Patents by Inventor Soo Kwang Kim

Soo Kwang Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11608358
    Abstract: Disclosed is a method for preparing a composition comprising factor VIII (FVIII) and von Willebrand factor (vWF), wherein the content of the von Willebrand factor (vWF) can be controlled by mixing the factor VIII (FVIII) with the von Willebrand factor (vWF) at an appropriate ratio after separately purifying the factor VIII (FVIII) and the von Willebrand factor (vWF) from plasma in a single process. The method can prepare and purify a composition comprising factor VIII (FVIII) and a varying content of von Willebrand factor (vWF) without increasing the amount of impurities other than the von Willebrand factor (vWF) compared to a method of purifying factor VIII (FVIII) separately, without significantly increasing the processing time (within 3 hours) compared to a method of purifying factor VIII (FVIII), and without changing the yield of factor VIII (FVIII).
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: March 21, 2023
    Assignee: GREEN CROSS HOLDINGS CORPORATION
    Inventors: Jee Won Ahn, Kwan Young Ko, Jeong Hye Yoon, Seung-Ho Baek, Min Jung Kim, Geun Hye Yeo, Jung-Ae Lim, Soo-kwang Kim
  • Patent number: 11535646
    Abstract: The present invention relates to an improved method of purifying an immunoglobulin, and more particularly to a method of purifying an immunoglobulin which is capable of sufficiently removing impurities from an immunoglobulin-containing plasma protein sample through a simple process, comprising a single anion-exchange chromatography and a single cation-exchange chromatography.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: December 27, 2022
    Assignee: GREEN CROSS CORPORATION
    Inventors: Soo-kwang Kim, Kyung Hyun Boo, Kang Yun Seo, Sung Min Choi, Jeong Hye Yoon, Jin Hyun Park, Yeon Hui Kim
  • Publication number: 20210363179
    Abstract: Disclosed is a method for removing factor XI (FXI) during plasma protein purification, more specifically a method for removing FXI including dialyzing and concentrating a plasma protein fraction II paste containing FXI and a plasma protein, and then removing the FXI using a ceramic-based cation exchange resin. The method for removing factor XI (FXI) can improve removal efficiency of impurities and thrombogenic substances, thereby producing stable plasma proteins with improved quality.
    Type: Application
    Filed: August 4, 2021
    Publication date: November 25, 2021
    Inventors: Dae-eun KANG, Gil Bu KANG, Seol Young YOO, Jihye LEE, Ki-Yong KIM, Soo-kwang KIM
  • Patent number: 11046975
    Abstract: The present invention relates to a bicistronic expression vector for antibody expression, an animal cell transfected with the expression vector, and a method for producing an antibody including culturing the animal cell, in which the expression vector includes a first expression cassette including ‘promoter-UTR-intron-antibody light chain gene-polyA’ and a second expression cassette including ‘promoter-UTR-intron-antibody heavy chain gene-internal ribosome entry site (IRES)-amplification gene-polyA’. An expression vector capable of expressing a desired antibody with high efficiency can be constructed using the bicistronic expression vector including an intron for antibody expression according to the present invention, and the expression vector can produce the antibody by culturing the transfected animal cell with stability and high efficiency.
    Type: Grant
    Filed: October 7, 2014
    Date of Patent: June 29, 2021
    Assignee: PRESTIGE BIOPHARMA PTE. LTD.
    Inventors: Soo Kwang Kim, Young Min Kim, Yong Gyu Son, Yong Ho Ahn, Dong Heon Lee, Yang Soon Lee, Hee Jung Jun, Yu Bin Choi, Eun A Kim
  • Publication number: 20200347093
    Abstract: The present invention relates to an improved method of purifying an immunoglobulin, and more particularly to a method of purifying an immunoglobulin which is capable of sufficiently removing impurities from an immunoglobulin-containing plasma protein sample through a simple process, comprising a single anion-exchange chromatography and a single cation-exchange chromatography.
    Type: Application
    Filed: October 26, 2018
    Publication date: November 5, 2020
    Inventors: Soo-kwang KIM, Kyung Hyun BOO, Kang Yun SEO, Sung Min CHOI, Jeong Hye YOON, Jin Hyun PARK, Yeon Hui KIM
  • Publication number: 20200247843
    Abstract: Disclosed is a method for preparing a composition comprising factor VIII (FVIII) and von Willebrand factor (vWF), wherein the content of the von Willebrand factor (vWF) can be controlled by mixing the factor VIII (FVIII) with the von Willebrand factor (vWF) at an appropriate ratio after separately purifying the factor VIII (FVIII) and the von Willebrand factor (vWF) from plasma in a single process. The method can prepare and purify a composition comprising factor VIII (FVIII) and a varying content of von Willebrand factor (vWF) without increasing the amount of impurities other than the von Willebrand factor (vWF) compared to a method of purifying factor VIII (FVIII) separately, without significantly increasing the processing time (within 3 hours) compared to a method of purifying factor VIII (FVIII), and without changing the yield of factor VIII (FVIII).
