Patents by Inventor Soomin Hwang

Soomin Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for treating substrate
    Patent number: 9059224
    Abstract: A method and system for treating a substrate are provided. The system includes a coating unit, a pre/post-exposure treatment unit, and a developing unit. Each of the units includes a load port and an index module. The pre/post-exposure treatment unit includes first and second modules that are arranged in different layers. The first module performs a process for coating a protective layer on the wafer before an exposure process. The second module performs a process for cleaning the wafer and a post-exposure bake process after the exposure process.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: June 16, 2015
    Assignee: SEMES CO., LTD.
    Inventors: Dong Ho Kim, Jinyoung Choi, Jaeseung Go, Soomin Hwang
  • SYSTEM AND METHOD FOR TREATING SUBSTRATE
    Publication number: 20120307217
    Abstract: A method and system for treating a substrate are provided. The system includes a coating unit, a pre/post-exposure treatment unit, and a developing unit. Each of the units includes a load port and an index module. The pre/post-exposure treatment unit includes first and second modules that are arranged in different layers. The first module performs a process for coating a protective layer on the wafer before an exposure process. The second module performs a process for cleaning the wafer and a post-exposure bake process after the exposure process.
    Type: Application
    Filed: August 16, 2012
    Publication date: December 6, 2012
    Inventors: Dong Ho Kim, Jinyoung Choi, Jaeseung Go, Soomin Hwang
  • System and method for treating substrate
    Patent number: 8289496
    Abstract: A method and system for treating a substrate are provided. The system includes a coating unit, a pre/post-exposure treatment unit, and a developing unit. Each of the units includes a load port and an index module. The pre/post-exposure treatment unit includes first and second modules that are arranged in different layers. The first module performs a process for coating a protective layer on the wafer before an exposure process. The second module performs a process for cleaning the wafer and a post-exposure bake process after the exposure process.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: October 16, 2012
    Assignee: Semes Co., Ltd.
    Inventors: Dong Ho Kim, Jinyoung Choi, Jaeseung Go, Soomin Hwang
  • System and method for treating substrate
    Publication number: 20100195066
    Abstract: A method and system for treating a substrate are provided. The system includes a coating unit, a pre/post-exposure treatment unit, and a developing unit. Each of the units includes a load port and an index module. The pre/post-exposure treatment unit includes first and second modules that are arranged in different layers. The first module performs a process for coating a protective layer on the wafer before an exposure process. The second module performs a process for cleaning the wafer and a post-exposure bake process after the exposure process.
    Type: Application
    Filed: January 29, 2010
    Publication date: August 5, 2010
    Inventors: Dong Ho Kim, Jinyoung Choi, Jaeseung Go, Soomin Hwang