to a root position of the object based on the mapping function; determines a target direction corresponding to a direction of the object, based on the mapping function; determines a target main joint corresponding to a main joint of the object based on the mapping function; determines a target sub-joint excluding the target main joint in the target space based on unique joint information of the object; and generates data representing the object motion in the target space by modifying a pose of the object in the target space to match the target main joint.

Abstract: The present invention is a method for bonding gold wire to gold bond pads at temperatures lower than 125 degrees Celsius, and more particularly at room temperature, defined to be 25 degrees Celsius. By applying compressive force and ultrasonic energy, an intermetallic bond can be formed between a gold wire and a gold bond pad without elevating the temperature. Furthermore, the present invention uses ultrasonic energy with frequencies low enough to be in the range of commercially available wire bonders.

Abstract: The present invention is a method for bonding gold wire to gold bond pads at temperatures lower than 125 degrees Celsius, and more particularly at room temperature, defined to be 25 degrees Celsius. By applying compressive force and ultrasonic energy, an intermetallic bond can be formed between a gold wire and a gold bond pad without elevating the temperature. Furthermore, the present invention uses ultrasonic energy with frequencies low enough to be in the range of commercially available wire bonders.

Abstract: The present invention is a method for bonding gold wire to gold bond pads at temperatures lower than 125 degrees Celsius, and more particularly at room temperature, defined to be 25 degrees Celsius. By applying compressive force and ultrasonic energy, an intermetallic bond can be formed between a gold wire and a gold bond pad without elevating the temperature. Furthermore, the present invention uses ultrasonic energy with frequencies low enough to be in the range of commercially available wire bonders.