Patents by Inventor Soo-Min Choi
Soo-Min Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240156324Abstract: A shoe care apparatus includes an inner cabinet, an inlet, an outlet, a connection passage, a heater, a blower, and a desiccant block. The air inside the inner cabinet flows into the connection passage through the inlet, and is discharged back into the inner cabinet through the outlet after being dehumidified by the desiccant block while circulating inside the shoe care apparatus. The heater is located in the inner space of the desiccant block to recycle the desiccant of the desiccant block.Type: ApplicationFiled: March 7, 2022Publication date: May 16, 2024Applicant: LG ELECTRONICS INC.Inventors: Chang Kyu KIM, Kyoung Min CHOI, Soo Chan YU
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Patent number: 11961983Abstract: Disclosed is a battery module, which includes: a battery cell assembly having at least one battery cell; a module case configured to accommodate the battery cell assembly; and at least one injection hole provided in a bottom portion of the module case to inject a thermally conductive adhesive into the module case.Type: GrantFiled: July 9, 2020Date of Patent: April 16, 2024Assignee: LG Energy Solution, Ltd.Inventors: Soo-Youl Kim, Jae-Hun Yang, Han-Jong Yoon, Jae-Min Lee, Hae-Ryong Jeon, Young-Ho Choi
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Publication number: 20240082345Abstract: Provided is a peptide composition for preventing or treating Alzheimer's dementia. A peptide or a salt substituent thereof according to the presently claimed subject matter exhibits effects such as suppression of LPS-mediated cytokine production, suppression of LPS-induced neuroinflammation, amelioration of cognitive impairment, suppression of beta amyloid or tau protein aggregation, and suppression of neuronal loss. The polypeptide or the salt substituent thereof can permeate the blood-brain barrier, and thus, is expected to be usefully used for preventing or treating Alzheimer's dementia.Type: ApplicationFiled: August 25, 2021Publication date: March 14, 2024Applicant: HLB SCIENCE INC.Inventors: Yeong Min PARK, Wahn Soo CHOI, Seung-Hyun LEE, In Duk JUNG, Yong Joo KIM, Seung Jun LEE, Sung Min KIM, Mi Suk LEE, Hee Jo PARK, Seung Pyo CHOI, Minho MOON, Soo Jung SHIN, Sujin KIM, Yong Ho PARK, Jae-Yong PARK, Kun Ho LEE
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Publication number: 20240080320Abstract: A server according to an embodiment includes a processor configured to receive a friend add request for a target account from a user terminal accessed with a user account; based on one of the user account and the target account being a protected account, transmit an approval request for the friend add request to a protector account connected to the protected account; and based on receiving a reply to the approval request from the protector terminal, add the target account to a friend list of the user account.Type: ApplicationFiled: April 27, 2023Publication date: March 7, 2024Inventors: You Jin KIM, Jung Woo CHOI, Jenog Ryeol CHOI, Joong Seon KIM, Hong Chan YUN, Ju Ho CHUNG, Do Hyun YOUN, Hyung Min KIM, Hyun Ok CHOI, Chun Ho KIM, Soo Beom KIM, Min Jeong KIM, Chang Oh HEO, Eun Soo HEO
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Publication number: 20140346654Abstract: A chip package comprising a carrier, a chip, a plurality of first conductive elements, an encapsulation, and a conductive film is provided. The carrier has a carrying surface and a back surface opposite to the carrying surface. Furthermore, the carrier has a plurality of common contacts in the periphery of the carrying surface. The chip is disposed on the carrying surface and electrically connected to the carrier. In addition, the first conductive elements are disposed on the common contacts respectively. The encapsulation is disposed on the carrying surface and encapsulating the chip. Moreover, the conductive film is disposed over the encapsulation and the first conductive elements, so as to electrically connect with the common contacts via the first conductive elements. A process for fabricating the chip package is further provided. The chip package is capable of preventing the EMI problem and thus provides superior electrical performance.Type: ApplicationFiled: June 2, 2014Publication date: November 27, 2014Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Soo-Min CHOI, Hyeong-No KIM, Jae-Sun AN, Young-Gue LEE, Sang-Jin CHA
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Patent number: 8866280Abstract: A chip package comprising a carrier, a chip, a plurality of first conductive elements, an encapsulation, and a conductive film is provided. The carrier has a carrying surface and a back surface opposite to the carrying surface. Furthermore, the carrier has a plurality of common contacts in the periphery of the carrying surface. The chip is disposed on the carrying surface and electrically connected to the carrier. In addition, the first conductive elements are disposed on the common contacts respectively. The encapsulation is disposed on the carrying surface and encapsulating the chip. Moreover, the conductive film is disposed over the encapsulation and the first conductive elements, so as to electrically connect with the common contacts via the first conductive elements. A process for fabricating the chip package is further provided. The chip package is capable of preventing the EMI problem and thus provides superior electrical performance.Type: GrantFiled: June 25, 2009Date of Patent: October 21, 2014Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Soo-Min Choi, Hyeong-No Kim, Jae-Sun An, Young-Gue Lee, Sang-Jin Cha
