Patents by Inventor Soo Jung Leem

Soo Jung Leem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11567408
    Abstract: A method for forming a photoresist relief image including applying a layer of a coating composition on a substrate; and disposing a layer of a photoresist composition on the layer of the coating composition, wherein the coating composition comprises an amine-containing polymer comprising a hydrocarbon-substituted amino group and having nitrogen atoms in an amount from 3 to 47 weight percent, based on a total weight of the amine-containing polymer.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: January 31, 2023
    Assignees: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD., ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Hye-Won Lee, Min Kyung Jang, Soo Jung Leem, Jae Hwan Sim, Emad Aqad
  • Publication number: 20210109447
    Abstract: A method for forming a photoresist relief image including applying a layer of a coating composition on a substrate; and disposing a layer of a photoresist composition on the layer of the coating composition, wherein the coating composition comprises an amine-containing polymer comprising a hydrocarbon-substituted amino group and having nitrogen atoms in an amount from 3 to 47 weight percent, based on a total weight of the amine-containing polymer.
    Type: Application
    Filed: October 15, 2019
    Publication date: April 15, 2021
    Inventors: Hye-Won Lee, Min Kyung Jang, Soo Jung Leem, Jae Hwan Sim, Emad Aqad
  • Publication number: 20180364575
    Abstract: In a preferred aspect, organic coating compositions, particularly antireflective coating compositions for use with an overcoated photoresist, are provided that comprise 1) one or more substituted uracil moieties; and 2) one or more reacted dicarboxylic acid groups.
    Type: Application
    Filed: June 15, 2017
    Publication date: December 20, 2018
    Inventors: Hye-Won Lee, Jae Hwan Sim, Soo Jung Leem, Jin Hong Park, You Rim Shin