Abstract: A foreign particle removal system for removing a foreign particle from a surface of an object has a tool gripper which grips a particle removal tool. A tip of the particle removal tool has a sticky tip portion. The sticky tip portion has an apex region at a remote end of the sticky tip portion and a flank region adjoining the apex region. The tool gripper holds the particle removal tool at an oblique angle with respect to the surface so that the flank region of the sticky tip portion faces towards the surface. The tilted particle removal tool is conveyed with the tool gripper to contact the foreign particle on the surface with the flank region of the sticky tip portion and a force is exerted onto the surface to attract the foreign particle onto the flank region. The particle removal tool may then be lifted away from the surface together with the foreign particle.

Abstract: A foreign particle removal system for removing a foreign particle from a surface of an object has a tool gripper which grips a particle removal tool. A tip of the particle removal tool has a sticky tip portion. The sticky tip portion has an apex region at a remote end of the sticky tip portion and a flank region adjoining the apex region. The tool gripper holds the particle removal tool at an oblique angle with respect to the surface so that the flank region of the sticky tip portion faces towards the surface. The tilted particle removal tool is conveyed with the tool gripper to contact the foreign particle on the surface with the flank region of the sticky tip portion and a force is exerted onto the surface to attract the foreign particle onto the flank region. The particle removal tool may then be lifted away from the surface together with the foreign particle.

Abstract: A method of recovering a bonding apparatus from a bonding failure to resume a normal operating state for semiconductor chip fabrication is disclosed. The bonding apparatus comprises: i) a bonding tool for bonding a wire between a semiconductor chip and a substrate; and ii) a position sensor. Specifically, the method comprises the steps of: a) the position sensor determining a position of the bonding tool when the bonding tool contacts a surface to bond the wire to the substrate; b) the bonding apparatus detecting a bonding failure caused by detachment of the semiconductor from the substrate based on the position of the bonding tool; and c) the bonding apparatus detaching the semiconductor chip from the wire.

Abstract: A method of recovering a bonding apparatus from a bonding failure to resume a normal operating state for semiconductor chip fabrication is disclosed. The bonding apparatus comprises: i) a bonding tool for bonding a wire between a semiconductor chip and a substrate; and ii) a position sensor. Specifically, the method comprises the steps of: a) the position sensor determining a position of the bonding tool when the bonding tool contacts a surface to bond the wire to the substrate; b) the bonding apparatus detecting a bonding failure caused by detachment of the semiconductor from the substrate based on the position of the bonding tool; and c) the bonding apparatus detaching the semiconductor chip from the wire.