Abstract: A system for mounting a mobile device to a wearer's arm, including a mobile device housing and an armband. The armband includes an elongate bistable spring movable between two positions to hold the armband to the wearer's arm. A clip may be joined to the armband, with the clip including slidable arms that extend across a diagonal of the mobile device.

Abstract: A system for mounting a mobile device to a wearer's arm, including a mobile device housing and an armband. The armband includes an elongate bistable spring movable between to positions to hold the armband to the wearer's arm. A clip may be joined to the armband, with the clip including slidable arms that extend across a diagonal of the mobile device.

Abstract: A portfolio for holding a mobile device. The portfolio includes walls movable between an open position and a closed position. The portfolio includes a housing for the mobile device. Panels are movable between a lowered position and a raised position to prop up the mobile device housing at an angle relative to a surface of a portfolio wall.

Abstract: A compact pipe specimen applicable to a fracture toughness test used to evaluate physical properties of a pipe material is provided. The compact pipe specimen includes: a pipe having a notch portion formed in a circumferential direction and a crack portion formed at the edge of the notch portion; and first and second jigs having openings to which a pressurizing unit is coupled so as to cause a bending load on the pipe, having the notch portion therebetween, and attached to the exterior surface of the pipe, respectively. It is unnecessary to correct the influence of a constraint effect due to varying sizes and shapes of the specimen. There is no restriction to the curvature and thickness of a pipe. A fracture behavior of a pipe crack portion can be precisely simulated.

Abstract: A compact pipe specimen applicable to a fracture toughness test used to evaluate physical properties of a pipe material is provided. The compact pipe specimen includes: a pipe having a notch portion formed in a circumferential direction and a crack portion formed at the edge of the notch portion; and first and second jigs having openings to which a pressurizing unit is coupled so as to cause a bending load on the pipe, having the notch portion therebetween, and attached to the exterior surface of the pipe, respectively. It is unnecessary to correct the influence of a constraint effect due to varying sizes and shapes of the specimen. There is no restriction to the curvature and thickness of a pipe. A fracture behavior of a pipe crack portion can be precisely simulated.

Abstract: Disclosed herein is a battery pack constructed such that a battery case, in which an electrode assembly is mounted, is made of a laminate sheet having high strength, side sealing parts of the battery case are formed in a specific shape, and a protection circuit module (PCM) is located in the inner space of at least one of the side sealing parts. The side sealing parts in themselves are used as a structure to decide the external shape of the battery pack, and, at the same time, are used as spaces for mounting the PCM therein. Consequently, it is possible to construct the battery pack without using additional pack sheathing members, to simplify the assembly process of the battery pack, and to manufacture the battery pack in a thinner and more compact structure with the reduced manufacturing costs. Furthermore, the PCM is located at either side of the battery cell while the PCM is spaced apart from electrode terminals.

Abstract: In a method chips are provided with solder balls as of a ball grid array directly without any substrate thereby forming a BGA device. The inventive BGA device is protected on its active side by a protective layer made of solder resist or other equivalent materials and the solder balls on the contact pads of the die are suitable to be connected to an other assembly directly.

Abstract: A method produces semiconductor components having a substrate, a semiconductor chip and an encapsulant. Chips situated on a wafer are singulated, arranged on a substrate and electrically conductively connected to a conductor structure on the substrate. The chips on the substrate are encapsulated with an encapsulant and the semiconductor components are singulated by sawing up the encapsulant.

Abstract: Provided are a method and system for verifying a protein-protein interaction according to a text mining method. The method includes extracting protein-protein interaction information from protein-related documents searched for from a bio-information document database, according to a text mining method, mapping the protein-protein interaction information to corresponding ontology identifications, and filtering the mapped protein-protein interaction information according to a frequency of the information and an impact factor of a corresponding protein-related document in order to obtain highly-weighted information.

Abstract: An optical pickup device, which reduces the size of an optical spot formed on an optical disk, and prevents the degradation of a tracking error signal due to coherent light from a layer adjacent a target recording/reproducing layer of the optical disk. The optical pickup device includes a light source emitting light at a designated wavelength; an object lens concentrating the light incident from the light source thereupon and forming an optical spot on an optical disk having multiple recording layers; and an optical detector receiving the light reflected by the optical disk and detecting a data signal and an error signal, wherein at least one diffraction pattern region partially diffracting or intercepting the light, emitted from the light source and being incident upon the object lens, and the light, reflected by optical disk and being incident upon the object lens, is formed on the object lens.

Abstract: An optical pickup device is provided with a plurality of object lens corresponding to various kinds of optical discs having different recording densities, in which the structure of the optical pickup device is simplified and the size of the optical pickup device is minimized. The optical pickup device comprises a bobbin including an upper surface, at which first and second object lenses are mounted, an opened lower surface, and a first and second side surfaces supported by a supporting unit, the first and second side surfaces being opposite to each other, a first focus coil and a first tracking coil mounted at a third side surface of the bobbin, a second focus coil and a second tracking coil mounted at a fourth side surface of the bobbin, which is opposite to the third side surface, and magnets disposed opposite to the first and second focus coils and the first and second tracking coils.