    Type: Application
    Filed: October 26, 2018
    Publication date: August 6, 2020
    Inventors: Jee Won AHN, Kwan Young KO, Jeong Hye YOON, Seung-Ho BAEK, Min Jung KIM, Geun Hye YEO, Jeong-Ae LIM, Soo-kwang KIM
  • Publication number: 20190367557
    Abstract: Disclosed is a method for removing factor XI (FXI) during plasma protein purification, more specifically a method for removing FXI including dialyzing and concentrating a plasma protein fraction II paste containing FXI and a plasma protein, and then removing the FXI using a ceramic-based cation exchange resin. The method for removing factor XI (FXI) can improve removal efficiency of impurities and thrombogenic substances, thereby producing stable plasma proteins with improved quality.
    Type: Application
    Filed: October 17, 2017
    Publication date: December 5, 2019
    Inventors: Dae-eun KANG, Gil Bu KANG, Seol Young YOO, Jihye LEE, Ki-Yong KIM, Soo-kwang KIM
  • Patent number: 10053489
    Abstract: The present invention relates to a method of purifying an antibody with high purity and high quality by removing impurities by sequential use of a cation-exchange column, a culture supernatant multilayer filter and an anion-exchange column without using a protein-A column that is an affinity chromatography column which is generally used for antibody purification.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: August 21, 2018
    Assignee: Prestige Biopharma PTE, LTD
    Inventors: Soo Kwang Kim, Yong Ho Ahn, Young Min Kim, Dae Hae Song
  • Publication number: 20160281106
    Abstract: The present invention relates to a bicistronic expression vector for antibody expression, an animal cell transfected with the expression vector, and a method for producing an antibody including culturing the animal cell, in which the expression vector includes a first expression cassette including ‘promoter-UTR-intron-antibody light chain gene-polyA’ and a second expression cassette including ‘promoter-UTR-intron-antibody heavy chain gene-internal ribosome entry site (IRES)-amplification gene-polyA’. An expression vector capable of expressing a desired antibody with high efficiency can be constructed using the bicistronic expression vector including an intron for antibody expression according to the present invention, and the expression vector can produce the antibody by culturing the transfected animal cell with stability and high efficiency.
    Type: Application
    Filed: October 7, 2014
    Publication date: September 29, 2016
    Inventors: Soo Kwang Kim, Young Min Kim, Yong Gyu Son, Yong Ho Ahn, Dong Heon Lee, Yang Soon Lee, Hee Jung Jun, Yu Bin Choi, Eun A Kim
  • Publication number: 20160122384
    Abstract: The present invention relates to a method of purifying an antibody with high purity and high quality by removing impurities by sequential use of a cation-exchange column, a culture supernatant multilayer filter and an anion-exchange column without using a protein-A column that is an affinity chromatography column which is generally used for antibody purification.
    Type: Application
    Filed: June 3, 2014
    Publication date: May 5, 2016
    Inventors: Soo Kwang KIM, Yong Ho AHN, Young Min KIM, Dae Hae SONG
  • Patent number: 8656901
    Abstract: A cutting tip for a cutting tool used to cut or drill a brittle workpiece such as stone, brick, concrete, or asphalt and a frame saw provided with the cutting tip are disclosed. The swing type cutting tip including abrasive particles has a specific arrangement capable of enhancing the cutting efficiency of the abrasive particles, and thus achieving an enhancement in cutting performance and an increase in lifespan. The cutting tip includes a plurality of abrasive particles to cut a workpiece while swing. At least a part of the abrasive particles are arranged in the form of abrasive particle groups. Each abrasive particle group is constituted by at least two abrasive particles. At least a part of the abrasive particles of the abrasive particle groups are overlapped in a cutting direction.
    Type: Grant
    Filed: February 28, 2007
    Date of Patent: February 25, 2014
    Assignees: Ehwa Diamond Industrial Co., Ltd., General Tool, Inc.
    Inventors: Soo-Kwang Kim, Hee-Dong Park, Nam-Kwang Kim
  • Patent number: 8028687
    Abstract: The invention provides a segment type diamond tool capable of improving cutting rate and reducing the amount of fine debris generated during cutting by properly arranging diamond particles in a cutting segment of the diamond tool. In the invention, the layers of diamond particles are arranged such that cutting grooves formed on a workpiece by trailing layers of diamond particles are arranged between cutting grooves formed thereon by leading layers of diamond particles, respectively, in cutting of the work piece. The cutting segment has high-concentration and low-concentration areas. The high-concentration area shows a concentration higher than an average concentration and the low concentration area shows a concentration lower than the average concentration. Also, at least one low concentration area is formed on the leading and/or trailing section of the cutting segment. The diamond tool of the invention ensures superior cutting rate and reduced amount of fine debris generated during cutting.
    Type: Grant
    Filed: February 13, 2006
    Date of Patent: October 4, 2011
    Assignees: Ehwa Diamond Industrial Co., Ltd., General Tool, Inc.
