Abstract: A die bonding device is disclosed. The device includes a frame member, a first bonding head having controlled horizontal linear movement along the frame member, wafer supporting means for supporting a wafer from which semiconductor chips are formed, first semiconductor chip suction means installed in the first bonding head for picking up semiconductor chips from the wafer by vacuum suction, lead frame transferring means for transferring a lead frame to a semiconductor chip bonding position, a second bonding head having controlled horizontal linear movement along the frame member, a pre-alignment system for aligning a semiconductor chip from the first semiconductor chip suction means, and second semiconductor chip suction means installed in the second bonding head for picking up semiconductor chips aligned according to the pre-alignment system. The die bonding device is capable of performing direct bonding or indirect bonding as required and may include a collet exchanger.

Abstract: A wire bonding apparatus includes a frame, an X, Y, table, installed on the frame, including a linear stepping motor with a first stator and a first inductor, a transducer, pivotably installed on the X, Y table, to one end of which a capillary for bonding wire is installed, a first transferring portion installed to the frame to make the other end of the transducer ascend so that the capillary for wire bonding ascends, a second transferring portion installed on the X, Y table in front of the first transferring portion to, thereby, make the other end of the transducer ascend during bonding, and a first location detecting portion installed to the frame and the X, Y table to detect an amount of movement in the X and Y directions so that energy loss according to the driving of a head portion can be reduced.