Patents by Inventor Soo Pin Chow

Soo Pin Chow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • GRAPHENE-COATED HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES
    Publication number: 20230197555
    Abstract: An integrated circuit device assembly including a graphene-coated heat spreader, including: a substrate; a die coupled to the substrate; and a heat spreader thermally coupled to the die, the heat spreader comprising: a body of thermally conductive metal defining a cavity at least partially surrounding the die; and a graphene layer contacting a surface of the body.
    Type: Application
    Filed: March 18, 2022
    Publication date: June 22, 2023
    Inventors: XIAOYANG JI, LI AN, SOO PIN CHOW
  • Semiconductor package and method of attaching semiconductor dies to substrates
    Patent number: 8592258
    Abstract: A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 kgf, the heat has a temperature range from approximately 150 to 200° C. and the pressure is applied for a range of approximately 1 to 10 seconds.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: November 26, 2013
    Assignees: United Test and Assembly Center, Ltd., QIMONDA AG
    Inventors: Denver Paul C. Castillo, Bryan Soon Hua Tan, Rodel Manalac, Kian Teng Eng, Pang Hup Ong, Soo Pin Chow, Wolfgang Johannes Hetzel, Werner Josef Reiss, Florian Ammer
  • SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES
    Publication number: 20120034738
    Abstract: A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 Kg, the heat has a temperature range from approximately 150 to 200° C. and the pressure is applied for a range of approximately 1 to 10 seconds.
    Type: Application
    Filed: October 20, 2011
    Publication date: February 9, 2012
    Applicants: QIMONDA AG, UNITED TEST AND ASSEMBLY CENTER, LTD.
    Inventors: Denver Paul C. CASTILLO, Bryan Soon Hua TAN, Rodel MANALAC, Kian Teng ENG, Pang Hup ONG, Soo Pin CHOW, Wolfgang Johannes HETZEL, Werner Josef REISS, Florian AMMER
  • SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES
    Publication number: 20090194871
    Abstract: A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 Kg, the heat has a temperature range from approximately 150 to 200° C. and the pressure is applied for a range of approximately 1 to 10 seconds.
    Type: Application
    Filed: December 24, 2008
    Publication date: August 6, 2009
    Applicant: UTAC - United Test and Assembly Test Center, Ltd.
    Inventors: Denver Paul C. Castillo, Soon Hua Bryan Tan, Rodel Manalac, Kian Teng Eng, Pang Hup Ong, Soo Pin Chow, Wolfgang Johannes Hetzel, Werner Josef Reiss, Florian Ammer