    Inventors: Soo-Kwang Kim, Jong-Ho Kim, Hee-Dong Park
  • Patent number: 8002858
    Abstract: A cutting segment for a cutting tool used for cutting or drilling brittle workpieces, such as stone, brick, concrete and asphalt, a method for manufacturing the segment, and a cutting tool comprising the segment are disclosed. The segment comprises layers of diamond particles and two kinds of plate-shaped metal matrix layers comprising soft and hard metal matrix layers having different ductility. The plate-shaped metal matrix layers are arranged perpendicular to a cutting surface while being parallel to a cutting direction, and are alternately stacked perpendicular to the cutting direction. The layers of diamond particles are suitably arranged in the plate-shaped soft and hard metal matrix layers. The segment and the cutting tool comprising the same have excellent cutting ability, and the manufacturing process thereof can be simplified, thereby remarkably enhancing productivity.
    Type: Grant
    Filed: April 14, 2006
    Date of Patent: August 23, 2011
    Assignees: EHWA Diamond Industrial Co., Ltd., General Tool, Inc.
    Inventors: Soo-Kwang Kim, Hee-Dong Park
  • Patent number: 7954483
    Abstract: The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.
    Type: Grant
    Filed: April 19, 2006
    Date of Patent: June 7, 2011
    Assignees: Ehwa Diamond Industrial Co., Ltd., General Tool, Inc.
    Inventors: Soo-Kwang Kim, Hee-Dong Park, Joon-Ho Chang, Jong-Ho Kim
  • Patent number: 7661419
    Abstract: The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from R wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.
    Type: Grant
    Filed: April 20, 2006
    Date of Patent: February 16, 2010
    Assignees: Ehwa Diamond Industrial Co., Ltd., General Tool, Inc.
    Inventors: Soo-Kwang Kim, Hee-Dong Park, Jong-Ho Kim, Joon-Ho Chang
  • Publication number: 20090229592
    Abstract: A cutting tip for a cutting tool used to cut or drill a brittle workpiece such as stone, brick, concrete, or asphalt and a frame saw provided with the cutting tip are disclosed. The swing type cutting tip including abrasive particles has a specific arrangement capable of enhancing the cutting efficiency of the abrasive particles, and thus achieving an enhancement in cutting performance and an increase in lifespan. The cutting tip includes a plurality of abrasive particles to cut a workpiece while swing. At least a part of the abrasive particles are arranged in the form of abrasive particle groups. Each abrasive particle group is constituted by at least two abrasive particles. At least a part of the abrasive particles of the abrasive particle groups are overlapped in a cutting direction.
    Type: Application
    Filed: February 28, 2007
    Publication date: September 17, 2009
    Applicant: EHWA DIAMOND INDUSTRIAL CO., LTD.
    Inventors: Soo-Kwang Kim, Hee-Dong Park, Nam-Kwang Kim
  • Publication number: 20080219783
    Abstract: A cutting segment of a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool. The cutting segment includes a cutting surface for cutting a work piece and a number of abrasive particles arranged in a plurality of rows. Each of the abrasive rows includes high-concentration parts and low-concentration parts. The high-concentration parts are grouped together to form a high-concentration area on the cutting surface and the low-concentration parts are grouped together to form a low-concentration area on the cutting surface. The cutting segment and the cutting tool are capable of improving cutting rate and useful life.
    Type: Application
    Filed: December 28, 2005
    Publication date: September 11, 2008
    Applicants: EHWA DIAMOND INDUSTRIAL CO., LTD., GENERAL TOOL, INC.
    Inventors: Soo-Kwang Kim, Joon Ho Chang, Hee-Dong Park, Jong-Ho Kim
  • Publication number: 20080202488
    Abstract: The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.
    Type: Application
    Filed: April 19, 2006
    Publication date: August 28, 2008
    Applicants: EHWA DIAMOND INDUSTRIAL CO., LTD., GENERAL TOOL, INC.
    Inventors: Soo-Kwang Kim, Hee-Dong Park, Joon-Ho Chang, Jong-Ho Kim
  • Publication number: 20080171505
    Abstract: The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.
    Type: Application
    Filed: April 20, 2006
    Publication date: July 17, 2008
    Applicants: EHWA Diamond Industrial Co., Ltd., General Tool, Inc.
    Inventors: Soo-Kwang Kim, Hee-Dong Park, Jong-Ho Kim, Joon-Ho Chang
  • Publication number: 20080163857
    Abstract: The invention provides a segment type diamond tool capable of improving cutting rate and reducing the amount of fine debris generated during cutting by properly arranging diamond particles in a cutting segment of the diamond tool. In the invention, the layers of diamond particles are arranged such that cutting grooves formed on a workpiece by trailing layers of diamond particles are arranged between cutting grooves formed thereon by leading layers of diamond particles, respectively, in cutting of the work piece. The cutting segment has high-concentration and low-concentration areas. The high-concentration area shows a concentration higher than an average concentration and the low concentration area shows a concentration lower than the average concentration. Also, at least one low concentration area is formed on the leading and/or trailing section of the cutting segment. The diamond tool of the invention ensures superior cutting rate and reduced amount of fine debris generated during cutting.
    Type: Application
    Filed: February 13, 2006
    Publication date: July 10, 2008
    Inventors: Soo-Kwang Kim, Jong-Ho Kim, Hee-Dong Park