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Publication number: 20090261470Abstract: A chip package comprising a carrier, a chip, a plurality of first conductive elements, an encapsulation, and a conductive film is provided. The carrier has a carrying surface and a back surface opposite to the carrying surface. Furthermore, the carrier has a plurality of common contacts in the periphery of the carrying surface. The chip is disposed on the carrying surface and electrically connected to the carrier. In addition, the first conductive elements are disposed on the common contacts respectively. The encapsulation is disposed on the carrying surface and encapsulating the chip. Moreover, the conductive film is disposed over the encapsulation and the first conductive elements, so as to electrically connect with the common contacts via the first conductive elements. A process for fabricating the chip package is further provided. The chip package is capable of preventing the EMI problem and thus provides superior electrical performance.Type: ApplicationFiled: June 25, 2009Publication date: October 22, 2009Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Soo-Min Choi, Hyeong-No Kim, Jae-Sun An, Young-Gue Lee, Sang-Jin Cha
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Publication number: 20080237821Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a substrate, a shielding plate, a first chip, a first sealant, a second chip and a second sealant. The substrate has a lower surface and an upper surface on which the shielding plate is disposed. The first chip disposed on the shielding plate is electrically connected to the substrate. The first sealant disposed on the upper surface encapsulates the shielding plate and the first chip. The second chip disposed on the lower surface is electrically connected to the substrate. The second sealant disposed on the lower surface encapsulates the second chip.Type: ApplicationFiled: March 28, 2007Publication date: October 2, 2008Inventors: Hyeongno Kim, Soo-Min Choi, Jae-Sun An, Young-Gue Lee, Sang-Jin Cha
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Publication number: 20080237820Abstract: A package structure including a substrate, a shielding element, a chip, a sealant layer and a semiconductor device is provided. The substrate has a first surface and a second surface opposite to the first surface. The shielding element is disposed on the first surface. The chip is disposed on the shielding element and is electrically connected to the substrate. The sealant layer is disposed on the first surface, and encapsulates the chip and the shielding element. The semiconductor device is disposed on the second surface.Type: ApplicationFiled: March 28, 2007Publication date: October 2, 2008Inventors: Hyeongno Kim, Soo-Min Choi, Jae-Sun An, Young-Gue Lee, Sang-Jin Cha
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Publication number: 20080197468Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a substrate, a first chip, a cap structure, a second chip and a sealant. The first chip is disposed in an opening of the substrate and is electrically connected to the substrate. The cap structure is disposed on the substrate corresponding to the first chip. The second chip is disposed on the cap structure and is electrically connected to the substrate. The sealant encapsulates the first chip, the cap structure and the second chip.Type: ApplicationFiled: February 15, 2007Publication date: August 21, 2008Inventors: Hyeongno Kim, Soo-Min Choi, Jae-Sun An, Young-Gue Lee, Sang-Jin Cha
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Publication number: 20080128890Abstract: A chip package comprising a carrier, a chip, a plurality of first conductive elements, an encapsulation, and a conductive film is provided. The carrier has a carrying surface and a back surface opposite to the carrying surface. Furthermore, the carrier has a plurality of common contacts in the periphery of the carrying surface. The chip is disposed on the carrying surface and electrically connected to the carrier. In addition, the first conductive elements are disposed on the common contacts respectively. The encapsulation is disposed on the carrying surface and encapsulating the chip. Moreover, the conductive film is disposed over the encapsulation and the first conductive elements, so as to electrically connect with the common contacts via the first conductive elements. A process for fabricating the chip package is further provided. The chip package is capable of preventing the EMI problem and thus provides superior electrical performance.Type: ApplicationFiled: November 30, 2006Publication date: June 5, 2008Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: SOO-MIN CHOI, HYEONG-NO KIM, JAE-SUN AN, YOUNG-GUE LEE, SANG-JIN CHA