Abstract: An image forming apparatus including a chip having an engine processor and a basic processor includes an image forming unit which has an image forming engine and forms an image of given image data, an engine processor to control a driving of the image forming engine, and a basic processor which is integrally provided with the engine processor and controls processes related to image formation except the driving of the image forming engine.

Abstract: An anti-warp heat spreader for semiconductor devices is disclosed, wherein the heat spreader is made of a metal sheet of substantially constant thickness, the metal sheet being perforated by at least one opening to allow for the percolation of an adhesive or a resin. The heat spreader is designed to strengthen the package by providing a strong bond between its components, i.e., the circuit board, die, heat spreader and reinforcing frame. At the same time the heat generated by the die during operation is efficiently dissipated. The heat spreader can easily be attached to the die by positioning it in the mold used to produce the reinforcing frame and then fill the mold with a mold compound. The mold compound will easily flow through the opening or openings, thereby filling the gap between the heat spreader and the die. The mold compound replaces the air that escapes from the gap through the opening or openings. Thus, a strong and intense connection between the die and the heat spreader is constituted.

Abstract: A wire bonding machine capable of removing particles from capillary and cleaning method of capillary bottom tip uses a grinding film of the wire bonding machine mounted on a clamp block. The capillary of the wire bonding machine periodically moves on the grinding film and then, the bottom tip of the capillary is rubbed with and moves on the grinding film at a predetermined distance, whereby various particles formed at the bottom tip of the capillary are removed.

Abstract: A method for fabricating an LED having section grown on a sapphire substrate, a boded structure, and a unit chip separated from the bonded structure. The method includes (a) bonding the section grown on a first surface of the sapphire substrate to a first surface of a first substrate with a first binder; (b) bonding a second surface of the first substrate to a first surface of a second substrate with a second binder; (c) removing the second substrate from a bonded structure obtained as a result of step (b) after polishing a second surface of the sapphire substrate; (d) separating the bonded structure into unit chips after the second substrate has been removed; and (e) bonding the second surface of the polished sapphire substrate provided in each unit chip to a lead frame, and removing the first substrate. This method improves heat dissipation efficiency.

Abstract: Disclosed is an apparatus for reproducing copyrighted data, in more particular copyrighted sound source data and/or image data The apparatus includes: a data storage unit for storing copyrighted data; a controller for generating a control signal for reproducing the copyrighted data stored in the data storage unit; an output unit for outputting played signals for the copyrighted data according to the control signal from the controller; and a key input unit for inputting a signal for controlling the operation of the controller; a display unit for indicating the operating condition of the controller, the display unit displaying information concerning whether the copyrighted data is being played or not; a power source for applying driving power to the controller; and a case for receiving the data storage unit, the controller, the output unit, the key input unit, the display unit, and the power source.

Abstract: Manufacturing method for an electronic component assembly and corresponding electronic component assembly The present invention provides a manufacturing method for an electronic component assembly and to a corresponding electronic component assembly.

Abstract: The present embodiments relate to organic metal compounds in which compounds for host and compounds for dopant are connected, organic electroluminescence display devices using the compounds and a method for preparation of the devices. More precisely, the present embodiments relate to organic metal compounds in which compounds for host and compounds for dopant were connected to make energy transmission between host and dopant possible in a molecular level, organic electroluminescence display devices using the same and a preparation method thereof. And, the organic metal compound of the present embodiments has the structure having the connection of the compounds for host and the compounds for dopant, so that its solubility can be remarkably increased owing to the increased molecular weight. Thus, a wet process such as spin coating can be applied for the preparation of the device.

Abstract: A substrate for producing a soldering connection to a second substrate is disclosed. Soldering pads are distributed on the substrate surface. Solder balls can be applied to these pads. A soldering pad has a top side area and side areas connected to a conductor track. A soldering mask with openings in the region of the soldering pads is applied to the substrate. A soldering pad is provided with holding mechanism for the solder balls in such a way that, within the top side area of the soldering pad, a depression is introduced in the direction of the substrate or an elevation rising above the top side area is applied.

Abstract: There is provided an air inlet structure of a laundry dryer. In the air inlet structure, a base defines an air inlet, a front cabinet is disposed in front of the base and defines a suction hole to pass ambient air into the base, a cooling fan is stably disposed in the base to suck the ambient air, a blower tube forms a flow passage for the ambient air, a blower cover is fixed to the base to connect the blower tube and the cooling fan, and an air guide is disposed between the base and the blower cover, the air guide having a shroud at a center portion.