Patents by Inventor Soo Ki CHOI
Soo Ki CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11983501Abstract: The present invention relates to an apparatus and method for automatically generating machine reading comprehension training data, and more particularly, to an apparatus and method for automatically generating and managing machine reading comprehension training data based on text semantic analysis. The apparatus for automatically generating machine reading comprehension training data according to the present invention includes a domain selection text collection unit configured to collect pieces of text data according to domains and subjects, a paragraph selection unit configured to select a paragraph using the pieces of collected text data and determine whether questions and correct answers are generatable, and a question and correct answer generation unit configured to generate questions and correct answers from the selected paragraph.Type: GrantFiled: October 7, 2021Date of Patent: May 14, 2024Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Yong Jin Bae, Joon Ho Lim, Min Ho Kim, Hyun Kim, Hyun Ki Kim, Ji Hee Ryu, Kyung Man Bae, Hyung Jik Lee, Soo Jong Lim, Myung Gil Jang, Mi Ran Choi, Jeong Heo
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Patent number: 11777641Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may identify radio access technology (RAT) state information associated with the UE, the RAT state information including an indication of whether the UE is operating in a steady state or is operating in a transition state. The UE may adapt a codec rate associated with an application of the UE based at least in part on whether the UE is operating in the steady state or is operating in the transition state. Numerous other aspects are provided.Type: GrantFiled: September 29, 2021Date of Patent: October 3, 2023Assignee: QUALCOMM IncorporatedInventors: Sitaramanjaneyulu Kanamarlapudi, Harish Bhandiwad, Touseef Khan, Kavya Putluri, Soo-Ki Choi, Manjinder Singh Sandhu
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Publication number: 20230232265Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive a measurement gap configuration from a base station, wherein the measurement gap configuration includes a tune away period. The UE may determine whether one or more data traffic criteria are satisfied for the tune away period. The UE may disregard the measurement gap configuration based at least in part on the determination of whether the one or more data traffic criteria are satisfied. The UE may remain tuned to the base station during the tune away period based at least in part on the determination of whether the one or more data traffic criteria are satisfied. Numerous other aspects are provided.Type: ApplicationFiled: September 2, 2021Publication date: July 20, 2023Inventors: Sitaramanjaneyulu KANAMARLAPUDI, Deepak WADHWA, Shailesh MAHESHWARI, Seshagiri Rao GORANTLA, Soo-Ki CHOI, Balaji KANNAN, Sharda RANJAN, Gautham JAYARAM, Vishu KUMAR, Vijay MARWAH
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Patent number: 11658393Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.Type: GrantFiled: June 22, 2021Date of Patent: May 23, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hak Gu Kim, Young Sik Hur, Yoo Sam Na, Won Gi Kim, Young Bal Kim, Soo Ki Choi, Ho Kyung Kang, Young Kyoon Im, Seong Jong Cheon
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Patent number: 11380633Abstract: A radio frequency module includes a radio frequency integrated circuit (RFIC) to input or output a base signal and a radio frequency (RF) signal having a higher frequency than the base signal, a wiring via extending upward from the RFIC and a feed line electrically connected to the wiring via to provide a transmission path of the RF signal, a second ground layer surrounding the feed line, a first ground layer spaced above the second ground layer, a third ground layer between the second ground layer and the RFIC, a feed-line insulating layer disposed between the first and third ground layers, an IC wiring layer between the third ground layer and the RFIC, electrically connected to the RFIC, and providing a transmission path of the base signal, and an IC insulating layer between the third ground layer and the RFIC, having a higher dielectric constant than the feed-line insulating layer.Type: GrantFiled: May 13, 2020Date of Patent: July 5, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myeong Woo Han, Young Sik Hur, Won Gi Kim, Soo Ki Choi
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Patent number: 11335991Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.Type: GrantFiled: July 24, 2020Date of Patent: May 17, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hak Gu Kim, Young Sik Hur, Yoo Sam Na, Won Gi Kim, Young Bal Kim, Soo Ki Choi, Ho Kyung Kang, Young Kyoon Im, Seong Jong Cheon
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Publication number: 20220109520Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may identify radio access technology (RAT) state information associated with the UE, the RAT state information including an indication of whether the UE is operating in a steady state or is operating in a transition state. The UE may adapt a codec rate associated with an application of the UE based at least in part on whether the UE is operating in the steady state or is operating in the transition state. Numerous other aspects are provided.Type: ApplicationFiled: September 29, 2021Publication date: April 7, 2022Inventors: Sitaramanjaneyulu KANAMARLAPUDI, Harish BHANDIWAD, Touseef KHAN, Kavya PUTLURI, Soo-Ki CHOI, Manjinder Singh SANDHU
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Publication number: 20220013914Abstract: An antenna apparatus including: a first insulation layer defining a cavity; an antenna and an electronic element disposed in the cavity of the first insulation layer; a second insulation layer disposed on a first surface facing a first direction among surfaces of the antenna and on a second surface facing the first direction among surfaces of the electronic element; and a connection wire disposed on a third surface facing the first direction among surfaces of the second insulation layer and configured to electrically connect the antenna and the electronic element. The connection wire is disposed on the second insulation layer, is disposed within a first contact hole overlapping the electronic element, and overlaps the antenna.Type: ApplicationFiled: September 28, 2020Publication date: January 13, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myeong Woo HAN, Youngsik HUR, Se Jong KIM, Wongi KIM, Woncheol LEE, Jeongki RYOO, Jinseon PARK, Soo-Ki CHOI, Hotaek SONG
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Publication number: 20210313672Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.Type: ApplicationFiled: June 22, 2021Publication date: October 7, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Hak Gu KIM, Young Sik HUR, Yoo Sam NA, Won Gi KIM, Young Bal KIM, Soo Ki CHOI, Ho Kyung KANG, Young Kyoon IM, Seong Jong CHEON
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Publication number: 20210257318Abstract: A radio frequency module includes a radio frequency integrated circuit (RFIC) to input or output a base signal and a radio frequency (RF) signal having a higher frequency than the base signal, a wiring via extending upward from the RFIC and a feed line electrically connected to the wiring via to provide a transmission path of the RF signal, a second ground layer surrounding the feed line, a first ground layer spaced above the second ground layer, a third ground layer between the second ground layer and the RFIC, a feed-line insulating layer disposed between the first and third ground layers, an IC wiring layer between the third ground layer and the RFIC, electrically connected to the RFIC, and providing a transmission path of the base signal, and an IC insulating layer between the third ground layer and the RFIC, having a higher dielectric constant than the feed-line insulating layer.Type: ApplicationFiled: May 13, 2020Publication date: August 19, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Myeong Woo HAN, Young Sik HUR, Won Gi KIM, Soo Ki CHOI
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Publication number: 20210143525Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.Type: ApplicationFiled: July 24, 2020Publication date: May 13, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Hak Gu KIM, Young Sik HUR, Yoo Sam NA, Won Gi KIM, Young Bal KIM, Soo Ki CHOI, Ho Kyung KANG, Young Kyoon IM, Seong Jong CHEON